Patents by Inventor Seung-Hwan Cha

Seung-Hwan Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12239281
    Abstract: A cleaning apparatus including a vacuum cleaner and a docking station is provided. The cleaning apparatus includes a vacuum cleaner including a dust collecting chamber in which foreign substances are collected, and a docking station configured to be connected to the dust collecting chamber to remove the foreign substances collected in the dust collecting chamber. The dust collecting chamber is configured to collect foreign substances through centrifugation, and configured to be docked to the docking station, and the docking station includes a suction device configured to suction the foreign substances and air in the dust collecting chamber docked to the docking station.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: March 4, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: See Hyun Kim, In Gyu Choi, Ki Hwan Kwon, Shin Kim, Hyeon Cheol Kim, Do Kyung Lee, Hyun Ju Lee, Yun Soo Jang, Seung Ryong Cha, Jung Gyun Han
  • Patent number: 12230313
    Abstract: A memory device includes: a first memory cell mat that includes first multi-layer level sub word lines positioned over a substrate; a second memory cell mat that is laterally spaced apart from the first memory cell mat and includes second multi-layer level sub word lines; a first sub word line driver circuit that is positioned underneath the first memory cell mat; and a second sub word line driver circuit that is positioned underneath the second memory cell mat, wherein the first sub word line driver circuit is positioned underneath ends of the first multi-layer level sub word lines, and the second sub word line driver circuit is positioned underneath ends of the second multi-layer level sub word lines.
    Type: Grant
    Filed: December 18, 2023
    Date of Patent: February 18, 2025
    Assignee: SK hynix Inc.
    Inventors: Seung-Hwan Kim, Su-Ock Chung, Seon-Yong Cha
  • Publication number: 20250037758
    Abstract: A memory device includes: a substrate; a bit line which is vertically oriented from the substrate; a plate line which is vertically oriented from the substrate; and a memory cell provided with a transistor and a capacitor that are positioned in a lateral arrangement between the bit line and the plate line, wherein the transistor includes: an active layer which is laterally oriented to be parallel to the substrate between the bit line and the capacitor; and a line-shaped lower word line and a line-shaped upper word line vertically stacked with the active layer therebetween and oriented to intersect with the active layer.
    Type: Application
    Filed: October 10, 2024
    Publication date: January 30, 2025
    Inventors: Seung-Hwan KIM, Su-Ock CHUNG, Seon-Yong CHA
  • Patent number: 12205746
    Abstract: A coil component includes a body having one surface and the other surface, opposing each other, both lateral surfaces respectively connecting the one surface and the other surface and opposing each other, and both end surfaces respectively connecting the both lateral surfaces and opposing each other; a coil unit disposed in the body; a first external electrode and a second external electrode, respectively connected to the coil unit and disposed to be spaced apart from each other on the one surface of the body; and a first insulating layer covering the other surface of the body, the both lateral surfaces of the body, and the both end surfaces of the body.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: January 21, 2025
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hwan Yang, Seung Mo Lim, Tae Jun Choi, Byung Soo Kang, Yong Hui Li, Tai Yon Cho, No Il Park, Yoon Mi Cha, Boum Seock Kim, Seung Min Lee
  • Publication number: 20250010674
    Abstract: Proposed is a control arm including a first panel portion having a first assembly hole, a second panel portion having a second assembly hole and coupled to the first panel portion, a reinforced panel portion interposed between the first panel portion and the second panel portion and coupled to the first assembly hole and the second assembly hole, and a bush mounted into the reinforced panel portion.
    Type: Application
    Filed: March 22, 2024
    Publication date: January 9, 2025
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventor: Seung Hwan CHA
  • Patent number: 12122886
    Abstract: The present invention relates to: a biodegradable capsule which is a capsule having a form in which a capsule wall surrounds fragrance or oil, wherein a polymer, formed by the reaction of a fibrous polymer, a protein polymer, an aliphatic polyesterpolyol and an aliphatic crosslinking agent, constitutes the capsule wall of the capsule; and a manufacturing thereof.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: October 22, 2024
    Assignee: DAEHA MANTECH CO., LTD.
    Inventors: Hyun Kim, Gyeong-In Cho, Seung Hwan Cha, Jung-Pyo Kim, Min-Ho Jong, Dong-Yeon Yang
  • Publication number: 20220112341
    Abstract: The present invention relates to: a biodegradable capsule which is a capsule having a form in which a capsule wall surrounds fragrance or oil, wherein a polymer, formed by the reaction of a fibrous polymer, a protein polymer, an aliphatic polyesterpolyol and an aliphatic crosslinking agent, constitutes the capsule wall of the capsule; and a manufacturing thereof.
    Type: Application
    Filed: January 16, 2020
    Publication date: April 14, 2022
    Applicant: DAEHA MANTECH CO., LTD.
    Inventors: Hyun KIM, Gyeong-In CHO, Seung Hwan CHA, Jung-Pyo KIM, Min-Ho JONG, Dong-Yeon YANG
  • Patent number: 9714680
    Abstract: An assembling device for a bush may include: a bush unit mounted on a part; a connection unit of which the inside is locked and fixed to the bush unit; and a support unit coupled to the connection unit, and supporting the bush unit so as to prevent separation of the bush unit.
    Type: Grant
    Filed: September 4, 2014
    Date of Patent: July 25, 2017
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventor: Seung Hwan Cha
  • Patent number: 9604516
    Abstract: A suspension system for a vehicle that is capable of preventing a lower pad from being separated from a lower arm by elastic force of a spring. The lower pad of the suspension system for a vehicle includes an elastically deformable part made of a material deformable by elastic force of the spring, and a base part made of a material harder than the material of the elastically deformable part, and coupled to the lower arm.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: March 28, 2017
    Assignee: Hyundai Mobis Co., Ltd.
    Inventor: Seung Hwan Cha
  • Patent number: 9506517
    Abstract: A hybrid assembly of a honeycomb structure is provided. The assembly includes a steel plate capable of being mounted on a vehicle body, a steel core into which the steel plate is inserted in order for both ends of the steel plate along the longitudinal direction thereof to be protruded through the steel core, and a plastic core having an inner portion formed with a honeycomb shape into which the steel core is inserted at a central axis along a longitudinal direction thereof.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: November 29, 2016
    Assignee: Hyundai Mobis Co., Ltd.
    Inventor: Seung-Hwan Cha
  • Publication number: 20160121674
    Abstract: A suspension system for a vehicle that is capable of preventing a lower pad from being separated from a lower arm by elastic force of a spring. The lower pad of the suspension system for a vehicle includes an elastically deformable part made of a material deformable by elastic force of the spring, and a base part made of a material harder than the material of the elastically deformable part, and coupled to the lower arm.
    Type: Application
    Filed: October 23, 2015
    Publication date: May 5, 2016
    Inventor: Seung Hwan CHA
  • Publication number: 20160052357
    Abstract: A hybrid assembly of a honeycomb structure is provided. The assembly includes a steel plate capable of being mounted on a vehicle body, a steel core into which the steel plate is inserted in order for both ends of the steel plate along the longitudinal direction thereof to be protruded through the steel core, and a plastic core having an inner portion formed with a honeycomb shape into which the steel core is inserted at a central axis along a longitudinal direction thereof.
    Type: Application
    Filed: August 7, 2015
    Publication date: February 25, 2016
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventor: Seung-Hwan CHA
  • Patent number: 9217488
    Abstract: A hydro bush includes an outer pipe, an inner pipe, a rubber portion that is installed between the outer pipe and the inner pipe, and stoppers that are installed at both side ends. The hydro bush further includes a liquid chamber which is formed between the outer pipe and the rubber portion, and filled with a working fluid; and a flow path which is formed between the outer pipe and the rubber portion, and connected to the liquid chamber so as to guide the working fluid when the working fluid flows, in which the flow path includes a protruding portion which is formed to protrude inward. Accordingly, a flow distance of a working fluid flowing along the flow path may be increased without increasing a size of the hydro bush, thereby securing various dynamic characteristics.
    Type: Grant
    Filed: March 21, 2014
    Date of Patent: December 22, 2015
    Assignee: HYUNDAI MOBIS, CO., LTD.
    Inventor: Seung Hwan Cha
  • Publication number: 20150113797
    Abstract: An assembling device for a bush may include: a bush unit mounted on a part; a connection unit of which the inside is locked and fixed to the bush unit; and a support unit coupled to the connection unit, and supporting the bush unit so as to prevent separation of the bush unit.
    Type: Application
    Filed: September 4, 2014
    Publication date: April 30, 2015
    Inventor: Seung Hwan Cha
  • Publication number: 20140333018
    Abstract: A hydro bush includes an outer pipe, an inner pipe, a rubber portion that is installed between the outer pipe and the inner pipe, and stoppers that are installed at both side ends. The hydro bush further includes a liquid chamber which is formed between the outer pipe and the rubber portion, and filled with a working fluid; and a flow path which is formed between the outer pipe and the rubber portion, and connected to the liquid chamber so as to guide the working fluid when the working fluid flows, in which the flow path includes a protruding portion which is formed to protrude inward. Accordingly, a flow distance of a working fluid flowing along the flow path may be increased without increasing a size of the hydro bush, thereby securing various dynamic characteristics.
    Type: Application
    Filed: March 21, 2014
    Publication date: November 13, 2014
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventor: Seung Hwan CHA
  • Patent number: 7999262
    Abstract: A thin film transistor includes a gate electrode, a gate insulation layer on the gate electrode, source and drain electrodes formed on the gate insulation layer, a polysilicon channel layer overlapping the ohmic contact layers and on the gate insulation layer between the source and drain electrodes, ohmic contact regions over the source and drain electrodes for contacting the polysilicon channel to the source and drain electrodes, and doping layers over the source and drain electrodes.
    Type: Grant
    Filed: June 1, 2010
    Date of Patent: August 16, 2011
    Assignee: LG Display Co., Ltd.
    Inventors: Gee Sung Chae, Seung Hwan Cha
  • Publication number: 20100237353
    Abstract: A thin film transistor includes a gate electrode, a gate insulation layer on the gate electrode, source and drain electrodes formed on the gate insulation layer, a polysilicon channel layer overlapping the ohmic contact layers and on the gate insulation layer between the source and drain electrodes, ohmic contact regions over the source and drain electrodes for contacting the polysilicon channel to the source and drain electrodes, and doping layers over the source and drain electrodes.
    Type: Application
    Filed: June 1, 2010
    Publication date: September 23, 2010
    Inventors: Gee Sung CHAE, Seung Hwan CHA
  • Patent number: 7754548
    Abstract: A thin film transistor includes a gate electrode, a gate insulation layer on the gate electrode, source and drain electrodes formed on the gate insulation layer, a polysilicon channel layer overlapping the ohmic contact layers and on the gate insulation layer between the source and drain electrodes, ohmic contact regions over the source and drain electrodes for contacting the polysilicon channel to the source and drain electrodes, and doping layers over the source and drain electrodes.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: July 13, 2010
    Assignee: LG Display Co., Ltd.
    Inventors: Gee Sung Chae, Seung Hwan Cha
  • Publication number: 20070295965
    Abstract: A thin film transistor includes a gate electrode, a gate insulation layer on the gate electrode, source and drain electrodes formed on the gate insulation layer, a polysilicon channel layer overlapping the ohmic contact layers and on the gate insulation layer between the source and drain electrodes, ohmic contact regions over the source and drain electrodes for contacting the polysilicon channel to the source and drain electrodes, and doping layers over the source and drain electrodes.
    Type: Application
    Filed: May 23, 2007
    Publication date: December 27, 2007
    Applicant: LG.PHILIPS LCD CO., LTD.
    Inventors: Gee Sung Chae, Seung Hwan Cha
  • Patent number: 6806189
    Abstract: A method of silver (Ag) electroless plating on an indium tin oxide (ITO) electrode comprises preparing a substrate on which the indium tin oxide (ITO) electrode is formed, depositing tin (Sn) on the indium tin oxide (ITO) electrode, depositing silver (Ag) on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an activation solution and plating silver (Ag) on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an electroless plating solution containing magnesium ions and silver ions.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: October 19, 2004
    Assignee: LG.Philips LCD Co., Ltd.
    Inventors: Jae-Jeong Kim, Seung-Hwan Cha