Abstract: A cleaning apparatus including a vacuum cleaner and a docking station is provided. The cleaning apparatus includes a vacuum cleaner including a dust collecting chamber in which foreign substances are collected, and a docking station configured to be connected to the dust collecting chamber to remove the foreign substances collected in the dust collecting chamber. The dust collecting chamber is configured to collect foreign substances through centrifugation, and configured to be docked to the docking station, and the docking station includes a suction device configured to suction the foreign substances and air in the dust collecting chamber docked to the docking station.

Abstract: A memory device includes: a first memory cell mat that includes first multi-layer level sub word lines positioned over a substrate; a second memory cell mat that is laterally spaced apart from the first memory cell mat and includes second multi-layer level sub word lines; a first sub word line driver circuit that is positioned underneath the first memory cell mat; and a second sub word line driver circuit that is positioned underneath the second memory cell mat, wherein the first sub word line driver circuit is positioned underneath ends of the first multi-layer level sub word lines, and the second sub word line driver circuit is positioned underneath ends of the second multi-layer level sub word lines.

Abstract: A memory device includes: a substrate; a bit line which is vertically oriented from the substrate; a plate line which is vertically oriented from the substrate; and a memory cell provided with a transistor and a capacitor that are positioned in a lateral arrangement between the bit line and the plate line, wherein the transistor includes: an active layer which is laterally oriented to be parallel to the substrate between the bit line and the capacitor; and a line-shaped lower word line and a line-shaped upper word line vertically stacked with the active layer therebetween and oriented to intersect with the active layer.

Abstract: A coil component includes a body having one surface and the other surface, opposing each other, both lateral surfaces respectively connecting the one surface and the other surface and opposing each other, and both end surfaces respectively connecting the both lateral surfaces and opposing each other; a coil unit disposed in the body; a first external electrode and a second external electrode, respectively connected to the coil unit and disposed to be spaced apart from each other on the one surface of the body; and a first insulating layer covering the other surface of the body, the both lateral surfaces of the body, and the both end surfaces of the body.

Abstract: Proposed is a control arm including a first panel portion having a first assembly hole, a second panel portion having a second assembly hole and coupled to the first panel portion, a reinforced panel portion interposed between the first panel portion and the second panel portion and coupled to the first assembly hole and the second assembly hole, and a bush mounted into the reinforced panel portion.

Abstract: The present invention relates to: a biodegradable capsule which is a capsule having a form in which a capsule wall surrounds fragrance or oil, wherein a polymer, formed by the reaction of a fibrous polymer, a protein polymer, an aliphatic polyesterpolyol and an aliphatic crosslinking agent, constitutes the capsule wall of the capsule; and a manufacturing thereof.

Abstract: The present invention relates to: a biodegradable capsule which is a capsule having a form in which a capsule wall surrounds fragrance or oil, wherein a polymer, formed by the reaction of a fibrous polymer, a protein polymer, an aliphatic polyesterpolyol and an aliphatic crosslinking agent, constitutes the capsule wall of the capsule; and a manufacturing thereof.

Abstract: An assembling device for a bush may include: a bush unit mounted on a part; a connection unit of which the inside is locked and fixed to the bush unit; and a support unit coupled to the connection unit, and supporting the bush unit so as to prevent separation of the bush unit.

Abstract: A suspension system for a vehicle that is capable of preventing a lower pad from being separated from a lower arm by elastic force of a spring. The lower pad of the suspension system for a vehicle includes an elastically deformable part made of a material deformable by elastic force of the spring, and a base part made of a material harder than the material of the elastically deformable part, and coupled to the lower arm.

Abstract: A hybrid assembly of a honeycomb structure is provided. The assembly includes a steel plate capable of being mounted on a vehicle body, a steel core into which the steel plate is inserted in order for both ends of the steel plate along the longitudinal direction thereof to be protruded through the steel core, and a plastic core having an inner portion formed with a honeycomb shape into which the steel core is inserted at a central axis along a longitudinal direction thereof.

Abstract: A suspension system for a vehicle that is capable of preventing a lower pad from being separated from a lower arm by elastic force of a spring. The lower pad of the suspension system for a vehicle includes an elastically deformable part made of a material deformable by elastic force of the spring, and a base part made of a material harder than the material of the elastically deformable part, and coupled to the lower arm.

Abstract: A hybrid assembly of a honeycomb structure is provided. The assembly includes a steel plate capable of being mounted on a vehicle body, a steel core into which the steel plate is inserted in order for both ends of the steel plate along the longitudinal direction thereof to be protruded through the steel core, and a plastic core having an inner portion formed with a honeycomb shape into which the steel core is inserted at a central axis along a longitudinal direction thereof.

Abstract: A hydro bush includes an outer pipe, an inner pipe, a rubber portion that is installed between the outer pipe and the inner pipe, and stoppers that are installed at both side ends. The hydro bush further includes a liquid chamber which is formed between the outer pipe and the rubber portion, and filled with a working fluid; and a flow path which is formed between the outer pipe and the rubber portion, and connected to the liquid chamber so as to guide the working fluid when the working fluid flows, in which the flow path includes a protruding portion which is formed to protrude inward. Accordingly, a flow distance of a working fluid flowing along the flow path may be increased without increasing a size of the hydro bush, thereby securing various dynamic characteristics.

Abstract: An assembling device for a bush may include: a bush unit mounted on a part; a connection unit of which the inside is locked and fixed to the bush unit; and a support unit coupled to the connection unit, and supporting the bush unit so as to prevent separation of the bush unit.

Abstract: A hydro bush includes an outer pipe, an inner pipe, a rubber portion that is installed between the outer pipe and the inner pipe, and stoppers that are installed at both side ends. The hydro bush further includes a liquid chamber which is formed between the outer pipe and the rubber portion, and filled with a working fluid; and a flow path which is formed between the outer pipe and the rubber portion, and connected to the liquid chamber so as to guide the working fluid when the working fluid flows, in which the flow path includes a protruding portion which is formed to protrude inward. Accordingly, a flow distance of a working fluid flowing along the flow path may be increased without increasing a size of the hydro bush, thereby securing various dynamic characteristics.

Abstract: A thin film transistor includes a gate electrode, a gate insulation layer on the gate electrode, source and drain electrodes formed on the gate insulation layer, a polysilicon channel layer overlapping the ohmic contact layers and on the gate insulation layer between the source and drain electrodes, ohmic contact regions over the source and drain electrodes for contacting the polysilicon channel to the source and drain electrodes, and doping layers over the source and drain electrodes.

Abstract: A thin film transistor includes a gate electrode, a gate insulation layer on the gate electrode, source and drain electrodes formed on the gate insulation layer, a polysilicon channel layer overlapping the ohmic contact layers and on the gate insulation layer between the source and drain electrodes, ohmic contact regions over the source and drain electrodes for contacting the polysilicon channel to the source and drain electrodes, and doping layers over the source and drain electrodes.

Abstract: A thin film transistor includes a gate electrode, a gate insulation layer on the gate electrode, source and drain electrodes formed on the gate insulation layer, a polysilicon channel layer overlapping the ohmic contact layers and on the gate insulation layer between the source and drain electrodes, ohmic contact regions over the source and drain electrodes for contacting the polysilicon channel to the source and drain electrodes, and doping layers over the source and drain electrodes.

Abstract: A thin film transistor includes a gate electrode, a gate insulation layer on the gate electrode, source and drain electrodes formed on the gate insulation layer, a polysilicon channel layer overlapping the ohmic contact layers and on the gate insulation layer between the source and drain electrodes, ohmic contact regions over the source and drain electrodes for contacting the polysilicon channel to the source and drain electrodes, and doping layers over the source and drain electrodes.

Abstract: A method of silver (Ag) electroless plating on an indium tin oxide (ITO) electrode comprises preparing a substrate on which the indium tin oxide (ITO) electrode is formed, depositing tin (Sn) on the indium tin oxide (ITO) electrode, depositing silver (Ag) on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an activation solution and plating silver (Ag) on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an electroless plating solution containing magnesium ions and silver ions.