Abstract: The present invention relates to a wearable pressure ulcer detection sensor, and the wearable pressure ulcer detection sensor according to the present invention includes a pressure sensor measuring pressure based on a change in capacitance caused by physical force, a temperature sensor measuring temperature based on a change in electrical conductivity due to electron hopping, and an impedance sensor including two electrodes spaced apart from each other and in contact with skin.

Abstract: Disclosed herein are image-based object recognition method and system by and in which a learning server performs image-based object recognition based on the learning of environment variable data. The image-based object recognition method includes: receiving an image acquired through at least one camera, and segmenting the image on a per-frame basis; primarily learning labeling results for one or more objects in the image segmented on a per-frame basis; performing primary reasoning by performing object detection in the image through a model obtained as a result of the primary learning; performing data labeling based on the results of the primary reasoning, and performing secondary learning with weights allocated to respective boxes obtained by the primary reasoning and estimated as object regions; and finally detecting one or more objects in the image through a model generated as a result of the secondary learning.

Abstract: A semiconductor package may include a package substrate, an interposer, a logic chip, at least one memory chip and a heat sink. The interposer may be located over an upper surface of the package substrate. The interposer may be electrically connected with the package substrate. The logic chip may be located over an upper surface of the interposer. The logic chip may be electrically connected with the interposer. The memory chip may be located over an upper surface of the interposer. The memory chip may be electrically connected with the interposer and the logic chip. The heat sink may make thermal contact with the upper surface of the logic chip to dissipate heat in the logic chip.

Abstract: A sidestream smoke removal device and a control method thereof are provided. The sidestream smoke removal device according to some embodiments of the present disclosure may include a housing in which a smoking space is formed, an article insertion portion which is disposed at one end of the housing and forms an opening for insertion of a smoking article into the smoking space, an ignition portion which is configured to ignite the smoking article inserted into the smoking space, a sidestream smoke processing portion which is configured to process sidestream smoke generated from the smoking article inserted into the smoking space, and a heating portion disposed inside the housing to heat the smoking space. The heating portion may heat the smoking space to remove a smell generated due to by-products of smoking, and accordingly, the cleanliness of the sidestream smoke removal device can be improved.

Abstract: The present specification relates to a conductive structure body, a method for manufacturing the same, and an electrode and an electronic device including the conductive structure body.

Abstract: Disclosed herein are image-based object recognition method and system by and in which a learning server performs image-based object recognition based on the learning of environment variable data. The image-based object recognition method includes: receiving an image acquired through at least one camera, and segmenting the image on a per-frame basis; primarily learning labeling results for one or more objects in the image segmented on a per-frame basis; performing primary reasoning by performing object detection in the image through a model obtained as a result of the primary learning; performing data labeling based on the results of the primary reasoning, and performing secondary learning with weights allocated to respective boxes obtained by the primary reasoning and estimated as object regions; and finally detecting one or more objects in the image through a model generated as a result of the secondary learning.

Abstract: A complementary thin film transistor (TFT) includes a substrate and a first TFT and a second TFT disposed on the substrate, wherein a first conductive semiconductor layer of the first TFT and a second gate electrode layer of the second TFT are disposed in the same layer and include the same material.

Abstract: Disclosed herein is a multi-layered window or door system for EMP protection. This may include a frame-shaped window or door frame, a plurality of shielding materials disposed on a side of the window or door frame to be spaced apart from each other, a first bracket disposed between the plurality of shielding materials and supported by an elastic mechanism, and a second bracket disposed outside an outermost shielding material among the plurality of shielding materials and supported by a cylinder.

Abstract: The present disclosure relates to a copolymer, which contains: an acrylonitrile-based monomer unit in an amount in a range of greater than 0 wt % and 15 wt % or less; a hydroxyl group (—OH)-containing acrylate-based monomer unit in an amount in a range of greater than 0 wt % and 5 wt % or less; an acrylamide-based monomer unit in an amount in a range of greater than 80 wt % and less than 95 wt %; and an acrylic acid-based monomer unit in an amount in a range of greater than 0 wt % and 15 wt % or less, based on the total weight of the copolymer in an amount of 100 wt %, to a slurry composition containing the copolymer, to a separator, and to a secondary battery.

Abstract: Disclosed is a low gloss black polyimide film produced from a soluble black polyimide resin composition capable of realizing matte by surface transfer of a support film, without addition of a matting agent. Also provided is a black polyimide film including a stress canceling resin layer and having no curl or distortion. The black polyimide film includes: a stress canceling resin layer; a support film; and a black polyimide resin layer coated on the support film in a flexible manner, wherein low gloss is realized without addition of a matting agent, and the stress canceling resin layer for residual stress cancellation of the black polyimide resin layer is provided on the other surface of the support film.

Abstract: A fail-over system and method relates to a fail-over technology of an equipment server managing a semiconductor fabrication equipment server.

Abstract: A fail-over system and method relates to a fail-over technology of an equipment server managing a semiconductor fabrication equipment server.