Patents by Inventor Seung Chin Park

Seung Chin Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9676935
    Abstract: A novel polyoxymethylene resin composition is provided, which may be availably used as engineered plastics in various industrial fields and products, such as vehicle parts. The poly resin includes polyoxymethylene, aramide fibers, and thermoplastic polyurethane, thereby providing the novel composition of polyoxymethylene resin and improving various physical properties thereof, such as thermal stability.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: June 13, 2017
    Assignees: Hyundai Motor Company, Korea Engineering Plastics Co., Ltd.
    Inventors: Duck Hyoung Hwang, Gyung Seob Byun, Seung Chin Park, Chang Ho Lee, Hyo Je Seong
  • Publication number: 20150318072
    Abstract: The present invention relates to a carbon nanotube-polyoxymethylene resin composition having improved processability and heat stability as well as excellent electrical conductivity, and a molded article formed from the resin composition. Provided are a carbon nanotube-polyoxymethylene resin composition including 91 to 98.7 wt % of polyoxymethylene, 1 to 6 wt % of carbon nanotubes, and 0.3 to 3 wt % of a modifier having processing properties, wherein the modifier having processing properties is a polymer having a core-shell structure, and a molded article formed from the resin composition.
    Type: Application
    Filed: December 28, 2012
    Publication date: November 5, 2015
    Applicant: KOREA ENGINEERING PLASTICS CO., LTD.
    Inventors: Seung-Chin PARK, Chung-Youl JUNG, Chang-Ho LEE
  • Publication number: 20150184110
    Abstract: A novel polyoxymethylene resin composition is provided, which may be availably used as engineered plastics in various industrial fields and products, such as vehicle parts. The poly resin includes polyoxymethylene, aramide fibers, and thermoplastic polyurethane, thereby providing the novel composition of polyoxymethylene resin and improving various physical properties thereof, such as thermal stability.
    Type: Application
    Filed: October 27, 2014
    Publication date: July 2, 2015
    Inventors: Duck Hyoung Hwang, Gyung Seob Byun, Seung Chin Park, Chang Ho Lee, Hyo Je Seong