Patents by Inventor Seung Gin Huh

Seung Gin Huh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11634679
    Abstract: Provided herein is a pipette tip for electroporation including an outer surface, a void located within the outer surface, and a conductor located at least partially on or within the outer surface, in electrical communication with at least a portion of the outer surface and the void. Further provided herein is a pipette tip for electroporation including a body, a connector, and an elongated part. The connector is located at the distal end of the body and further includes at least one connecting post, a connecting part in mechanical communication with the connector, and a conductor located at least partially on or within the connector, wherein the conductor surrounds at least a portion of the connecting post. The elongated part also has a void and is located at the distal end of the connector. The void of the body, connector, and elongated part are in fluid communication.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: April 25, 2023
    Assignee: LIFE TECHNOLOGIES CORPORATION
    Inventors: Jun-Keun Chang, Keun-Chang Cho, Chan-Il Chung, Neon-Cheol Jung, Seung Gin Huh
  • Publication number: 20200080042
    Abstract: Provided herein is a pipette tip for electroporation including an outer surface, a void located within the outer surface, and a conductor located at least partially on or within the outer surface, in electrical communication with at least a portion of the outer surface and the void. Further provided herein is a pipette tip for electroporation including a body, a connector, and an elongated part. The connector is located at the distal end of the body and further includes at least one connecting post, a connecting part in mechanical communication with the connector, and a conductor located at least partially on or within the connector, wherein the conductor surrounds at least a portion of the connecting post. The elongated part also has a void and is located at the distal end of the connector. The void of the body, connector, and elongated part are in fluid communication.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 12, 2020
    Inventors: Jun-Keun CHANG, Keun-Chang CHO, Chan-Il CHUNG, Neon-Cheol JUNG, Seung Gin HUH
  • Patent number: 10450543
    Abstract: Provided herein is a pipette tip for electroporation including an outer surface, a void located within the outer surface, and a conductor located at least partially on or within the outer surface, in electrical communication with at least a portion of the outer surface and the void. Further provided herein is a pipette tip for electroporation including a body, a connector, and an elongated part. The connector is located at the distal end of the body and further includes at least one connecting post, a connecting part in mechanical communication with the connector, and a conductor located at least partially on or within the connector, wherein the conductor surrounds at least a portion of the connecting post. The elongated part also has a void and is located at the distal end of the connector. The void of the body, connector, and elongated part are in fluid communication.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: October 22, 2019
    Assignee: LIFE TECHNOLOGIES CORPORATION
    Inventors: Jun-Keun Chang, Keun-Chang Cho, Chan-Il Chung, Neon-Cheol Jung, Seung Gin Huh
  • Publication number: 20170166854
    Abstract: Provided herein is a pipette tip for electroporation including an outer surface, a void located within the outer surface, and a conductor located at least partially on or within the outer surface, in electrical communication with at least a portion of the outer surface and the void. Further provided herein is a pipette tip for electroporation including a body, a connector, and an elongated part. The connector is located at the distal end of the body and further includes at least one connecting post, a connecting part in mechanical communication with the connector, and a conductor located at least partially on or within the connector, wherein the conductor surrounds at least a portion of the connecting post. The elongated part also has a void and is located at the distal end of the connector. The void of the body, connector, and elongated part are in fluid communication.
    Type: Application
    Filed: November 21, 2016
    Publication date: June 15, 2017
    Inventors: Jun-Keun CHANG, Keun-Chang CHO, Chan-Il CHUNG, Neon-Cheol JUNG, Seung Gin HUH
  • Patent number: 9523071
    Abstract: Provided herein is a pipette tip (600) for electroporation including an outer surface, a void (611) located within the outer surface, and a conductor (622) located at least partially on or within the outer surface, in electrical communication with at least a portion of the outer surface and the void. Further provided herein is a pipette tip for electroporation including a body, a connector (620), and an elongated part (630). The connector is located at the distal end of the body and further includes at least one connecting post, a connecting part in mechanical communication with the connector, and a conductor located at least partially on or within the connector, wherein the conductor surrounds at least a portion of the connecting post. The elongated part also has a void and is located at the distal end of the connector. The void of the body, connector, and elongated part are in fluid communication.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: December 20, 2016
    Assignee: Life Technologies Corporation
    Inventors: Jun-Keun Chang, Keun-Chang Cho, Chan-Il Chung, Neon-Cheol Jung, Seung Gin Huh
  • Publication number: 20110263005
    Abstract: Provided herein is a pipette tip (600) for electroporation including an outer surface, a void (611) located within the outer surface, and a conductor (622) located at least partially on or within the outer surface, in electrical communication with at least a portion of the outer surface and the void. Further provided herein is a pipette tip for electroporation including a body, a connector (620), and an elongated part (630). The connector is located at the distal end of the body and further includes at least one connecting post, a connecting part in mechanical communication with the connector, and a conductor located at least partially on or within the connector, wherein the conductor surrounds at least a portion of the connecting post. The elongated part also has a void and is located at the distal end of the connector. The void of the body, connector, and elongated part are in fluid communication.
    Type: Application
    Filed: April 15, 2009
    Publication date: October 27, 2011
    Applicant: LIFE TECHNOLOGIES CORPORATION
    Inventors: Jun-Keun Chang, Keun-Chang Cho, Chan-Il Chung, Neon-Cheol Jung, Seung Gin Huh