Abstract: A magnet assembly includes a yoke plate disposed on a plane, and a magnetic field generator which is disposed on the yoke plate and includes magnet parts including magnet units, magnetic bodies, and non-magnetic bodies. The magnetic bodies overlap the magnet parts in a plan view. The non-magnetic bodies overlap an area between the magnet units in a plan view. The magnet assembly operates in one of a first mode and a second mode. The magnetic field generator generates a magnetic field below the magnetic bodies and the non-magnetic bodies in the first mode and does not substantially generate the magnetic field below the magnetic bodies and the non-magnetic bodies in the second mode.

Abstract: A probe head and a probe card having the same are provided. The probe head includes a plurality of guide plates each having a guide hole, wherein each of the guide plates has a shape in which a plurality of layers are stacked, and each of the guide plates includes: a first guide layer provided at a lowermost side thereof, and having a first guide hole; and a second guide layer provided at an uppermost side thereof, and having a second guide hole, wherein a side wall of the first guide hole and a side wall of the second guide hole are not provided on the same vertical line.

Abstract: A ceramic electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in the first direction and side surfaces connected to the first and second surfaces, an external electrode disposed on one of the side surfaces of the body extending onto a portion of the first surface of the body, and an insulating layer covering a surface of the external electrode and including a plurality of openings exposing the external electrode, wherein a ratio of an area of the plurality of openings to an area of the surface of the external electrode covered by the insulating layer is 20% to 70%.

Abstract: An electronic device may include a display system and an optical system that are supported by a housing. The optical system may be a catadioptric optical system having one or more lens elements. The optical system may include a wave plate stack with one or more wave plates. The display system may also include a wave plate stack with one or more wave plates. Each wave plate stack may include a positive dispersion quarter wave plate and a positive dispersion half wave plate. Each wave plate stack may include a negative dispersion quarter wave plate and a negative dispersion half wave plate. Each wave plate stack may include a biaxial quarter wave plate and a biaxial half wave plate.

Abstract: A guide member, an inspection device, and an electro-conductive contact pin for improving inspection reliability with respect to an inspection object are proposed.

Abstract: Proposed is an electro-conductive contact pin which can implement a narrow pitch between electro-conductive contact pins and prevent the electro-conductive contact pins from being short-circuited even upon contact between center portions of the electro-conductive contact pins, through a manufacturing method for an electro-conductive contact pin, the manufacturing method including a step of forming a module area including pin bodies and a support frame supporting the pin bodies through connecting portions, and a coating layer forming step of forming a coating layer on the pin bodies.

Abstract: Provided are a method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material, a unidirectionally aligned discontinuous fiber reinforcement composite material, and a sandwich structure. The method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material comprises discontinuously aligning short fibers on a polymer substrate in one direction by using an air-laid method.

Abstract: Provided is a porous single resin fiber composite material comprising: a first fibrous particle; a second fibrous particle; and a binder for binding the first fibrous particle and the second fibrous particle, wherein the first fibrous particles and the second fibrous particles are bound by the binder so as to form a random network structure including pores, the first fibrous particle is a polyester-based fiber including a first polyester-based resin, the second fibrous particle is a polyester-based fiber including a second polyester-based resin, the binder includes a third polyester-based resin, the first fibrous particle has an elongation rate higher than that of the second fibrous particle, and the melting point of the second polyester-based resin is higher than the melting point of the third polyester-based resin.

Abstract: Provided are a method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material, a unidirectionally aligned discontinuous fiber reinforcement composite material, and a sandwich structure. The method for preparing a unidirectionally aligned discontinuous fiber reinforcement composite material comprises discontinuously aligning short fibers on a polymer substrate in one direction by using an air-laid method.

Abstract: Provided is a porous single resin fiber composite material comprising: a first fibrous particle; a second fibrous particle; and a binder for binding the first fibrous particle and the second fibrous particle, wherein the first fibrous particles and the second fibrous particles are bound by the binder so as to form a random network structure including pores, the first fibrous particle is a polyester-based fiber including a first polyester-based resin, the second fibrous particle is a polyester-based fiber including a second polyester-based resin, the binder includes a third polyester-based resin, the first fibrous particle has an elongation rate higher than that of the second fibrous particle, and the melting point of the second polyester-based resin is higher than the melting point of the third polyester-based resin.

Abstract: A thinner composition including an acetate-based compound in an amount in a range of about 30 weight percent to about 70 weight percent, a lactate-based compound in an amount in a range of about 1 weight percent to about 20 weight percent, a propionate-based compound in an amount in a range of about 30 weight percent to about 60 weight percent, and an ether-based additive in an amount in a range of about 10 ppm to about 500 ppm, based on a total amount of the composition.

Abstract: A thinner composition including an acetate-based compound in an amount in a range of about 30 weight percent to about 70 weight percent, a lactate-based compound in an amount in a range of about 1 weight percent to about 20 weight percent, a propionate-based compound in an amount in a range of about 30 weight percent to about 60 weight percent, and an ether-based additive in an amount in a range of about 10 ppm to about 500 ppm, based on a total amount of the composition.

Abstract: In a thinner composition and a method of forming a photosensitive film, the thinner composition includes about 50 to about 90% by weight of propylene glycol monomethyl ether acetate, about 1 to about 20% by weight of propylene glycol monomethyl ether, about 1 to about 10% by weight of ?-butyrolactone, and about 1 to about 20% by weight of n-butyl acetate. The thinner composition may have a proper volatility and an improved ability to dissolve various types of photosensitive materials, and thus the thinner composition may be usefully employed in an edge bead rinse process, a rework process or a pre-wetting process.

Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.

Abstract: In a thinner composition and a method of forming a photosensitive film, the thinner composition includes about 50 to about 90% by weight of propylene glycol monomethyl ether acetate, about 1 to about 20% by weight of propylene glycol monomethyl ether, about 1 to about 10% by weight of ?-butyrolactone, and about 1 to about 20% by weight of n-butyl acetate. The thinner composition may have a proper volatility and an improved ability to dissolve various types of photosensitive materials, and thus the thinner composition may be usefully employed in an edge bead rinse process, a rework process or a pre-wetting process.

Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.

Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.

Abstract: A film (e.g., silicon polymer film, photoresist film) may be removed by applying a composition including a quaternary ammonium hydroxide, a sulfoxide compound, a dialkylene glycol alkyl ether, and/or water to the film. A silicon polymer film (e.g., hard mask layer) and a photoresist film, for example, may be removed by the composition using an in-situ process. Additionally, the composition may remove the silicon polymer film and the photoresist film while preventing or reducing damage to an underlying layer and the generation of particle-type etch residue.

Abstract: A metal-containing pattern structure is formed on a semiconductor substrate, and a cleaning composition is applied to the semiconductor substrate. The cleaning composition includes, based on a total weight of the cleaning composition, about 78 wt % to about 99.98 wt % of an acidic aqueous solution, about 0.01 wt % to about 11 wt % of a first chelating agent, and about 0.01 wt % to about 11 wt % of a second chelating agent. The metal-containing pattern structure includes an exposed first surface portion and a second surface portion covered with a polymer. Application of the cleaning solution forms a first corrosion-inhibition layer on the first surface portion of the metal-containing pattern structure, and removes the polymer from the second surface portion of the metal-containing pattern structure.

Abstract: A thinner composition includes propylene glycol ether acetate, methyl 2-hydroxy-2-methyl propionate, and an ester compound such as ethyl lactate, ethyl 3-ethoxy propionate or a mixture thereof.