Patents by Inventor Seung Chu

Seung Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945880
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: April 2, 2024
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Patent number: 11937502
    Abstract: A condensed cyclic compound and an organic light-emitting device including the condensed cyclic compound are provided. The condensed cyclic compound is represented by Formula 1. The A3 ring of Formula 1 is a group represented by Formula 2A or a group represented by Formula 2B. The organic light-emitting device includes: a first electrode; a second electrode; and an organic layer between the first electrode and the second electrode and including an emission layer, the organic layer including at least one of the condensed cyclic compound represented by Formula 1.
    Type: Grant
    Filed: April 13, 2016
    Date of Patent: March 19, 2024
    Assignees: Samsung Display Co., Ltd., Research & Business Foundation Sungkyunkwan University
    Inventors: Sung-Wook Kim, Myeong-Suk Kim, Hwan-Hee Cho, Sam-Il Kho, Seung-Soo Yoon, Changwoong Chu
  • Patent number: 11859011
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: January 2, 2024
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Patent number: 11840579
    Abstract: The invention provides novel heterodimeric proteins including heterodimeric antibodies.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: December 12, 2023
    Assignee: Xencor, Inc.
    Inventors: Matthew Bernett, Seung Chu, Gregory Moore, John Desjarlais
  • Publication number: 20230365717
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: April 27, 2023
    Publication date: November 16, 2023
    Inventors: Matthew Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Publication number: 20230227581
    Abstract: The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind Ectonucleotide pyrophosphatase/phosphodiesterase family member 3 (ENPP3).
    Type: Application
    Filed: August 3, 2022
    Publication date: July 20, 2023
    Inventors: Rumana Rashid, Umesh S. Muchhal, Gregory Moore, Alex Nishtal, Seung Chu, Sung-Hyung Lee, Yoon Kyung Kim
  • Patent number: 11673972
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: June 13, 2023
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Patent number: 11623957
    Abstract: The present invention is directed to heterodimeric antibodies that bind CD3 and PSMA.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: April 11, 2023
    Assignee: Xencor, Inc.
    Inventors: Gregory Moore, John Desjarlais, Seung Chu
  • Publication number: 20230086017
    Abstract: Provided herein are trispecific antibodies that include a) a first monomer, b) a second monomer, and c) a light chain. The first monomer includes a first variant Fc domain and a variable heavy domain, the second monomer includes a second variant Fc domain and a first scFv domain and the light chain includes a variable light domain. The variable heavy domain and the variable light domain form an antigen binding domain. The trispecific antibody further includes a second scFv domain on either the first or second monomers.
    Type: Application
    Filed: July 22, 2022
    Publication date: March 23, 2023
    Inventors: Gregory Moore, John Desjarlais, Seung Chu, Sung-Hyung Lee
  • Publication number: 20220403049
    Abstract: The present invention is directed to heterodimeric antibodies that bind CD3 and CD38.
    Type: Application
    Filed: May 4, 2022
    Publication date: December 22, 2022
    Inventors: Matthew Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal
  • Patent number: 11472890
    Abstract: The present invention is directed to antibodies, including novel antigen binding domains and heterodimeric antibodies, that bind Ectonucleotide pyrophosphatase/phosphodiesterase family member 3 (ENPP3).
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: October 18, 2022
    Assignee: Xencor, Inc.
    Inventors: Rumana Rashid, Umesh S. Muchhal, Gregory Moore, Alex Nisthal, Seung Chu, Sung-Hyung Lee, Yoon Kyung Kim
  • Publication number: 20220162343
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: December 3, 2021
    Publication date: May 26, 2022
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Publication number: 20220041757
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: October 18, 2021
    Publication date: February 10, 2022
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Patent number: 11225528
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: January 18, 2022
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Publication number: 20210309762
    Abstract: The invention provides novel heterodimeric proteins including heterodimeric antibodies.
    Type: Application
    Filed: October 30, 2020
    Publication date: October 7, 2021
    Inventors: Matthew Bernett, Seung Chu, Gregory Moore, John Desjarlais
  • Patent number: 11111315
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: September 7, 2021
    Assignee: Xencor, Inc.
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee
  • Publication number: 20210253736
    Abstract: The present invention relates to novel antigen binding domains and heterodimeric antibodies that bind Fibroblast Activation Protein (FAP).
    Type: Application
    Filed: April 16, 2021
    Publication date: August 19, 2021
    Inventors: John Desjarlais, Alex Nisthal, Seung Chu
  • Patent number: 11091548
    Abstract: The present invention relates to methods and compositions for modulating T cells. The modulation includes suppressing or inducing regulatory T cells or cytotoxic T cells.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: August 17, 2021
    Assignee: Xencor, Inc.
    Inventors: Matthew Bernett, Seung Chu, Dilki Wickramarachichi, John Desjarlais
  • Patent number: 10982006
    Abstract: The present invention relates to novel antigen binding domains and heterodimeric antibodies that bind Fibroblast Activation Protein (FAP).
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: April 20, 2021
    Assignee: Xencor, Inc.
    Inventors: John Desjarlais, Alex Nisthal, Seung Chu
  • Publication number: 20210102003
    Abstract: The present invention is directed to novel heterodimeric antibodies.
    Type: Application
    Filed: December 16, 2020
    Publication date: April 8, 2021
    Inventors: Matthew J. Bernett, Gregory Moore, John Desjarlais, Seung Chu, Rumana Rashid, Umesh Muchhal, Sung-Hyung Lee