Patents by Inventor Seung-Heong Lee

Seung-Heong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma processing method of semiconductor manufacturing apparatus
    Patent number: 9048189
    Abstract: Plasma processing methods of a semiconductor manufacturing apparatus which can minimize the amount of impurities adhered to the surface of a wafer, when a desired process using plasma is performed. According to the plasma processing methods of the semiconductor manufacturing apparatus, after the desired process is completed, the plasma generated over the wafer is diffused, and then the wafer is de-chucked.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: June 2, 2015
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventors: Hyun-Su Jun, Ki-Sang Kim, Seung-Heong Lee, Jong-Bum Kim, Min-Woung Choi, In-Joong Kim
  • PLASMA PROCESSING METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS
    Publication number: 20110250758
    Abstract: Plasma processing methods of a semiconductor manufacturing apparatus which can minimize the amount of impurities adhered to the surface of a wafer, when a desired process using plasma is performed. According to the plasma processing methods of the semiconductor manufacturing apparatus, after the desired process is completed, the plasma generated over the wafer is diffused, and then the wafer is de-chucked.
    Type: Application
    Filed: March 10, 2011
    Publication date: October 13, 2011
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Hyun-Su JUN, Ki-Sang Kim, Seung-Heong Lee, Jong-Bum Kim, Min-Woung Choi, In-Joong Kim