Patents by Inventor Seung-Jae Go

Seung-Jae Go has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of and apparatus for detecting a defect at the outer peripheral edge of a wafer, and cleaning equipment comprising the apparatus
    Patent number: 6867855
    Abstract: Apparatus for detecting a defect in the outer peripheral edge of a wafer includes a rotary mechanism by which the wafer can be rotated, a wafer edge contact device, and a controller. The wafer edge contact device includes a string that is pressed against the edge of the wafer. One end of the string is fixed in place, and a sensor is operatively associated with the other end of the string so as to sense movement of the other end of the string. This other end of the string will be pulled by a defect at the outer peripheral edge of the wafer when the wafer is rotated. Thus, a defective edge of the wafer can be detected before/after the wafer is processed. Accordingly, the wafer can be prevented from being further damaged, wafer particles are prevented from polluting the fabricating equipment, and the operating efficiency and productivity of the fabricating equipment are enhanced.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: March 15, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-Jae Go, In-Suk Lee, Tae-Jun Kim
  • Method of and apparatus for detecting a defect at the outer peripheral edge of a wafer, and cleaning equipment comprising the apparatus
    Publication number: 20040004713
    Abstract: Apparatus for detecting a defect in the outer peripheral edge of a wafer includes a rotary mechanism by which the wafer can be rotated, a wafer edge contact device, and a controller. The wafer edge contact device includes a string that is pressed against the edge of the wafer. One end of the string is fixed in place, and a sensor is operatively associated with the other end of the string so as to sense movement of the other end of the string. This other end of the string will be pulled by a defect at the outer peripheral edge of the wafer when the wafer is rotated. Thus, a defective edge of the wafer can be detected before/after the wafer is processed. Accordingly, the wafer can be prevented from being further damaged, wafer particles are prevented from polluting the fabricating equipment, and the operating efficiency and productivity of the fabricating equipment are enhanced.
    Type: Application
    Filed: February 3, 2003
    Publication date: January 8, 2004
    Inventors: Seung-Jae Go, In-Suk Lee, Tae-Jun Kim