Patents by Inventor Seung-Chul Ahn
Seung-Chul Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11949881Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.Type: GrantFiled: April 1, 2021Date of Patent: April 2, 2024Assignees: Electronics and Telecommunications Research Institute, Kwangwoon University Research Institute for Industry Cooperation, Industry-Academia Cooperation Group of Sejong UniversityInventors: Se-Yoon Jeong, Hae-Chul Choi, Jeong-Il Seo, Seung-Kwon Beack, In-Seon Jang, Jae-Gon Kim, Kyung-Ae Moon, Dae-Young Jang, Jin-Woo Hong, Jin-Woong Kim, Yung-Lyul Lee, Dong-Gyu Sim, Seoung-Jun Oh, Chang-Beom Ahn, Dae-Yeon Kim, Dong-Kyun Kim
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Publication number: 20240107032Abstract: The present invention relates to an image encoding and decoding technique, and more particularly, to an image encoder and decoder using unidirectional prediction. The image encoder includes a dividing unit to divide a macro block into a plurality of sub-blocks, a unidirectional application determining unit to determine whether an identical prediction mode is applied to each of the plurality of sub-blocks, and a prediction mode determining unit to determine a prediction mode with respect to each of the plurality of sub-blocks based on a determined result of the unidirectional application determining unit.Type: ApplicationFiled: December 7, 2023Publication date: March 28, 2024Applicants: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, University-Industry Cooperation Group of Kyung Hee UniversityInventors: Hae Chul CHOI, Se Yoon JEONG, Sung-Chang LIM, Jin Soo CHOI, Jin Woo HONG, Dong Gyu SIM, Seoung-Jun OH, Chang-Beom AHN, Gwang Hoon PARK, Seung Ryong KOOK, Sea-Nae PARK, Kwang-Su JEONG
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Patent number: 8523158Abstract: An opener and a buffer table for a test handler are disclosed. The opener includes an opening plate, a plurality of pin blocks forming pairs, and at least one or more interval retaining apparatus for retaining an interval between the pin blocks forming a pair. Each of the pin blocks is movably coupled to the opening plate, and includes opening pins for releasing a holding state of a holding apparatus that holds semiconductor devices in a carrier board. Although semiconductor devices to be tested are altered in size and a carrier board loading with the semiconductor devices is thus replaced, the opener does not need to be replaced, thereby reducing the replacement cost and the waste of resources.Type: GrantFiled: July 2, 2008Date of Patent: September 3, 2013Assignee: TechWing., Co. Ltd.Inventors: Yun-Sung Na, In-Gu Jeon, Seung-Chul Ahn, Dong-Han Kim, Jae-Hyun Son
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Publication number: 20100320348Abstract: An opener and a buffer table for a test handler are disclosed. The opener includes an opening plate, a plurality of pin blocks forming pairs, and at least one or more interval retaining apparatus for retaining an interval between the pin blocks forming a pair. Each of the pin blocks is movably coupled to the opening plate, and includes opening pins for releasing a holding state of a holding apparatus that holds semiconductor devices in a carrier board. Although semiconductor devices to be tested are altered in size and a carrier board loading with the semiconductor devices is thus replaced, the opener does not need to be replaced, thereby reducing the replacement cost and the waste of resources.Type: ApplicationFiled: July 2, 2008Publication date: December 23, 2010Applicant: TECHWING., CO. LTDInventors: Yun-Sung Na, In-Gu Jeon, Seung-Chul Ahn, Dong-Han Kim, Jae-Hyun Son
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Patent number: 6820792Abstract: Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).Type: GrantFiled: August 6, 2001Date of Patent: November 23, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Geun Kim, Seung-Chul Ahn
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Patent number: 6662799Abstract: A vertical wafer sawing apparatus for separating semiconductor devices formed on a semiconductor wafer includes a chuck table disposed vertically to a supporting surface of the chuck table and a scribing member moving perpendicular to the wafer surface to dice the wafer. The chuck table or a scribing member moves in one specific direction at least among the directions of the x, y and z-axis. The direction of the x-axis runs perpendicular to a wafer stage, on which a wafer is loaded, and parallel to the ground or the support surface for the chuck table. As a result, the set-up dimensions of the apparatus can be decreased even as wafer size increases. Further, contaminants such as silicon scraps and dust on the wafer can be efficiently removed during the wafer sawing process.Type: GrantFiled: October 9, 2001Date of Patent: December 16, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Dong-Kuk Kim, Seung-Chul Ahn
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Publication number: 20030145939Abstract: A dual die bonder device having two die-bonding sections and a transfer rail is disclosed. As a substrate moves along the transfer rail, each die-bonding section performs separate die-bonding processes, one process utilizing a liquid adhesive and one process utilizing an insulating adhesive tape. In the first die-bonding section, the liquid adhesive is supplied to a die-bonding area of the substrate, and a first semiconductor die is bonded onto the liquid adhesive. In the second die-bonding section, the insulating adhesive tape is supplied to either the first semiconductor die or to another die-bonding area of the substrate, and a second semiconductor die is bonded onto the insulating adhesive tape. A method of dual bonding a first semiconductor die and a second semiconductor die is also disclosed.Type: ApplicationFiled: September 20, 2002Publication date: August 7, 2003Inventors: Seung Chul Ahn, Hyeong Seob Kim, Kyoung Bok Cho, Sung Bok Hong
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Publication number: 20020063115Abstract: A vertical wafer sawing apparatus for separating semiconductor devices formed on a semiconductor wafer includes a chuck table disposed vertically to a supporting surface of the chuck table and a scribing member moving perpendicular to the wafer surface to dice the wafer. The chuck table or a scribing member moves in one specific direction at least among the directions of the x, y and z-axis. The direction of the x-axis runs perpendicular to a wafer stage, on which a wafer is loaded, and parallel to the ground or the support surface for the chuck table.Type: ApplicationFiled: October 9, 2001Publication date: May 30, 2002Applicant: Samsung Electronics Co. Ltd.Inventors: Dong-Kuk Kim, Seung-Chul Ahn
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Publication number: 20010051394Abstract: Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).Type: ApplicationFiled: August 6, 2001Publication date: December 13, 2001Inventors: Sang-Geun Kim, Seung-Chul Ahn