Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; and external electrodes disposed on the body. One of the internal electrodes includes interfacial portions disposed at interfaces thereof with two of the dielectric layers, between which the one of the internal electrodes is disposed, and a central portion disposed between the interfacial portions, and one of the interfacial portions has a Mn content higher than an average Mn content of the central portion and an average Mn content of one of the dielectric layers which is in contact with the one of the interfacial portions.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; and external electrodes disposed on the body. One of the internal electrodes includes interfacial portions disposed at interfaces thereof with two of the dielectric layers, between which the one of the internal electrodes is disposed, and a central portion disposed between the interfacial portions, and one of the interfacial portions has a Mn content higher than an average Mn content of the central portion and an average Mn content of one of the dielectric layers which is in contact with the one of the interfacial portions.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet containing a ceramic powder and forming an internal electrode pattern on the ceramic green sheet using a conductive paste containing conductive metal particles and an additive. A ceramic laminate is formed by stacking the ceramic green sheets on which the internal electrode pattern is formed. A ceramic body including dielectric layers and internal electrodes is formed by sintering the ceramic laminate. An average number of conductive metal particles in the internal electrode pattern in a thickness direction is more than 2 and 5 or less.

Abstract: Provided are a multilayer ceramic electronic component and a method for manufacturing the same, the multilayer ceramic electronic component including a ceramic body including a dielectric layer and an internal electrode, and an external electrode formed on an outer side of the ceramic body and electrically connected to the internal electrode, wherein the internal electrode includes a conductive metal and an additive, and the number of particles of the additive disposed per ?m2 of the internal electrode is in the range of 7 to 21, both inclusive.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.

Abstract: A capacitor includes a body including dielectric layers and internal electrodes; and external electrodes disposed on the body. The capacitor includes Sn, the Sn having an alpha particle emission rate equal to or less than 0.02 cph/cm2.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes: preparing a ceramic green sheet containing a ceramic powder; forming an internal electrode pattern on the ceramic green sheet using a conductive paste containing conductive metal particles and an additive; forming a ceramic laminate by stacking the ceramic green sheets on which the internal electrode pattern is formed; and forming a ceramic body including dielectric layers and internal electrodes by sintering the ceramic laminate. An average number of conductive metal particles in the internal electrode pattern in a thickness direction is more than 2 and 5 or less.

Abstract: Provided are a multilayer ceramic electronic component and a method for manufacturing the same, the multilayer ceramic electronic component including a ceramic body including a dielectric layer and an internal electrode, and an external electrode formed on an outer side of the ceramic body and electrically connected to the internal electrode, wherein the internal electrode includes a conductive metal and an additive, and the number of particles of the additive disposed per ?m2 of the internal electrode is in the range of 7 to 21, both inclusive.

Abstract: A capacitor includes a body including dielectric layers and internal electrodes; and external electrodes disposed on the body. The capacitor includes Sn, the Sn having an alpha particle emission rate equal to or less than 0.02 cph/cm2.

Abstract: A capacitor includes a body including a plurality of dielectric layers and internal electrodes which are alternately stacked, and a compensation region formed in the interior of the body, the compensation region including portions of the plurality of dielectric layers and including a central portion and an end portion extended from the central portion. A thickness of the central portion of the compensation region is between 4 and 13 times as great as that of a dielectric layer among the plurality of dielectric layers on which the internal electrodes are formed.

Abstract: A multilayer ceramic electronic component and a method of manufacturing the same are provided. The multilayer ceramic electronic component includes a ceramic body including dielectric layers, and internal electrodes alternately disposed on the dielectric layers and containing a ceramic additive disposed therein; and external electrodes formed on an outer portion of the ceramic body and electrically connected to the internal electrodes. The ceramic additive is disposed in the internal electrode at a position spaced apart from a boundary between the internal electrode and the dielectric layer by a predetermined distance.

Abstract: A multilayer ceramic electronic component and a method of manufacturing the same are provided. The multilayer ceramic electronic component includes a ceramic body including dielectric layers, and internal electrodes alternately disposed on the dielectric layers and containing a ceramic additive disposed therein; and external electrodes formed on an outer portion of the ceramic body and electrically connected to the internal electrodes. The ceramic additive is disposed in the internal electrode at a position spaced apart from a boundary between the internal electrode and the dielectric layer by a predetermined distance.

Abstract: A capacitor includes a body including a plurality of dielectric layers and internal electrodes which are alternately stacked, and a compensation region formed in the interior of the body, the compensation region including portions of the plurality of dielectric layers and including a central portion and an end portion extended from the central portion. A thickness of the central portion of the compensation region is between 4 and 13 times as great as that of a dielectric layer among the plurality of dielectric layers on which the internal electrodes are formed.

Abstract: The present invention relates to techniques to detect chromosomal columns abnormalities. More specifically, the present invention is directed to a microarray chip for detecting chromosomal abnormalities comprising one or more pooled probe sets, wherein the pooled probe set is specific to a chromosomal abnormality and all probes of each pooled probe set are immobilized together in at least one spot; a method of detecting chromosomal abnormalities using the microarray chip; a kit for diagnosing diseases associated with chromosomal abnormalities comprising the microarray chip; and a method of diagnosing a disease associated with a chromosomal abnormality by identifying the chromosomal abnormality specific to the disease using the microarray chip. The present invention relates to techniques to detect chromosomal abnormalities.