Patents by Inventor Seung-Do Leem

Seung-Do Leem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of preparing a heat-resistant polyamide
    Patent number: 8822629
    Abstract: The present invention relates to a method of prepairing a heat-resistant polyamide by carrying out condensation polymerization with a monomer mixture including a diester compound and a diamine compound. The present invention provides an economical method of prepairing a heat-resistant polyamide in that a monomer, a raw material, is simply and chiefly prepared, and the polymerizing reaction time is short because it does not need solvent separately.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: September 2, 2014
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Dong-June Hwang, Jae-Bong Lim, Seung-Do Leem, Tae-Young Kim, Sung-su Bae
  • METHOD OF PREPARING A HEAT-RESISTANT POLYAMIDE
    Publication number: 20120029163
    Abstract: The present invention relates to a method of prepairing a heat-resistant polyamide by carrying out condensation polymerisation with a monomer mixture including a diester compound and a diamine compound. The present invention provides an economical method of prepairing a heat-resistant polyamide in that a monomer, a raw material, is simply and chiefly prepared, and the polymerizing reaction time is short because it does not need solvent separately.
    Type: Application
    Filed: April 10, 2009
    Publication date: February 2, 2012
    Applicant: SK Chemicals Co., Ltd.
    Inventors: Dong-June Hwang, Jae-Bong Lim, Seung-Do Leem, Tae-young Kim, Sung-su Bae