Patents by Inventor Seung Eun Yang

Seung Eun Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Overload protection device for compressor motor
    Patent number: 10483067
    Abstract: An overload protection device for a compressor motor and, more specifically, to an overload protection device for a compressor motor, which has an overload protection means and can thus more effectively prevent overload of the compressor motor.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: November 19, 2019
    Assignee: MICRO CONTACT SOLUTION CO., LTD.
    Inventors: Seung Eun Yang, Jang Hyun Baic, Takashi Masuda
  • OVERLOAD PROTECTION DEVICE FOR COMPRESSOR MOTOR
    Publication number: 20180218866
    Abstract: An overload protection device for a compressor motor and, more specifically, to an overload protection device for a compressor motor, which has an overload protection means and can thus more effectively prevent overload of the compressor motor.
    Type: Application
    Filed: July 14, 2016
    Publication date: August 2, 2018
    Inventors: Seung Eun YANG, Jang Hyun BAIC, Takashi MASUDA
  • Apparatus and method for forming panel
    Patent number: 8167606
    Abstract: Disclosed herein is an apparatus and method for forming a panel. The apparatus includes a first mold unit may include a right-angled upper mold provided on the front portion of an upper mold to reciprocate vertically, and a right-angled lower mold provided on the front portion of a lower mold, thus compressing base materials to impart a pattern of a right triangular waveform. A second mold unit may include an obtuse upper mold provided on the central portion of the upper mold to reciprocate in a direction inclined relative to a progressing direction of the base materials, and an obtuse lower mold provided on the central portion of the lower mold, thus compressing the base materials to impart a pattern of an obtuse triangular waveform. A third mold unit may be provided behind the second mold unit and linearly presses the base materials in a direction from front to rear.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: May 1, 2012
    Assignee: Micro Contact Solution Co, Ltd.
    Inventor: Seung Eun Yang
  • APPARATUS AND METHOD FOR FORMING PANEL
    Publication number: 20100252954
    Abstract: Disclosed herein is an apparatus and method for forming a panel. The apparatus includes a first mold unit may include a right-angled upper mold provided on the front portion of an upper mold to reciprocate vertically, and a right-angled lower mold provided on the front portion of a lower mold, thus compressing base materials to impart a pattern of a right triangular waveform. A second mold unit may include an obtuse upper mold provided on the central portion of the upper mold to reciprocate in a direction inclined relative to a progressing direction of the base materials, and an obtuse lower mold provided on the central portion of the lower mold, thus compressing the base materials to impart a pattern of an obtuse triangular waveform. A third mold unit may be provided behind the second mold unit and linearly presses the base materials in a direction from front to rear.
    Type: Application
    Filed: December 18, 2009
    Publication date: October 7, 2010
    Applicant: MICRO CONTACT SOLUTION CO., LTD.
    Inventor: Seung Eun Yang