Patents by Inventor Seung-Han Park

Seung-Han Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100305657
    Abstract: The present invention relates to a neural device comprising wires transmitting and receiving electric signals. More specifically, the present invention relates to a structure of the neural device comprising wires which effectively obtain electric signals developed in nerve fibers and transmit electric stimuli to the nerve fibers. The neural device according to the present invention is connected to a processing module processing electric signals detected from nerve fibers, and the neural device is inserted in nerve fibers via nanowires to obtain electric signals from the nerve fibers, or inserted in the nerve fibers to transmit electric stimuli. The neural device may further provide with at least one through-hole and support. The neural device according to the present invention has an advantage that may obtain electric signals without killing nerve fibers or provide them with electric stimuli.
    Type: Application
    Filed: February 18, 2008
    Publication date: December 2, 2010
    Applicant: INDUSTRY ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Seung Han Park, Jong Il Hong, Jae Young Choi, Hoeon Jin Choi
  • Publication number: 20100296097
    Abstract: Provided is a scanning optical measurement apparatus having super resolution.
    Type: Application
    Filed: February 18, 2008
    Publication date: November 25, 2010
    Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Seung-Han Park, Dae-Geun Kim, Hong-Gyu Ahn, Eung-Jang Lee
  • Patent number: 7517763
    Abstract: In a semiconductor device and a method of fabricating the same, a fuse and a capacitor are formed at a same level on a semiconductor substrate having a fuse area and a capacitor area. The fuse is placed on the fuse area, and a lower plate is placed on the capacitor area. The lower plate is located on a same plane as the fuse. Further, an upper plate is located above the lower plate, and a capping layer is interposed between the lower plate and the upper plate. Therefore, the fuse and the capacitor can be formed at the same time, thereby minimizing photolithography and etch process steps.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: April 14, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Han Park, Ki-Young Lee
  • Publication number: 20070224771
    Abstract: In a semiconductor device and a method of fabricating the same, a fuse and a capacitor are formed at a same level on a semiconductor substrate having a fuse area and a capacitor area. The fuse is placed on the fuse area, and a lower plate is placed on the capacitor area. The lower plate is located on a same plane as the fuse. Further, an upper plate is located above the lower plate, and a capping layer is interposed between the lower plate and the upper plate. Therefore, the fuse and the capacitor can be formed at the same time, thereby minimizing photolithography and etch process steps.
    Type: Application
    Filed: May 30, 2007
    Publication date: September 27, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-Han Park, Ki-Young Lee
  • Patent number: 7239004
    Abstract: In a semiconductor device and a method of fabricating the same, a fuse and a capacitor are formed at a same level on a semiconductor substrate having a fuse area and a capacitor area. The fuse is placed on the fuse area, and a lower plate is placed on the capacitor area. The lower plate is located on a same plane as the fuse. Further, an upper plate is located above the lower plate, and a capping layer is interposed between the lower plate and the upper plate. Therefore, the fuse and the capacitor can be formed at the same time, thereby minimizing photolithography and etch process steps.
    Type: Grant
    Filed: September 22, 2004
    Date of Patent: July 3, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Han Park, Ki-Young Lee
  • Publication number: 20050067671
    Abstract: In a semiconductor device and a method of fabricating the same, a fuse and a capacitor are formed at a same level on a semiconductor substrate having a fuse area and a capacitor area. The fuse is placed on the fuse area, and a lower plate is placed on the capacitor area. The lower plate is located on a same plane as the fuse. Further, an upper plate is located above the lower plate, and a capping layer is interposed between the lower plate and the upper plate. Therefore, the fuse and the capacitor can be formed at the same time, thereby minimizing photolithography and etch process steps.
    Type: Application
    Filed: September 22, 2004
    Publication date: March 31, 2005
    Inventors: Seung-Han Park, Ki-Young Lee
  • Patent number: 6676884
    Abstract: Disclosed is a helmet or a safety cap for protecting the rider's head and a method of manufacturing the same, in which the main body of the helmet has a dual-structure so as to reduce work process when an outer surface of the helmet is painted, and weight thereof. The main body of the helmet has a dual-structure in that an outer surface thereof is formed of a thermoplastic for an aesthetic enhancement and an inner surface thereof is formed of FRP or a mixture of aramide fiber, polyethylene fiber, vinylon, carbon fiber. Thus-formed dual structure of the helmet body contributes to enhancement in impact resistance and convenience in painting, decreasing an overall weight of the helmet.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: January 13, 2004
    Assignee: Hong Jin Crown Corp., Ltd.
    Inventors: Wan-Ki Hong, Myung-Ho Jung, Dae-Ki Park, Seung-Han Park
  • Publication number: 20030049431
    Abstract: Disclosed is a helmet or a safety cap for protecting the rider's head and a method of manufacturing the same, in which the main body of the helmet has a dual-structure so as to reduce work process when an outer surface of the helmet is painted, and weight thereof. The main body of the helmet has a dual-structure in that an outer surface thereof is formed of a thermoplastic for an aesthetic enhancement and an inner surface thereof is formed of FRP or a mixture of aramide fiber, polyethylene fiber, vinylon, carbon fiber. Thus-formed dual structure of the helmet body contributes to enhancement in impact resistance and convenience in painting, decreasing an overall weight of the helmet.
    Type: Application
    Filed: October 16, 2002
    Publication date: March 13, 2003
    Applicant: HONG JIN CROWN Corporation, Ltd.
    Inventors: Wan-Ki Hong, Myung-Ho Jung, Dae-Ki Park, Seung-Han Park
  • Patent number: 6468644
    Abstract: Disclosed is a helmet or a safety cap for protecting the rider's head and a method of manufacturing the same, in which the main body of the helmet has a dual-structure so as to reduce work process when an outer surface of the helmet is painted, and weight thereof. The main body of the helmet has a dual-structure in that an outer surface thereof is formed of a thermoplastic for an aesthetic enhancement and an inner surface thereof is formed of FRP or a mixture of aramide fiber, polyethylene fiber, vinylon, carbon fiber. Thus-formed dual structure of the helmet body contributes to enhancement in impact resistance and convenience in painting, decreasing an overall weight of the helmet.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: October 22, 2002
    Assignee: Hong Jin Crown Corporation, Ltd.
    Inventors: Wan-Ki Hong, Myung-Ho Jung, Dae-Ki Park, Seung-Han Park