Abstract: Disclosed is a scanning display apparatus using a laser beam source. In accordance with an embodiment of the present invention, the scanning display apparatus can include a lighting optical system, configured to use a laser device as a light source, the laser device outputting a plurality of beams having different wavelengths that are recognized as an identical color; an optical modulator, configured to output a modulation beam by diffracting a beam transferred from the lighting optical system; a diffuser, placed on an optical path of the modulation beam outputted from the optical modulator and configured to expand a width of the modulation beam through a diffraction grating pattern formed on one surface of the diffuser; and a scanning mirror, configured to scan the modulation beam having passed through the diffuser on a screen.

Abstract: A tilt mirror is disclosed. The tilt mirror can include: a reflection portion, which may reflect incident light; a first cantilever, which may be formed on either end of the reflection portion, and which may generate a stress in one direction; a second cantilever, which may be formed on either end of the reflection portion beside the first cantilever, and which may generate a stress in the other direction; and a connector portion, which may connect the reflection portion with one end of the first cantilever and with one end of the second cantilever such that the stress generated in the one direction and the stress generated in the other direction are transferred to the reflection portion. The tilt mirror provides a simple composition that can be utilized to alter the path for rays of light.

Abstract: Disclosed is a diffractive micromirror and a method of producing the same. More particularly, the present invention pertains to a diffractive thin-film piezoelectric micromirror, which is operated in a piezoelectric operation manner to assure excellent displacement, operation speed, reliability, linearity, and low voltage operation, and a method of producing the same. The diffractive thin-film piezoelectric micromirror includes a silicon substrate on which a recess is formed to provide an air space to the center thereof, and a piezoelectric mirror layer having a band shape, which is attached to the silicon substrate along both ends of the recess at both ends thereof while being spaced from the bottom of the recess at a center portion thereof and which includes a thin-film piezoelectric material layer to be vertically movable when voltage is applied to the piezoelectric material layer, and thus diffracts an incident light beam.

Abstract: Disclosed are a method for driving a piezoelectric element or an optical modulator including a piezoelectric element and a recorded medium recorded with a program for executing the same. In accordance with an embodiment of the present invention, the method for driving a piezoelectric element causing a displacement object to be displaced by being contracted or expanded according to a supplied driving voltage, including supplying a driving signal to the piezoelectric element during a first driving period in a first voltage range; supplying a control signal for controlling a polarization hysteresis of the piezoelectric element according to a driving, performed during the first driving period, to the piezoelectric element; and supplying the driving signal to the piezoelectric element during a second driving period in a second voltage range.

Abstract: A spatial optic modulating system with speckle reduction and a method thereof are disclosed. According to an embodiment of the present invention, a spatial optic modulating system includes a spatial optic modulator, which modulates and reflects an image transferred in accordance with an upward or downward movement of a ribbon that is operated according to a contraction or expansion of a piezoelectric element, an image lens unit, which transfers an image modulated from the spatial optic modulator as a diffraction image to a scanner, and a phase modulator, which modulates a phase of the diffraction image transferred from the image lens unit. With the present invention, an image, from which a speckle is removed, can be displayed by modulating a phase of an image projected by using a spatial optic modulator.

Abstract: Disclosed are a light homogenizing device and a display apparatus including the same. The light homogenizing device can include a light source; a polarization rotator, including two planes of polarization that are vertical to each other, and receiving a beam of light incident from the light source and outputting a polarized linear beam of light having different polarization depending on driving voltage; and a birefringent plate, receiving the polarized linear beam of light and outputting two refracted beams of light proceeding by being refracted in different directions. Here, the two refracted beams of light can be combined at a predetermined point into a uniform beam of light. With the present invention, the light homogenizing device can improve the uniformity of an image through the decrease of a fringe pattern.

Abstract: An optical modulator using a plurality of ribbons for rendering a pixel of an image is disclosed. An embodiment of the present invention provides an optical modulator having a multiple ribbon structure that can include a substrate and a first driving ribbon group and a second driving ribbon group, each of which includes at least one ribbon spaced from the substrate and driven upward or downward in accordance with a supplied voltage. A relative displacement between the first driving ribbon group and the second driving ribbon group can modulate an incident beam. By alternately driving the first driving ribbon group and the second driving ribbon group, the image quality of the optical modulator in accordance with an embodiment of the present invention can be robust against environmental factors, such as time, time, temperature and fatigue, and hysteresis.

Abstract: Disclosed is an optical modulator including: a substrate; an insulation layer disposed on the substrate; a ribbon layer, a center portion of which is spaced apart from the insulation layer by a predetermined gap; a piezoelectric element that is disposed on the ribbon layer and allows the center portion of the ribbon layer to bend vertically; and a passivation layer that is disposed on the piezoelectric element and comprises a main passivation film.

Abstract: Disclosed are a method for driving a piezoelectric element or an optical modulator including a piezoelectric element and a recorded medium recorded with a program for executing the same. In accordance with an embodiment of the present invention, the method for driving a piezoelectric element causing a displacement object to be displaced by being contracted or expanded according to a supplied driving voltage, including supplying a driving signal to the piezoelectric element during a first driving period in a first voltage range; supplying a control signal for controlling a polarization hysteresis of the piezoelectric element according to a driving, performed during the first driving period, to the piezoelectric element; and supplying the driving signal to the piezoelectric element during a second driving period in a second voltage range.

Abstract: Disclosed are a piezoelectric driving device and a driving method thereof, and an optical modulating device using the same. In accordance with an embodiment of the present invention, the optical modulating device can include an optical modulator, having a piezoelectric element causing a displacement object to be displaced by being contracted or expanded according to a supplied driving voltage; and a driving unit, generating the driving voltage to be supplied to the piezoelectric element. Here, the driving voltage can be a square-wave signal having a shorter reset time than a minimum reaction time necessary to allow the displacement object to be displaced.

Abstract: Disclosed is a method of producing a diffractive micromirror. More particularly, the present invention pertains to a method of producing a diffractive micromirror, in which a recess having a desired depth and width is precisely formed in a piezoelectric operation manner.

Abstract: An aspect of the present invention provides a device for inspecting an optical modulator. The device can comprise: a probe card that converts an inputted control signal to a driving signal, and provide the driving signal by contacting with each driving signal input pad of an optical modulator—wherein the optical modulator comprises one or more micromirrors and one or more driving signal input pads connected to the micromirrors, respectively, and the micromirror moves up and down according to the driving signal inputted through the driving signal input pad—; and an image control circuit that generates the control signal for checking if the optical modulator is operation properly, and is connected electrically to the probe card to transmit the control signal. A device and a method for inspecting an optical modulator according to the present invention can inspect performance and function of the optical modulator at a chip level.

Abstract: A spatial optic modulating system with speckle reduction and a method thereof are disclosed. According to an embodiment of the present invention, a spatial optic modulating system includes a spatial optic modulator, which modulates and reflects an image transferred in accordance with an upward or downward movement of a ribbon that is operated according to a contraction or expansion of a piezoelectric element, an image lens unit, which transfers an image modulated from the spatial optic modulator as a diffraction image to a scanner, and a phase modulator, which modulates a phase of the diffraction image transferred from the image lens unit. With the present invention, an image, from which a speckle is removed, can be displayed by modulating a phase of an image projected by using a spatial optic modulator.

Abstract: An aspect of the present invention features a calibration apparatus for an optical modulator comprising: a light source emitting a beam to the optical modulator; an optical scanning unit scanning and projecting a beam emitted from the optical modulator; a light measuring unit measuring a beam emitted from the light source; and a light source control unit controlling the light source to the optical scanning unit to emit a calibration beam that is invisible and can be sensed by the light measuring unit.

Abstract: Disclosed is an optical modulator including: a substrate; an insulation layer disposed on the substrate; a ribbon layer, a center portion of which is spaced apart from the insulation layer by a predetermined gap; a piezoelectric element that is disposed on the ribbon layer and allows the center portion of the ribbon layer to bend vertically; and a passivation layer that is disposed on the piezoelectric element and comprises a main passivation film.

Abstract: Disclosed is a diffractive micromirror and a method of producing the same. More particularly, the present invention pertains to a diffractive micromirror, in which a recess having a desired depth and width is precisely formed in a piezoelectric operation manner, and a method of producing the same.

Abstract: A semiconductor package and packaging method using a flip-chip bonding technology is disclosed. In the semiconductor package and packaging method, the microelement array of a micro-device, for example, the micromirror array of a light modulator having micromirrors that are hyperfine elements, is sealed from the outside using flip-chip bonding technology. Thus, the microelement array is protected from the outside. The packaging method executes the packaging process using only the flip-chip bonding technology, without a wire-bonding technology, at a wafer level instead of a conventional individual semiconductor device level, thus increasing the bonding process efficiency. Furthermore, the electrode array pattern for supplying both electricity and control signals to the microelement array does not pass through a hermetic sealing layer, thus ensuring a well-sealed semiconductor package. The electrode array pattern is also finely formed to correspond to the microelement array which is extremely finely formed.

Abstract: A semiconductor package and packaging method using a flip-chip bonding technology is disclosed. In the semiconductor package and packaging method, the microelement array of a micro-device, for example, the micromirror array of a light modulator having micromirrors that are hyperfine elements, is sealed from the outside using flip-chip bonding technology. Thus, the microelement array is protected from the outside. The packaging method executes the packaging process using only the flip-chip bonding technology, without a wire-bonding technology, at a wafer level instead of a conventional individual semiconductor device level, thus increasing the bonding process efficiency. Furthermore, the electrode array pattern for supplying both electricity and control signals to the microelement array does not pass through a hermetic sealing layer, thus ensuring a well-sealed semiconductor package. The electrode array pattern is also finely formed to correspond to the microelement array which is extremely finely formed.

Abstract: Disclosed is a diffractive micromirror and a method of producing the same. More particularly, the present invention pertains to a diffractive micromirror, in which a recess having a desired depth and width is precisely formed in a piezoelectric operation manner, and a method of producing the same.

Abstract: Disclosed is a diffractive micromirror and a method of producing the same. More particularly, the present invention pertains to a diffractive thin-film piezoelectric micromirror, which is operated in a piezoelectric operation manner to assure excellent displacement, operation speed, reliability, linearity, and low voltage operation, and a method of producing the same. The diffractive thin-film piezoelectric micromirror includes a silicon substrate on which a recess is formed to provide an air space to the center thereof, and a piezoelectric mirror layer having a band shape, which is attached to the silicon substrate along both ends of the recess at both ends thereof while being spaced from the bottom of the recess at a center portion thereof and which includes a thin-film piezoelectric material layer to be vertically movable when voltage is applied to the piezoelectric material layer, and thus diffracts an incident light beam.