Abstract: An antenna module includes a connection member, an integrated circuit (IC) on a first surface thereof, and an antenna package on a second surface thereof. The connection member includes a wiring layer and an insulating layer. The IC is electrically connected to the wiring layer. The antenna package includes first antenna members and feed vias each electrically connected to a corresponding one of the first antenna members and a corresponding wire of the wiring layer. A feed line is electrically connected to a wire of the wiring layer and extends in a side direction of the second surface, a second antenna member is electrically connected to the feed line and is configured to transmit and/or receive an RF signal in the side direction, and a director member is spaced apart from the second antenna member in the side direction and has an inside boundary oblique to the second antenna member.

Abstract: An antenna includes feed pads; a radiating portion disposed on one side of the feed pads and spaced apart from the feed pads, the radiating portion being constituted by a single conductor plate; and a ground part disposed on an opposite side of the feed pads from the radiating portion; wherein each of the feed pads has a polygonal shape.

Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.

Abstract: An antenna includes feed pads; a radiating portion disposed on one side of the feed pads and spaced apart from the feed pads, the radiating portion being constituted by a single conductor plate; and a ground part disposed on an opposite side of the feed pads from the radiating portion; wherein each of the feed pads has a polygonal shape.

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.

Abstract: An antenna includes feed pads; a radiating portion disposed on one side of the feed pads and spaced apart from the feed pads, the radiating portion being constituted by a single conductor plate; and a ground part disposed on an opposite side of the feed pads from the radiating portion; wherein each of the feed pads has a polygonal shape.

Abstract: An antenna module includes a connection member, an integrated circuit (IC) on a first surface thereof, and an antenna package on a second surface thereof. The connection member includes a wiring layer and an insulating layer. The IC is electrically connected to the wiring layer. The antenna package includes first antenna members and feed vias each electrically connected to a corresponding one of the first antenna members and a corresponding wire of the wiring layer. A feed line is electrically connected to a wire of the wiring layer and extends in a side direction of the second surface, a second antenna member is electrically connected to the feed line and is configured to transmit and/or receive an RF signal in the side direction, and a director member is spaced apart from the second antenna member in the side direction and has an inside boundary oblique to the second antenna member.

Abstract: An antenna module includes a connection member, an integrated circuit (IC) on a first surface thereof, and an antenna package on a second surface thereof. The connection member includes a wiring layer and an insulating layer. The IC is electrically connected to the wiring layer. The antenna package includes first antenna members and feed vias each electrically connected to a corresponding one of the first antenna members and a corresponding wire of the wiring layer. A feed line is electrically connected to a wire of the wiring layer and extends in a side direction of the second surface, a second antenna member is electrically connected to the feed line and is configured to transmit and/or receive an RF signal in the side direction, and a director member is spaced apart from the second antenna member in the side direction and has an inside boundary oblique to the second antenna member.

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.

Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.

Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an IC disposed on a first surface of the connection member and electrically connected to at least one wiring layer of the connection member; and an antenna package disposed on a second surface of the connection member and including first antenna members and feed vias, wherein the connection member includes a feed line having a first end electrically connected to a corresponding wire of at least one wiring layer of the connection member; a second antenna member electrically connected to a second end of the feed line and configured to transmit or receive a radio frequency (RF) signal; and a ground member spaced apart from the feed line in a direction toward the first surface or the second surface of the connection member.

Abstract: An antenna module includes a connection member, an integrated circuit (IC) on a first surface thereof, and an antenna package on a second surface thereof. The connection member includes a wiring layer and an insulating layer. The IC is electrically connected to the wiring layer. The antenna package includes first antenna members and feed vias each electrically connected to a corresponding one of the first antenna members and a corresponding wire of the wiring layer. A feed line is electrically connected to a wire of the wiring layer and extends in a side direction of the second surface, a second antenna member is electrically connected to the feed line and is configured to transmit and/or receive an RF signal in the side direction, and a director member is spaced apart from the second antenna member in the side direction and has an inside boundary oblique to the second antenna member.

Abstract: A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.

Abstract: An antenna includes feed pads; a radiating portion disposed on one side of the feed pads and spaced apart from the feed pads, the radiating portion being constituted by a single conductor plate; and a ground part disposed on an opposite side of the feed pads from the radiating portion; wherein each of the feed pads has a polygonal shape.

Abstract: Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.

Abstract: A signal amplifier includes a band suppression filter configured to suppress a preset band among bands included in an input signal, a first common source-type amplifier connected between a supply terminal of a driving voltage and a ground terminal and configured to amplify a first input signal separated from an output signal of the band suppression filter in a common input node to provide a first amplified signal to a common output node, a second common source-type amplifier configured to amplify a second input signal separated from the output signal of the band suppression filter in the common input node to provide a second amplified signal to the common output node, and an output matcher configured to match levels of impedance between the common output node and an output terminal and to transfer a combined signal to the output terminal.

Abstract: There is provided a band pass filter including: a first substrate including a plurality of capacitors and a plurality of conductive patterns provided thereon; and a second substrate laminated with the first substrate and connected to the plurality of first conductive patterns through a plurality of via holes, wherein an attenuation frequency is determined according to the amount and shape of the plurality of via holes.

Abstract: Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.