Abstract: A device and a method for common type conversion of a PLC control program are disclosed. The device for common type conversion of a PLC control program according to an embodiment of the present invention comprises: a common command library construction unit for constructing a common command library by generating, using a common command generation algorithm, a common command for commands used in text-based PLC control programs having different types; and a common type conversion unit for converting an arbitrary text-based PLC control program into a common type PLC control program by using the common command library, in accordance with the arbitrary text-based PLC control program requested to be converted into a common type being able to be converted into a common type PLC control program.

Abstract: A computer-controlled slurry supplying apparatus for providing abrasive slurry to a chemical mechanical polishing (CMP) machine in a semiconductor manufacturing process preferably comprises a storage portion for accepting and storing a quantity of undiluted slurry, a mixing portion for accepting undiluted slurry from the storage portion and mixing with a diluting solution to created a diluted slurry, a supply portion for holding the diluted slurry, and at least one point-of-use mixing unit for mixing at least one chemical additive to the diluted slurry at or near a dispensing nozzle at the point of application. Each of the above portions of the slurry supplying apparatus further includes a re-circulation means for keep solutions in a mixed and agitated state. A method for using the slurry supplying apparatus comprises steps of controllably operating various valves, pumps, and sensors to maintain a desired slurry composition and flow rate.

Abstract: A conveying apparatus conveys articles used for manufacturing semiconductor devices. The conveying apparatus has a conveying rail section that includes a first rail providing a first conveying route, a second rail providing a second conveying route, and an intermediate rail structure interconnecting the first and second rails. Respective vehicles are fitted to the first and second rails so as to convey articles as supported atop the first rail or as suspended from the second rail, respectively. The conveying apparatus can be readily installed in the bay of an automatic manufacturing system, e.g., of a type for processing wafers having a diameter of 300 mm. In this case, the conveying route of the articles is unified, and space is saved, as well.

Abstract: A computer-controlled slurry supplying apparatus for providing abrasive slurry to a chemical mechanical polishing (CMP) machine in a semiconductor manufacturing process preferably comprises a storage portion for accepting and storing a quantity of undiluted slurry, a mixing portion for accepting undiluted slurry from the storage portion and mixing with a diluting solution to created a diluted slurry, a supply portion for holding the diluted slurry, and at least one point-of-use mixing unit for mixing at least one chemical additive to the diluted slurry at or near a dispensing nozzle at the point of application. Each of the above portions of the slurry supplying apparatus further includes a re-circulation means for keep solutions in a mixed and agitated state. A method for using the slurry supplying apparatus comprises steps of controllably operating various valves, pumps, and sensors to maintain a desired slurry composition and flow rate.

Abstract: A conveying apparatus conveys articles used for manufacturing semiconductor devices. The conveying apparatus has a conveying rail section that includes a first rail providing a first conveying route, a second rail providing a second conveying route, and an intermediate rail structure interconnecting the first and second rails. Respective vehicles are fitted to the first and second rails so as to convey articles as supported atop the first rail or as suspended from the second rail, respectively. The conveying apparatus can be readily installed in the bay of an automatic manufacturing system, e.g., of a type for processing wafers having a diameter of 300 mm. In this case, the conveying route of the articles is unified, and space is saved, as well.