Patents by Inventor Setsuyu Hayakawa

Setsuyu Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9421605
    Abstract: An object is to propose a mold release agent improving the state of a mold surface by repeating casting cycle so as to extend the life of the metal mold actively, and a casting method using the mold release agent. A water-soluble mold release agent applied on a mold surface of a metal mold contains organic acid or organic acid salt which is reducing and ligand, wherein concentration of a total thereof is not less than 0.01 wt % in using concentration and is not more than a fixed concentration which is stability limit of emulsion of the mold release agent in undiluted concentration. Construction weight ratio of the organic acid or organic acid salt which is reducing and the ligand is in the range from 99/1 to 30/70.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: August 23, 2016
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yuichi Furukawa, Toshio Uchida, Setsuyu Hayakawa
  • Patent number: 8147961
    Abstract: A metal material that is, without using expensive apparatus, carburized in a low temperature region where crystal grains do not grow so much, and a producing method of the metal material are provided. A metal material mainly containing iron, wherein a surface of the metal material is subjected to a carburization treatment by a treatment using fullerenes as a carbon source.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: April 3, 2012
    Assignees: Toyota Jidosha Kabushiki Kaisha, MEC International Co., Ltd.
    Inventors: Kyosuke Yoshimi, Takeshi Matsuo, Mitsuo Suzuki, Takaaki Niinomi, Yuichi Furukawa, Setsuyu Hayakawa
  • Publication number: 20110042029
    Abstract: An object is to propose a mold release agent improving the state of a mold surface by repeating casting cycle so as to extend the life of the metal mold actively, and a casting method using the mold release agent. A water-soluble mold release agent applied on a mold surface of a metal mold contains organic acid or organic acid salt which is reducing and ligand, wherein concentration of a total thereof is not less than 0.01 wt % in using concentration and is not more than a fixed concentration which is stability limit of emulsion of the mold release agent in undiluted concentration. Construction weight ratio of the organic acid or organic acid salt which is reducing and the ligand is in the range from 99/1 to 30/70.
    Type: Application
    Filed: October 23, 2006
    Publication date: February 24, 2011
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, TETRA CO., LTD
    Inventors: Yuichi Furukawa, Toshio Uchida, Setsuyu Hayakawa