Patents by Inventor Seung Ho CHA

Seung Ho CHA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11993702
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a base resin including at least two polypropylene-based resins having different melt indexes, an elastomer having a melt index (190° C., 2.16 kg) of 20 g/10 min to 35 g/10 min as measured by ASTM D1238, and inorganic particles, and has a flexural modulus (FM) of 2,500 MPa or more and a coefficient of linear thermal expansion (CLTE) of 60 ?m/m° C. or less.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: May 28, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, LOTTE CHEMICAL CORPORATION
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Kyung Hwan Lim, Eun Hwa Jang
  • Publication number: 20230008119
    Abstract: A non-threaded, one-touch connection device for connecting reinforcing bars includes a pair of coupler bodies fastened together by a connector and each of the coupler bodies having a hollow portion for receiving the reinforcing bar. An inner diameter of the coupler body gradually increases from an entrance of the coupler body to an end opposite to the entrance. A lock is placed in the coupler body. The lock includes slits and wall parts partially separated by the slits. The lock further includes a breaking disc configured to break away from the lock. An elastic member is placed between the connector and the lock to apply an elastic force to move the lock toward the entrance when the reinforcing bar is fastened to the lock. The coupler body further has a checking hole to allow concrete to flow in and out.
    Type: Application
    Filed: July 8, 2021
    Publication date: January 12, 2023
    Inventor: Seung Ho CHA