Abstract: Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electrode formed therein. The second laminated body is laminated on and electrically connected to the first laminated body. Also, the adhesive part is intervened between the first laminated body and the second laminated body to adhere the first and second laminated bodies through interfacial reaction.

Abstract: A method of manufacturing a capacitor-embedded low temperature co-fired ceramic substrate, the method including: manufacturing a capacitor part by firing a deposition including at least one high dielectric ceramic sheet to form a capacitor part; providing a plurality of low temperature co-fired green sheets each having at least one of a conductive pattern and a conductive via hole thereon; forming a low temperature co-fired ceramic deposition by depositing the low temperature co-fired green sheets to embed the capacitor part in the low temperature co-fired ceramic deposition, the embedded capacitor part connected to the one of conductive pattern and conductive via hole of an adjacent one of the green sheets; and firing the low temperature co-fired ceramic deposition having the capacitor part embedded therein. The capacitor-embedded low temperature co-fired ceramic substrate may be beneficially employed in various types of capacitor part such as a deposited chip capacitor and a capacitor layer structure.

Abstract: Disclosed herein is a multi-layer chip directional coupler. The multi-layer chip directional coupler has a first ground pattern, a coupling signal line, a main signal line, a second ground pattern, and a plurality of ports. The first ground pattern is formed on the upper surface of a first dielectric layer. The coupling signal line is formed of a conduction pattern on the upper surface of a second dielectric layer. The main signal line is formed of a conduction pattern on the upper surface of a third dielectric layer formed over the second dielectric layer. The second ground pattern formed on the upper surface of a fourth dielectric layer formed over the third dielectric layer. A plurality of ports is formed on the side surfaces of the first to fourth dielectric layers.

Abstract: In a method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter, when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between a ceramic main body and a metal case so as to protect the chip component, and then, a second sealing is carried out also between the metal case and the ceramic main body again, so that the shielding effect against external electromagnetic fields would be superior, and so that costs are reduced and so that a workability improvement can be realized, and so that the sealing can be made more secure. The first sealing is carried out on a step that is formed on the top of the ceramic main body to bond the metal case thereupon. The second sealing is carried out on the top of the ceramic main body to bond the metal case on the ceramic main body.

Abstract: Disclosed herein is a multi-layer chip directional coupler. The multi-layer chip directional coupler has a first ground pattern, a coupling signal line, a main signal line, a second ground pattern, and a plurality of ports. The first ground pattern is formed on the upper surface of a first dielectric layer. The coupling signal line is formed of a conduction pattern on the upper surface of a second dielectric layer. The main signal line is formed of a conduction pattern on the upper surface of a third dielectric layer formed over the second dielectric layer. The second ground pattern formed on the upper surface of a fourth dielectric layer formed over the third dielectric layer. A plurality of ports is formed on the side surfaces of the first to fourth dielectric layers.

Abstract: A method and a device for sealing a ceramic package of a SAW (Surface Acoustic Wave) filter are disclosed, in which when making a ceramic package of an environmentally sensitive SAW filter such as a SAW duplexer filter or a SAW filter, a first sealing is carried out between a ceramic main body and a metal case so as to protect the chip component, and then, a second sealing is carried out also between the metal case and the ceramic main body again, so that the shielding effect against external electromagnetic fields would be superior, that a cost curtail and a workability improvement can be realized, and that the sealing can be made sure. The first sealing is carried out on a step which is formed on the top of the ceramic main body to bond the metal case thereupon. The second sealing is carried out on the top of the ceramic main body to bond the metal case on the ceramic main body.