Abstract: Wafer probing test apparatus includes a main body, a test head having a plurality of pogo pins at its bottom surface, a probe card for engagement with the test head, a position sensor for sensing when the test head is oriented properly for docking with the probe card, and a docking height sensor for sensing when the test head arrives at the proper docking height. The sensors include a plurality of position sensor protrusions and at least one height sensor protrusion formed on the bottom of the test head, a plurality of position limit switches and a down limit switch. The switches are operated in response to the insertion and withdrawal of the position sensor protrusions into and from holes formed in the probe card.

Abstract: Wafer probing test apparatus includes a main body, a test head installed over the main body and having a plurality of pogo pins at its bottom surface, a probe card supported on the main body for engagement with the test head, a position sensor for sensing when the test head is oriented properly for docking with the probe card, and a docking height sensor for sensing when the test head arrives at the proper docking height. The sensors, which act together to detect the docking state of the test head, include a plurality of position sensor protrusions and at least one height sensor protrusion formed on the bottom of the test head, a plurality of position limit switches and a down limit switch. The switches are operated in response to the insertion and withdrawal of the sensor protrusions into and form holes formed in the probe card. The movement of the test head is controlled by a manipulator and lifting arm in response to the detected docking state.