Patents by Inventor Seung Hyeon HAM

Seung Hyeon HAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113852
    Abstract: A wireless communication system, according to one embodiment of the present invention, comprises: a first communication module; and at least one second communication module wirelessly connected to the first communication module, wherein the first communication module is wirelessly connected to the second communication module to which driving power is applied from the same power source as that of the first communication module.
    Type: Application
    Filed: February 10, 2022
    Publication date: April 4, 2024
    Inventors: Chang Hoon YOO, Sung Jun BAE, Jeong Hyeon SON, Seung Taek WOO, So Yeon HAM
  • Publication number: 20240033060
    Abstract: The present invention relates to an artificial intelligence-based method for manufacturing a 3D prosthesis for tooth restoration, the method including the steps of (a) obtaining an image of arrangement of teeth including an abutment tooth and a 3D modeling image of a crown which is a prosthesis, (b) preprocessing the 3D modeling image of the abutment tooth and the 3D modeling image of the crown into a 2D image so as to establish a learning dataset, (c) performing first artificial intelligence learning by using an artificial intelligence image conversion algorithm with the abutment tooth image and the crown image having been established into the learning dataset as reference data and a crown image generated appropriately to be intubated into the abutment tooth considering a shape and a size of a peripheral tooth of the abutment tooth as a correct answer data, and (d) performing second artificial intelligence learning for extracting a 3D learning image of a crown in which a volume is assigned to the 2D learning
    Type: Application
    Filed: October 20, 2021
    Publication date: February 1, 2024
    Inventors: Hyuk Jun PARK, Sung Gyeol LIM, Ji Woong YU, Seung Hyeon HAM