Patents by Inventor Seung Boong JEONG

Seung Boong JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970407
    Abstract: An ion-exchange resin module and a deionization apparatus using same are proposed. An ion-exchange resin module may have the inside filled with ion-exchange resin and may be configured to have a pressing plate such that fluid in the ion-exchange resin is discharged. Multiple ion-exchange resin modules may be installed by being stacked in an inner space defined inside a tank of the deionization apparatus. A discharge pipe which passes through the lower end of the tank and extends to the upper end thereof may be installed in the inner space, the discharge pipe being located in a through duct which passes through the centers of the ion-exchange resin modules.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: April 30, 2024
    Assignee: HYOSUNG HEAVY INDUSTRIES CORPORATION
    Inventors: Chang Woo Han, Seung Boong Jeong
  • Patent number: 11953273
    Abstract: Proposed is a heat dissipating device using turbulent flow. In the heat dissipating device, a plurality of block flow paths are formed in parallel inside a block body, a first cap and a second cap are mounted on side surfaces of the respective ends of the block body so as to connect the block flow paths, a working fluid flows into the block flow paths, and the working fluid which has passed through the block flow paths is transferred to the outside. Turbulence generators are mounted inside the block flow paths, and finishing end portions on the respective ends of the turbulence generators are supported by the first cap and the second cap and are positioned inside the block flow paths.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: April 9, 2024
    Assignee: HYOSUNG HEAVY INDUSTRIES CORPORATION
    Inventors: Chang Woo Han, Young Joo Kim, Kang Min Choi, Seung Boong Jeong
  • Publication number: 20230354550
    Abstract: A heat sink according to an example embodiment comprises: an inlet part through which a refrigerant is introduced; an outlet part through which the refrigerant received from the inlet part is discharged; and a plurality of flow channels disposed between the inlet part and the outlet part, configured to allow the refrigerant to flow, wherein the plurality of flow channels is arranged to have a spirally bent shape, and parts of the plurality of flow channels communicate with each other to allow the refrigerant to circulate between the flow channels.
    Type: Application
    Filed: May 7, 2021
    Publication date: November 2, 2023
    Inventors: Young Joo KIM, Yong Soo KIM, Seung Boong JEONG, Jong Yun CHOI
  • Publication number: 20230104454
    Abstract: The present disclosure is an evaporation device for cooling. In an evaporation space 12 formed inside a housing 10, a wick 16 allows a working fluid to move by capillary force. As the working fluid moves from a lower portion of the evaporation space 12 to an upper portion thereof, that is, from the working fluid inlet pipe 26 to the vapor outlet pipe 28 by the wick 16, the working fluid is evaporated by heat generated from the heat source to become vapor. A partition wall 20 is provided in the evaporation space 12 to control the flow of vapor. The working fluid transferred into the evaporation space 12 is uniformly mixed with the existing working fluid in the lower portion of the evaporation space 12 by a distributor 30.
    Type: Application
    Filed: January 28, 2021
    Publication date: April 6, 2023
    Inventors: Chang Woo HAN, Seung Boong JEONG, Joon Hong BOO
  • Publication number: 20220349663
    Abstract: Proposed is a heat dissipating device using turbulent flow. In the heat dissipating device, a plurality of block flow paths (12) are formed in parallel inside a block body (10), a first cap (16) and a second cap (28) are mounted on side surfaces (15) of the respective ends of the block body (10) so as to connect the block flow paths (12), a working fluid flows into the block flow paths (12), and the working fluid which has passed through the block flow paths (12) is transferred to the outside. Turbulence generators (38) are mounted inside the block flow paths (12), and finishing end portions (40) on the respective ends of the turbulence generators (38) are supported by the first cap (16) and the second cap (28) and are positioned inside the block flow paths (12).
    Type: Application
    Filed: January 28, 2021
    Publication date: November 3, 2022
    Inventors: Chang Woo HAN, Young Joo KIM, Kang Min CHOI, Seung Boong JEONG
  • Publication number: 20220089466
    Abstract: An ion-exchange resin module and a deionization apparatus using same are proposed. An ion-exchange resin module may have the inside filled with ion-exchange resin and may be configured to have a pressing plate such that fluid in the ion-exchange resin is discharged. Multiple ion-exchange resin modules may be installed by being stacked in an inner space defined inside a tank of the deionization apparatus. A discharge pipe which passes through the lower end of the tank and extends to the upper end thereof may be installed in the inner space, the discharge pipe being located in a through duct which passes through the centers of the ion-exchange resin modules.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 24, 2022
    Inventors: Chang Woo HAN, Seung Boong JEONG
  • Publication number: 20220039292
    Abstract: A sub-module cooling device of a power transmission system is proposed. Sub-modules may be arranged in a row on each of multiple layers of a frame. Heat generated by the sub-modules may be transferred to a duct through heat pipes, and the heat transferred through the heat pipes may be discharged to the outside while air coming out from an air conditioner passes through the duct. When the heat generated by the sub-modules is discharged in this manner, a cooling fan may not be required to be installed in each of the sub-modules. Air may be flown by the operation of the air conditioner and may absorb the heat generated by the sub-modules and discharge the heat to the outside.
    Type: Application
    Filed: November 18, 2019
    Publication date: February 3, 2022
    Inventors: Chang Woo HAN, Seung Boong JEONG
  • Patent number: 11083115
    Abstract: The present invention relates to an apparatus for cooling a power device of a power conditioning system. To this end, the present invention comprises: a power device; an evaporator butted to the power device; and a modularized condenser which is connected with the evaporator, placed on the power device, and equipped on the upper side of the power conditioning system. Accordingly, the present invention may easily secure a space, make it easy to install, and increase heat emission performance of the condenser so as to keep the power device at a low temperature, thereby enabling the system to be stably operated over a long period of time.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: August 3, 2021
    Assignee: Hyosung Heavy Industries Corporation
    Inventors: Chang Woo Han, Seung Boong Jeong, Moon Ho Lee, Joon Hong Boo
  • Publication number: 20200375071
    Abstract: The present invention relates to an apparatus for cooling a power device of a power conditioning system. To this end, the present invention comprises: a power device; an evaporator butted to the power device; and a modularized condenser which is connected with the evaporator, placed on the power device, and equipped on the upper side of the power conditioning system. Accordingly, the present invention may easily secure a space, make it easy to install, and increase heat emission performance of the condenser so as to keep the power device at a low temperature, thereby enabling the system to be stably operated over a long period of time.
    Type: Application
    Filed: December 14, 2017
    Publication date: November 26, 2020
    Inventors: Chang Woo HAN, Seung Boong JEONG, Moon Ho LEE, Joon Hong BOO