Patents by Inventor Seung-Baik Nam

Seung-Baik Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11312855
    Abstract: The present invention relates to a resin composition containing a polyvinyl chloride resin and an acrylic resin and a board for interior materials manufactured using the same. More specifically, the present invention relates to a resin composition having excellent heat resistance due to a high glass transition temperature, having high flexibility even with a low plasticizer content, and having excellent processability due to such properties, as compared with the case wherein a polyvinyl chloride resin is used alone, and to a board for interior materials manufactured using the resin composition. According to the present invention, the resin composition may be applied to both a calendering method and an extrusion method due to excellent processability thereof.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: April 26, 2022
    Assignee: LG Hausys, Ltd.
    Inventors: Hae Seung Ko, Seung Baik Nam, Myeong Seok Park, Woo Kyung Jang, Woo Chul Jung
  • Publication number: 20210230418
    Abstract: The present invention relates to a resin composition containing a polyvinyl chloride resin and an acrylic resin and a board for interior materials manufactured using the same. More specifically, the present invention relates to a resin composition having excellent heat resistance due to a high glass transition temperature, having high flexibility even with a low plasticizer content, and having excellent processability due to such properties, as compared with the case wherein a polyvinyl chloride resin is used alone, and to a board for interior materials manufactured using the resin composition. According to the present invention, the resin composition may be applied to both a calendering method and an extrusion method due to excellent processability thereof.
    Type: Application
    Filed: March 14, 2018
    Publication date: July 29, 2021
    Inventors: Hae Seung KO, Seung Baik Nam, Myeong Seok Park, Woo Kyung JANG, Woo Chul JUNG
  • Patent number: 10265929
    Abstract: The present invention relates to a cushion flooring material and a manufacturing method for the same and, more particularly, to a cushion flooring material and a manufacturing method for the same, which uses an elastic layer including a PHA resin alone or a composite resin including a PHA resin as a surface layer constituting the cushion flooring material to prevent toxic substances exposed to the user even if the surface layer is exposed due to wear of a surface treatment layer positioned on the surface layer, thereby making the cushion flooring material non-toxic, eco-friendly and excellent in sound insulation.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: April 23, 2019
    Assignee: LG Hausys, Ltd.
    Inventors: Seokbong Lee, Seung Baik Nam
  • Publication number: 20170282493
    Abstract: The present invention relates to a cushion flooring material and a manufacturing method for the same and, more particularly, to a cushion flooring material and a manufacturing method for the same, which uses an elastic layer including a PHA resin alone or a composite resin including a PHA resin as a surface layer constituting the cushion flooring material to prevent toxic substances exposed to the user even if the surface layer is exposed due to wear of a surface treatment layer positioned on the surface layer, thereby making the cushion flooring material non-toxic, eco-friendly and excellent in sound insulation.
    Type: Application
    Filed: August 31, 2015
    Publication date: October 5, 2017
    Inventors: Seokbong LEE, Seung Baik NAM
  • Patent number: 9321885
    Abstract: Disclosed is an environmentally-friendly sheet using a PLA resin. The environmentally-friendly sheet using the PLA resin according to the present invention comprises: a back layer; a printed layer which is formed on the upper part of the back layer, wherein a printing pattern is formed on the upper surface thereof; and a transparent layer formed on the upper part of the printed layer, wherein one or more of the back layer, the printed layer, and the transparent layer have a PLA (polylactic acid) resin.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: April 26, 2016
    Assignee: LG HAUSYS, LTD.
    Inventors: Seung Baik Nam, Jeong Ho Jeong, Jong Seok Son
  • Patent number: 9187899
    Abstract: The present invention relates to a composite panel comprising: a surface-material layer; a substrate layer formed on the surface-material layer; and a profile which has the shape of a polygonal frame, receives the surface-material layer on the inside, is formed with a slot-in projection on at least one side and is formed with a slot-in recess on at least one side, and relates to a production method for the composite panel. The present invention can provide a composite material which entails a straightforward construction method and which can maintain a high degree of thermal conductivity and can minimize level differences in the constructed product surface, and provide a production method for the composite panel.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: November 17, 2015
    Assignee: LG HAUSYS, LTD.
    Inventor: Seung Baik Nam
  • Publication number: 20150073075
    Abstract: Disclosed is a biodegradable resin composition containing an eco-friendly plasticizer, and a biodegradable resin product using same. The biodegradable resin composition according to the present invention contains a biodegradable resin and a plasticizer, and the plasticizer contains a benzoate-based plasticizer. The biodegradable resin composition according to the present invention is eco-friendly since a phthalate-based plasticizer is not used. Also, the present invention has excellent formability and workability at high temperatures by overcoming the disadvantage of the low plasticization rate of a citrate-based plasticizer.
    Type: Application
    Filed: December 28, 2012
    Publication date: March 12, 2015
    Inventors: Seung Baik Nam, Jong-Seok Son
  • Publication number: 20140309349
    Abstract: The present invention provides a biodegradable resin composition which is modified through a thermally initiated cross linking reaction and comprising a PLA resin, a thermal initiator, and a cross linked monomer. Also, the present invention provides an eco-friendly biodegradable sheet manufactured by extruding the biodegradable resin composition or by processing the biodegradable resin composition using a calendaring method.
    Type: Application
    Filed: June 26, 2014
    Publication date: October 16, 2014
    Inventors: Seung-Baik NAM, Jong-Seok SON
  • Publication number: 20140170394
    Abstract: Disclosed is an environmentally-friendly sheet using a PLA resin. The environmentally-friendly sheet using the PLA resin according to the present invention comprises: a back layer; a printed layer which is formed on the upper part of the back layer, wherein a printing pattern is formed on the upper surface thereof; and a transparent layer formed on the upper part of the printed layer, wherein one or more of the back layer, the printed layer, and the transparent layer have a PLA (polylactic acid) resin.
    Type: Application
    Filed: August 16, 2012
    Publication date: June 19, 2014
    Applicant: LG Hausys, Ltd.
    Inventors: Seung Baik Nam, Jeong Ho Jeong, Jong Seok Son
  • Publication number: 20120156438
    Abstract: The present invention relates to a composite panel comprising: a surface-material layer; a substrate layer formed on the surface-material layer; and a profile which has the shape of a polygonal frame, receives the surface-material layer on the inside, is formed with a slot-in projection on at least one side and is formed with a slot-in recess on at least one side, and relates to a production method for the composite panel. The present invention can provide a composite material which entails a straightforward construction method and which can maintain a high degree of thermal conductivity and can minimise level differences in the constructed product surface, and provide a production method for the composite panel.
    Type: Application
    Filed: November 22, 2010
    Publication date: June 21, 2012
    Applicant: LG HAUSYS, LTD.
    Inventor: Seung Baik Nam
  • Patent number: 7678466
    Abstract: Disclosed herein is a flooring comprising a surface layer made of a synthetic resin, and a wood-based board as a base. Preferably, the surface layer includes a printed layer formed by general gravure, transfer, heat-sublimation, silk screen or digital printing using a printer, a protective made of a synthetic resin, and a UV-curable or heat-curable surface treatment layer. The wood-based board is selected from plywood, medium-density fiberboard (MDF), high-density fiberboard (HDF), particle board, and resin-wood flour composite board. The flooring may further comprise a bottom layer laminated under the wood-based board for protecting the flooring against moisture from the bottom. The flooring is cut into pieces having an appropriate size, and the pieces are processed into a finished product in a tongue and groove (T & G) shape.
    Type: Grant
    Filed: April 14, 2005
    Date of Patent: March 16, 2010
    Assignee: LG Chem, Ltd.
    Inventor: Seung-Baik Nam
  • Publication number: 20090197036
    Abstract: Disclosed is a wood flooring containing laminated wood and high-density fiberboard using a symmetric structure and a process for manufacturing the same. The wood flooring includes a high-density fiberboard core layer and an upper laminated wood layer and lower laminated wood or veneer layer symmetrically stacked about the high-density fiberboard core layer to achieve a stable structure, and the lower laminated wood or veneer layer has a density of 100±30% of that of the upper laminated wood layer to keep the balance therebetween. With this configuration it is possible to completely eliminate deformation problems caused by variation of environmental conditions such as temperature, humidity, etc., and to impart the natural texture of raw lumber and high durability to the flooring surface.
    Type: Application
    Filed: July 25, 2006
    Publication date: August 6, 2009
    Applicant: LG CHEM, LTD.
    Inventors: Sung-chul Hwang, Jae-Wan Sung, Seung-Baik Nam, Seung-Hun Lee, Jong-Bum Kim, Bum-Soo Kim
  • Publication number: 20090049786
    Abstract: Disclosed herein is a low-priced flooring comprising a transfer-printed high-density fiberboard (HDF). According to the flooring, an aqueous primer layer is formed on a high-density fiberboard as a core layer and transfer printing is performed on the surface of the primer layer to form a printed layer so that the background fiber pattern of the high-density fiberboard is covered, the adhesion of the core layer to the printed layer is enhanced, and the natural beauty of wood is faithfully imparted to the surface of the flooring.
    Type: Application
    Filed: October 20, 2006
    Publication date: February 26, 2009
    Applicant: LG CHEM, LTD.
    Inventors: Sung-Chul Hwang, Seung-Baik Nam, Seung-Hun Lee, Jong-Bum Kim, Jae-Wan Sung
  • Publication number: 20050281986
    Abstract: Disclosed herein is a flooring comprising a surface layer made of a synthetic resin, and a wood-based board as a base. Preferably, the surface layer includes a printed layer formed by general gravure, transfer, heat-sublimation, silk screen or digital printing using a printer, a protective made of a synthetic resin, and a UV-curable or heat-curable surface treatment layer. The wood-based board is selected from plywood, medium-density fiberboard (MDF), high-density fiberboard (HDF), particle board, and resin-wood flour composite board. The flooring may further comprise a bottom layer laminated under the wood-based board for protecting the flooring against moisture from the bottom. The flooring is cut into pieces having an appropriate size, and the pieces are processed into a finished product in a tongue and groove (T & G) shape.
    Type: Application
    Filed: April 14, 2005
    Publication date: December 22, 2005
    Inventor: Seung-Baik Nam