Patents by Inventor Seung Dae Seok
Seung Dae Seok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230115922Abstract: A method for fabricating a semiconductor device includes loading a substrate into a process chamber, processing the substrate in the process chamber, using a plasma generated inside the process chamber, receiving a plasma light emitted from the plasma, selecting a target light from the plasma light, such that the target light is related to a surface condition of the substrate, and analyzing an intensity of the target light over time to monitor the surface condition of the substrate.Type: ApplicationFiled: May 20, 2022Publication date: April 13, 2023Inventors: Yong In LEE, In Hwa BAEK, Se-Hoon JANG, Dong Gap SHIN, Young Ho KIM, Seung Dae SEOK, Si Woong WOO, Jun Gyu LEE
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Patent number: 11600515Abstract: Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker and an inverting driving unit for inverting the vacuum gripper to invert the die so that a rear surface of the die gripped by the vacuum gripper faces upward.Type: GrantFiled: August 25, 2020Date of Patent: March 7, 2023Assignees: Semes Co., Ltd, Samsung Electronics Co., Ltd.Inventors: Chang Bu Jeong, Min Gu Lee, Eui Sun Choi, Kang San Lee, Dae Ho Min, Seung Dae Seok
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Patent number: 10058952Abstract: A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.Type: GrantFiled: November 1, 2016Date of Patent: August 28, 2018Assignee: Samsung Electronics Co., Ltd.Inventors: Seung-Dae Seok, Sang Yoon Kim, Hui Jae Kim, Jae Bong Shin, Byung Joon Lee
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Publication number: 20170136570Abstract: A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.Type: ApplicationFiled: November 1, 2016Publication date: May 18, 2017Inventors: Seung Dae Seok, Sang Yoon Kim, Hui Jae KIM, Jae Bong SHIN, Byung Joon LEE
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Patent number: 9620476Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.Type: GrantFiled: November 4, 2014Date of Patent: April 11, 2017Assignees: SEMES CO., LTD., SAMSUNG ELECTRONICS CO., LTD.Inventors: Hang Lim Lee, Jong Jin Weon, Soon Hyun Kim, Seung Dae Seok
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Patent number: 9508577Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.Type: GrantFiled: July 22, 2014Date of Patent: November 29, 2016Assignee: Samsung Electronics Co., Ltd.Inventors: Byung Joon Lee, Masato Kajinami, Yoshiaki Yukimori, Sang-Yoon Kim, Hui-Jae Kim, Byeong-Kuk Park, Seung Dae Seok, Jae Bong Shin, Byeong Kap Choi
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Patent number: 9431365Abstract: A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.Type: GrantFiled: April 30, 2015Date of Patent: August 30, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seung-dae Seok, Sang-yoon Kim, Hui-jae Kim, Jae-bong Shin
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Publication number: 20160079199Abstract: A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.Type: ApplicationFiled: April 30, 2015Publication date: March 17, 2016Inventors: Seung-dae SEOK, Sang-yoon KIM, Hui-jae KIM, Jae-bong SHIN
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Publication number: 20150155210Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.Type: ApplicationFiled: July 22, 2014Publication date: June 4, 2015Inventors: Byung Joon LEE, Masato KAJINAMI, Yoshiaki YUKIMORI, Sang-Yoon KIM, Hui-Jae KIM, Byeong-Kuk PARK, Seung Dae SEOK, Jae Bong SHIN, Byeong Kap CHOI
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Publication number: 20150129135Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.Type: ApplicationFiled: November 4, 2014Publication date: May 14, 2015Inventors: Hang Lim LEE, Jong Jin WEON, Soon Hyun KIM, Seung Dae SEOK
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Publication number: 20130248114Abstract: A bonding apparatus includes at least one stage unit to support a circuit board having a chip thereon and a bonding unit coupled to the stage unit to define a chamber. The bonding unit has at least one inductive heater to heat to bond the chip to the circuit board, and the stage unit includes a vacuum generator configured to generate a vacuum between the stage unit and the circuit board. The vacuum is used to hold the circuit board on the stage unit during bonding of the chip to the circuit board. The induction heater may include one or more induction heating antennas, and the chamber may include one or more stage units.Type: ApplicationFiled: March 14, 2013Publication date: September 26, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seung Dae SEOK, Kyoungran KIM, Jae Bong SHIN, Hyung Sok YEO, Byung Joon LEE, Il Young HAN
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Publication number: 20100071847Abstract: It is an aspect of the present invention to provide a wafer bonding apparatus having a pressing apparatus configured to press wafers fixed in a fixing apparatus, wherein the fixing apparatus is configured to allow the pressing apparatus to press the wafers without interference. The wafer bonding apparatus may include an upper wafer and a lower wafer, a support member configured to support the upper wafer and the lower wafer, a push member on the upper wafer, and a fixing apparatus configured to fix the push member to the support member, wherein the push member includes a fixing part extending outward from a periphery of the upper wafer, and the fixing apparatus is coupled to the fixing part. It is also an aspect of the present invention to provide a method for bonding wafers.Type: ApplicationFiled: August 28, 2009Publication date: March 25, 2010Inventors: Jae Bong Shin, Byung Joon Lee, Seung Dae Seok, Seung Woo Choi, Jung Hyeon Kim, Sang il Hong