Patents by Inventor Setuo Sekine

Setuo Sekine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding apparatus and testing apparatus of a bonded portion
    Patent number: 5323952
    Abstract: A bonding apparatus comprising a bonding tool, means for driving the bonding tool, means for detecting an amount of crushing of a bonding portion during bonding, means for calculating a rate of change of the amount of crushing detected by the amount-of-crushing detecting means, means for setting a target value, which is inputted from an external source, of the amount of crushing of the bonding portion, and means for controlling the driving means. When the rate of change of the amount of crushing calculated by the calculating means is smaller than a predetermined value, the controlling means compares the amount of crushing detected by the amount-of-crushing detecting means with the target value. When the amount of crushing detected by the amount-of-crushing detecting means is smaller than the target value, the controlling means discriminates that the bonding is being performed in a satisfactory manner and hence should be continued.
    Type: Grant
    Filed: September 18, 1992
    Date of Patent: June 28, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Mituo Kato, Ryoichi Kajiwara, Kazuya Takahashi, Setuo Sekine, Tokiyuki Seto