Abstract: A semiconductor device, which can improve reading and writing stability of a static random access memory (SRAM) is provided.

Abstract: The present invention provides a ceramide lamella structure comprising a glucoside surfactant, a preparation method thereof, and a skin composition for external use containing the same. According to the skin preparation composition for external use of the present invention, phase stability is very excellent and a greater amount of ceramides can be stably formed according to the stability of ceramides using multilayered lamellar liquid crystals, thereby showing excellent skin moisturizing and skin barrier function repairing effects when applied to the skin.

Abstract: Provided is a neural device including a nanowire and a support layer. Further, provided is a neural device including: a substrate, at least one nanowire which is fixed on the substrate at a lengthwise end thereof to extend vertically and inserted into nerves to obtain electrical signals from nerve fibers or apply electrical signals to the nerve fibers; and a support layer which is formed on the substrate and which surrounds and supports at least one portion of the nanowire.

Abstract: The present invention provides a ceramide lamella structure comprising a glucoside surfactant, a preparation method thereof, and a skin composition for external use containing the same. According to the skin preparation composition for external use of the present invention, phase stability is very excellent and a greater amount of ceramides can be stably formed according to the stability of ceramides using multilayered lamellar liquid crystals, thereby showing excellent skin moisturizing and skin barrier function repairing effects when applied to the skin.

Abstract: Provided is a scanning optical measurement apparatus having super resolution.

Abstract: The present invention relates to a neural device comprising wires transmitting and receiving electric signals. More specifically, the present invention relates to a structure of the neural device comprising wires which effectively obtain electric signals developed in nerve fibers and transmit electric stimuli to the nerve fibers. The neural device according to the present invention is connected to a processing module processing electric signals detected from nerve fibers, and the neural device is inserted in nerve fibers via nanowires to obtain electric signals from the nerve fibers, or inserted in the nerve fibers to transmit electric stimuli. The neural device may further provide with at least one through-hole and support. The neural device according to the present invention has an advantage that may obtain electric signals without killing nerve fibers or provide them with electric stimuli.

Abstract: The present invention relates to a neural device comprising wires transmitting and receiving electric signals. More specifically, the present invention relates to a structure of the neural device comprising wires which effectively obtain electric signals developed in nerve fibers and transmit electric stimuli to the nerve fibers. The neural device according to the present invention is connected to a processing module processing electric signals detected from nerve fibers, and the neural device is inserted in nerve fibers via nanowires to obtain electric signals from the nerve fibers, or inserted in the nerve fibers to transmit electric stimuli. The neural device may further provide with at least one through-hole and support. The neural device according to the present invention has an advantage that may obtain electric signals without killing nerve fibers or provide them with electric stimuli.

Abstract: Provided is a scanning optical measurement apparatus having super resolution.

Abstract: In a semiconductor device and a method of fabricating the same, a fuse and a capacitor are formed at a same level on a semiconductor substrate having a fuse area and a capacitor area. The fuse is placed on the fuse area, and a lower plate is placed on the capacitor area. The lower plate is located on a same plane as the fuse. Further, an upper plate is located above the lower plate, and a capping layer is interposed between the lower plate and the upper plate. Therefore, the fuse and the capacitor can be formed at the same time, thereby minimizing photolithography and etch process steps.

Abstract: In a semiconductor device and a method of fabricating the same, a fuse and a capacitor are formed at a same level on a semiconductor substrate having a fuse area and a capacitor area. The fuse is placed on the fuse area, and a lower plate is placed on the capacitor area. The lower plate is located on a same plane as the fuse. Further, an upper plate is located above the lower plate, and a capping layer is interposed between the lower plate and the upper plate. Therefore, the fuse and the capacitor can be formed at the same time, thereby minimizing photolithography and etch process steps.

Abstract: In a semiconductor device and a method of fabricating the same, a fuse and a capacitor are formed at a same level on a semiconductor substrate having a fuse area and a capacitor area. The fuse is placed on the fuse area, and a lower plate is placed on the capacitor area. The lower plate is located on a same plane as the fuse. Further, an upper plate is located above the lower plate, and a capping layer is interposed between the lower plate and the upper plate. Therefore, the fuse and the capacitor can be formed at the same time, thereby minimizing photolithography and etch process steps.

Abstract: In a semiconductor device and a method of fabricating the same, a fuse and a capacitor are formed at a same level on a semiconductor substrate having a fuse area and a capacitor area. The fuse is placed on the fuse area, and a lower plate is placed on the capacitor area. The lower plate is located on a same plane as the fuse. Further, an upper plate is located above the lower plate, and a capping layer is interposed between the lower plate and the upper plate. Therefore, the fuse and the capacitor can be formed at the same time, thereby minimizing photolithography and etch process steps.

Abstract: Disclosed is a helmet or a safety cap for protecting the rider's head and a method of manufacturing the same, in which the main body of the helmet has a dual-structure so as to reduce work process when an outer surface of the helmet is painted, and weight thereof. The main body of the helmet has a dual-structure in that an outer surface thereof is formed of a thermoplastic for an aesthetic enhancement and an inner surface thereof is formed of FRP or a mixture of aramide fiber, polyethylene fiber, vinylon, carbon fiber. Thus-formed dual structure of the helmet body contributes to enhancement in impact resistance and convenience in painting, decreasing an overall weight of the helmet.

Abstract: Disclosed is a helmet or a safety cap for protecting the rider's head and a method of manufacturing the same, in which the main body of the helmet has a dual-structure so as to reduce work process when an outer surface of the helmet is painted, and weight thereof. The main body of the helmet has a dual-structure in that an outer surface thereof is formed of a thermoplastic for an aesthetic enhancement and an inner surface thereof is formed of FRP or a mixture of aramide fiber, polyethylene fiber, vinylon, carbon fiber. Thus-formed dual structure of the helmet body contributes to enhancement in impact resistance and convenience in painting, decreasing an overall weight of the helmet.

Abstract: Disclosed is a helmet or a safety cap for protecting the rider's head and a method of manufacturing the same, in which the main body of the helmet has a dual-structure so as to reduce work process when an outer surface of the helmet is painted, and weight thereof. The main body of the helmet has a dual-structure in that an outer surface thereof is formed of a thermoplastic for an aesthetic enhancement and an inner surface thereof is formed of FRP or a mixture of aramide fiber, polyethylene fiber, vinylon, carbon fiber. Thus-formed dual structure of the helmet body contributes to enhancement in impact resistance and convenience in painting, decreasing an overall weight of the helmet.