Abstract: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed outside the body and connected to the internal electrode, in which the dielectric layer includes a plurality of dielectric crystal grains, and at least one of the plurality of dielectric crystal grains includes a core-shell structure including an inner core area and a shell area covering at least a portion of the core area, and 90% or more of the plurality of dielectric crystal grains satisfy an average size of 170.0 nm to 190.0 nm, and a maximum deviation of sizes of the dielectric crystal grains satisfies ±60.0 nm compared to an average size of the dielectric crystal grains.

Abstract: A display device according to an embodiment includes: a substrate; a transistor that is disposed on the substrate; a light emitting diode that is disposed on the substrate, and connected to the transistor; and a passivation layer that is disposed between the transistor and the light emitting diode, wherein a surface step of the passivation layer is within a range of and including 1 nm to 30 nm.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A display device may include a first electrode, a second electrode, an emission layer, an intervening layer, and a first encapsulation layer. The second electrode may overlap the first electrode. The emission layer may be disposed between the first electrode and the second electrode, may overlap the first electrode, and may include a light emitting material. The intervening layer may directly contact the second electrode, may be spaced from each of the first electrode and the emission layer, and may include a fluorine compound. A first section of the first encapsulation layer may overlap the emission layer. The intervening layer may be positioned between the second electrode and a second section of the first encapsulation layer.

Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

Abstract: An electronic device is provided that includes a front housing arranged in a front portion of the electronic device, and a bracket connected to the front housing, to which a plurality of electronic parts of the electronic device are affixed. The electronic device also includes a rear housing arranged in a rear portion of the electronic device and including at least one slider and at least one rail. Each of the at least one slider is connected to a respective rail. The at least one slider is slidable on and elastically supported by the at least one rail, without being released from the at least one rail. The rear housing is detachable from the bracket by the at least one slider.

Abstract: An electronic device is provided that includes a front housing arranged in a front portion of the electronic device, and a bracket connected to the front housing, to which a plurality of electronic parts of the electronic device are affixed. The electronic device also includes a rear housing arranged in a rear portion of the electronic device and including at least one slider and at least one rail. Each of the at least one slider is connected to a respective rail. The at least one slider is slidable on and elastically supported by the at least one rail, without being released from the at least one rail. The rear housing is detachable from the bracket by the at least one slider.