Abstract: The present invention provides an electromagnetic wave-absorbing composite material and a manufacturing method therefor, the electromagnetic wave-absorbing composite material comprising: a polymer composite including a refractive index-adjusting material therein; and a plurality of conductive wires formed on at least one surface of the polymer composite, wherein electromagnetic waves reflected in a matching frequency (f) range derived through Mathematical Formulas 1 to 3 described in the present invention are 0.2 dB or less.

Abstract: A storage device includes a memory device including a plurality of memory dies; and a memory controller for addressing a memory die among the plurality of memory dies by using an address latch enable (ALE) signal and a command latch enable (CLE) signal, which are input during predetermined N cycles, where N is a natural number, and controlling the memory device such that the memory die performs a memory operation. The memory controller may address the memory die by addressing a channel among a plurality of channels respectively connected to a plurality of package groups by using a chip enable (CE) signal.

Abstract: According to the present technology, a storage device includes a nonvolatile storage area including a plurality of backup memory blocks each including a plurality of memory cells respectively connected to a plurality of word lines, and a controller configured to control the nonvolatile storage area to determine a target memory block in which data is to be stored among the plurality of backup memory blocks, determine a reference word line among the plurality of word lines coupled to the target memory block, and perform a pre-conditioning operation of programming dummy data to memory cells connected to at least one of remaining word lines except for the reference word line among the plurality of word lines coupled to the target memory block.

Abstract: The present invention provides an electromagnetic wave-absorbing composite material and a manufacturing method therefor, the electromagnetic wave-absorbing composite material comprising: a polymer composite including a refractive index-adjusting material therein; and a plurality of conductive wires formed on at least one surface of the polymer composite, wherein electromagnetic waves reflected in a matching frequency (f) range derived through Mathematical Formulas 1 to 3 described in the present invention are 0.2 dB or less.

Abstract: A storage device includes a memory device including a plurality of memory dies; and a memory controller for addressing a memory die among the plurality of memory dies by using an address latch enable (ALE) signal and a command latch enable (CLE) signal, which are input during predetermined N cycles, where N is a natural number, and controlling the memory device such that the one memory die performs a memory operation. The memory controller may address the memory die by addressing a channel among a plurality of channels respectively connected to a plurality of package groups by using a chip enable (CE) signal.

Abstract: A thermal dissipation composite material comprising: a matrix including a polymer material; and composite particles distributed in the matrix, wherein the composite particles include a filler, and a thermally conductive material coated on the surface of the filler by an inorganic coating layer, and wherein the plurality of thermally conductive materials coated by the inorganic coating layer are connected to each other on the surfaces of the plurality of composite particles so as to establish a heat transfer network.

Abstract: Provided are a nanostructure network and a method of fabricating the same. The nanostructure network includes nanostructures having a poly-crystalline structure formed by self-assembly of the nanostructures. The method includes preparing a nanostructure solution in which nanostructures are dispersed in a first solvent, forming a nanostructure ink by adding the nanostructure solution into a second solvent having a viscosity higher than that of the first solvent, coating a surface of a substrate with the nanostructure ink, and forming a nanostructure network by evaporating the first solvent and the second solvent included in the nanostructure ink coated on the substrate.

Abstract: An electronic device may include a semiconductor memory device, a central processing device that controls an operation of the semiconductor memory device, and a power supply that supplies power to the semiconductor memory device and the central processing device, and the power supply may include a power controller that receives external power and generates an internal voltage and a charge voltage, an auxiliary power unit that is charged by the charge voltage in a normal mode and provides charged power when sudden power loss occurs, and a charge voltage conversion unit that supplies the auxiliary power unit with the charge voltage at a first level in the normal mode, and converts the first level of the charge voltage to a second level higher than the first level and supplies the charge voltage to the auxiliary power unit in a test mode.

Abstract: An electronic device may include a semiconductor memory device, a central processing device that controls an operation of the semiconductor memory device, and a power supply that supplies power to the semiconductor memory device and the central processing device, and the power supply may include a power controller that receives external power and generates an internal voltage and a charge voltage, an auxiliary power unit that is charged by the charge voltage in a normal mode and provides charged power when sudden power loss occurs, and a charge voltage conversion unit that supplies the auxiliary power unit with the charge voltage at a first level in the normal mode, and converts the first level of the charge voltage to a second level higher than the first level and supplies the charge voltage to the auxiliary power unit in a test mode.

Abstract: Provided are a nanostructure network and a method of fabricating the same. The nanostructure network includes nanostructures having a poly-crystalline structure formed by self-assembly of the nanostructures. The method includes preparing a nanostructure solution in which nanostructures are dispersed in a first solvent, forming a nanostructure ink by adding the nanostructure solution into a second solvent having a viscosity higher than that of the first solvent, coating a surface of a substrate with the nanostructure ink, and forming a nanostructure network by evaporating the first solvent and the second solvent included in the nanostructure ink coated on the substrate.

Abstract: Provided are a magnetic sensor and a method of fabricating the same. The magnetic sensor includes: hall elements disposed in a substrate, a protection layer disposed on the substrate, a seed layer disposed on the protection layer, and an integrated magnetic concentrator (IMC) formed on the seed layer, the seed layer and the IMC each having an uneven surface.

Abstract: The present invention relates to a thermoelectric composite in which a thermoplastic polymer constitutes a matrix, and one or more types of electroconductive materials selected from the group consisting of chalcogen materials and chalcogenides are dispersed at grain boundaries between the thermoplastic polymer particles to form a conductive pathway, wherein an average size of the electroconductive materials is smaller than an average size of the thermoplastic polymer particles, the chalcogen materials are one or more substances selected from the group consisting of sulfur (S), selenium (Se), tellurium (Te), and polonium (Po), the chalcogenides are compounds containing one or more chalcogens selected from the group consisting of S, Se, Te, and Po, and the thermoelectric composite has a thermal conductivity of 0.1 to 0.5 W/m·K. The present invention also relates to a method of preparing the thermoelectric composite.

Abstract: Provided are a magnetic sensor and a method of fabricating the same. The magnetic sensor includes: hall elements disposed in a substrate, a protection layer disposed on the substrate, a seed layer disposed on the protection layer, and an integrated magnetic concentrator (IMC) formed on the seed layer, the seed layer and the IMC each having an uneven surface.

Abstract: Provided are a magnetic sensor and a method of fabricating the same. The magnetic sensor includes: hall elements disposed in a substrate, a protection layer disposed on the substrate, a seed layer disposed on the protection layer, and an integrated magnetic concentrator (IMC) formed on the seed layer, the seed layer and the IMC each having an uneven surface.

Abstract: A magnetic sensor and a manufacturing method thereof are provided. The magnetic sensor includes: a substrate comprising a plurality of Hall elements, a protective layer formed on the substrate, a base layer formed on the protective layer, and an integrated magnetic concentrator (IMC) formed on the base layer and comprising a surface with an elevated portion. The base layer has a larger cross-sectional area than the IMC.

Abstract: A magnetic sensor and a manufacturing method thereof are provided. The magnetic sensor includes: a substrate comprising a plurality of Hall elements, a protective layer formed on the substrate, a base layer formed on the protective layer, and an integrated magnetic concentrator (IMC) formed on the base layer and comprising a surface with an elevated portion. The base layer has a larger cross-sectional area than the IMC.

Abstract: Provided are a magnetic sensor and a method of fabricating the same. The magnetic sensor includes: hall elements disposed in a substrate, a protection layer disposed on the substrate, a seed layer disposed on the protection layer, and an integrated magnetic concentrator (IMC) formed on the seed layer, the seed layer and the IMC each having an uneven surface.

Abstract: A memory system includes a memory device configured to read control data for operating conditions from a content addressed memory (CAM) block by performing a CAM read operation and to perform a data input/output operation based on the control data and a memory controller configured to store the control data of the memory device and to determine whether the memory device is to perform the CAM read operation by comparing the stored control data with the control data of the memory device when an operating mode of the memory device or the memory controller changes.

Abstract: A semiconductor memory apparatus includes: a first data counting unit configured to count respective programming levels of a plurality of input data and output a plurality of first data counting codes having a code value corresponding to the number of respective programming levels; a data read unit configured to sense data stored in a memory block having the plurality of input data programmed therein, based on a voltage level of a plurality of read bias signals, and output the sensed result as a plurality of output data; a second data counting unit configured to count respective programming levels of the plurality of output data and output a plurality of second data counting codes having a code value corresponding to the number of respective programming levels; a read bias control unit configured to compare the plurality of first data counting codes with the plurality of second data counting codes and output a bias control code having a code value corresponding to the comparison result; and a read bias genera

Abstract: A memory system includes a memory device configured to read control data for operating conditions from a content addressed memory (CAM) block by performing a CAM read operation and to perform a data input/output operation based on the control data and a memory controller configured to store the control data of the memory device and to determine whether the memory device is to perform the CAM read operation by comparing the stored control data with the control data of the memory device when an operating mode of the memory device or the memory controller changes.