Abstract: A semiconductor package assembly includes recessed edge portions extending along at least one edge portion of the assembly and an upper surface of leads being exposed therefrom, a top recess portion disposed on a top surface of the assembly, and a bottom recess portion disposed on a bottom surface of the assembly. When the assemblies are used in fabricating a three-dimensional integrated circuit module, the recessed edge portions accommodates leads belonging to an upper semiconductor assembly to achieve electrical interconnection therebetween, the top recess portion and the bottom recess portion belonging to an upper semiconductor assembly form a space to accommodate a heat sink or a capacitor plate.

Abstract: A semiconductor device having at least one semiconductor chip loaded on a lower surface of a printed circuit board, electrode terminals of the semiconductor chip wire-bonded to terminals on the printed circuit board, and a connection portion of the semiconductor chip and wires encapsulated by means of encapsulating resin includes a semiconductor device of three-dimensional structure having the printed circuit board reversely mounted, the terminals of the printed circuit board connected to external terminals via through holes, and at least one semiconductor device stacked on an upper surface of the printed circuit board, thereby interconnecting respective semiconductor devices while interposing solder balls to be mounted to other printed circuit boards by leads being the external terminals.

Abstract: Disclosed herein is a high thermal emissive semiconductor device package which comprises a substrate having a plurality of external connection leads, a plurality of connection lands and wires between the leads and the lands; at least one semiconductor chips mounted on the substrate; bonding wires electrically connecting bonding pads of the chip and the connection lands of the substrate; a heat spreader with high thermal conductivity, which is attached to the upper surface of the bonding pads of the chip by insulating adhesives with good thermal conductivity; and a metal cap which is in contact with the upper surface of the heat spreader via thermal compounds and encapsulates the whole components by being sealed to the substrate.The high thermal emissive semiconductor device packages have advantageous that they efficiently emit heat generated during the operation of components and that they may be applied to various semiconductor devices which can be produced at low costs.

Abstract: A semiconductor memory module is formed of semiconductor packages respectively having at least one defect data line combined to be mounted to a module substrate which has two rows of auxiliary pads for excluding the defect data line of the mounted semiconductor packages from overall data lines of the module to thus attain more than a required memory capacity. By connecting the auxiliary pads with coupling units of resistors or jumper cables to isolate the defect data lines, the semiconductor memory module achieves the required memory capacity and utilizes defective semiconductor packages to reduce manufacturing costs, to attain excellent compatibility resulting from employing all kinds of semiconductor packages, and to simplify the data line connection process. Further, reworking semiconductor package is easy which improves yield, and humid air is prevented from permeating into the interior of the molding resin thereby preventing failures such as disconnection of wires and improving reliability.

Abstract: A rotation and alignment device for assembling of an optical fiber connector with a lower connection loss. This device image-processes the distribution of optical intensity of light emitted from an end surface of an optical fiber of a ferrule and derives an optical peak intensity point of the end surface of the optical fiber such that the point is placed in a predetermined region of a rectangular coordinate system. This device comprises a rotation and marking part for controlling a rotational position of a marker with respect to the ferrule and marking the optical peak intensity point on an outer surface of the ferrule. A ferrule fixture part is coupled to the rotation and marking part and fixes the ferrule such that the outer surface of the ferrule is marked with the optical peak intensity point by the marker. A vertical supporting part supports the rotation and marking part and the ferrule fixture pat.

Abstract: This invention comprises a pair of bit lines; a word line; a pair of data bus lines; bit line sense amplifying means connected to said pair of bit lines and said word line; a voltage difference to current difference converter connected to said bit line sense amplifying means through said pair of bit lines, for converting the voltage difference between said pair of bit lines to the current difference; current sensing means connected to said pair of data bus lines and a power source, for sensing a current flowing to said pair of data bus lines and holding a same voltage level in said pair of data bus lines; and current difference to voltage difference converting and amplifying means connected to said current sensing means, for converting the current difference occurred in said current sensing means to the voltage difference and amplifying the voltage difference.