Patents by Inventor Seung-Hun Eu

Seung-Hun Eu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same
    Patent number: 8053540
    Abstract: The present invention relates to a catalyst precursor composition for electroless plating, and more specifically, the present invention provides the catalyst precursor composition comprising (a) a reactive oligomer; (b) a reactive monomer; (c) a photoinitiator; (d) a catalyst precursor for electroless plating; and (e) a solvent, and a method of preparing the EMI shielding material with the same. The present invention provides an easy and simple method of preparing the EMI shielding material by using the catalyst precursor composition that contains a UV curable resin with good adhesion to the base material, thereby eliminating the need for pre-treating the base material with a receptive layer before electroless plating.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: November 8, 2011
    Assignee: LG Chem, Ltd.
    Inventors: Seung-Hun Eu, Jang-Hoon Lee
  • CATALYST PRECURSOR COMPOSITION FOR ELECTROLESS PLATING, AND PREPARATION METHOD OF TRANSPARENT ELECTROMAGNETIC INTERFERENCE SHIELDING MATERIAL USING THE SAME
    Publication number: 20080213506
    Abstract: The present invention relates to a catalyst precursor composition for electroless plating, and more specifically, the present invention provides the catalyst precursor composition comprising (a) a reactive oligomer; (b) a reactive monomer; (c) a photoinitiator; (d) a catalyst precursor for electroless plating; and (e) a solvent, and a method of preparing the EMI shielding material with the same. The present invention provides an easy and simple method of preparing the EMI shielding material by using the catalyst precursor composition that contains a UV curable resin with good adhesion to the base material, thereby eliminating the need for pre-treating the base material with a receptive layer before electroless plating.
    Type: Application
    Filed: April 14, 2008
    Publication date: September 4, 2008
    Applicant: LG CHEM LTD.
    Inventors: Seung-Hun EU, Jang-Hoon LEE
  • Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same
    Patent number: 7378478
    Abstract: The present invention relates to a catalyst precursor composition for electroless plating, and more specifically, the present invention provides the catalyst precursor composition comprising (a) a reactive oligomer; (b) a reactive monomer; (c) a photoinitiator; (d) a catalyst precursor for electroless plating; and (e) a solvent, and a method of preparing the EMI shielding material with the same. The present invention provides an easy and simple method of preparing the EMI shielding material by using the catalyst precursor composition that contains a UV curable resin with good adhesion to the base material, thereby eliminating the need for pre-treating the base material with a receptive layer before electroless plating.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: May 27, 2008
    Assignee: LG Chem Ltd.
    Inventors: Seung-Hun Eu, Jang-Hoon Lee
  • Catalyst precursor composition for electroless plating, and preparation method of transparent electromagnetic interference shielding material using the same
    Publication number: 20050022692
    Abstract: The present invention relates to a catalyst precursor composition for electroless plating, and more specifically, the present invention provides the catalyst precursor composition comprising (a) a reactive oligomer; (b) a reactive monomer; (c) a photoinitiator; (d) a catalyst precursor for electroless plating; and (e) a solvent, and a method of preparing the EMI shielding material with the same. The present invention provides an easy and simple method of preparing the EMI shielding material by using the catalyst precursor composition that contains a UV curable resin with good adhesion to the base material, thereby eliminating the need for pre-treating the base material with a receptive layer before electroless plating.
    Type: Application
    Filed: July 28, 2004
    Publication date: February 3, 2005
    Inventors: Seung-Hun Eu, Jang-Hoon Lee