Patents by Inventor Seung Jin IN

Seung Jin IN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130111
    Abstract: A semiconductor device may comprise: a plurality of lower electrodes which are on a substrate; a first electrode support which is between adjacent lower electrodes and comprises a metallic material; a dielectric layer which is on the lower electrodes and the first electrode support to extend along profiles of the first electrode support and each of the lower electrodes; and an upper electrode which is on the dielectric layer.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yoon Young CHOI, Seung Jin KIM, Byung-Hyun LEE, Sang Jae PARK
  • Publication number: 20240128310
    Abstract: A method of manufacturing a semiconductor device includes sequentially stacking a mold layer and a supporter layer on a substrate, forming a plurality of capacitor holes passing through the mold layer and supporter layer, forming a plurality of lower electrodes filling the capacitor holes, forming a supporter mask pattern having a plurality of mask holes on the supporter layer and the lower electrodes, and forming a plurality of supporter holes by patterning the supporter layer. Each of the plurality of lower electrodes has a pillar shape, and each of the mask holes is between four adjacent lower electrodes and has a circular shape.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 18, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung Jin KIM, Sung Soo YIM
  • Patent number: 11957495
    Abstract: An X-ray imaging apparatus includes an imaging device configured to capture a camera image of a target; a controller configured to stitch a plurality of X-ray images of respective divided regions of the target to generate one X-ray image of the target; and a display configured to display a settings window that provides a GUI for receiving a setting of an X-ray irradiation condition for the respective divided regions, and display the camera image in which positions of the respective divided regions are displayed.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho Jun Lee, Ju Hwan Kim, Se Hui Kim, Seung-Hoon Kim, Si Won Park, Phill Gu Jung, Duhgoon Lee, Myung Jin Chung, Do Hyeong Hwang, Sung Jin Park
  • Patent number: 11962208
    Abstract: Proposed is an air gap adjustment apparatus. The apparatus is for enabling an air gap between the inner surface of a stator and the outer surface of a rotor, which are installed in an inner space of a housing, to be uniform overall. A plurality of fastening holes are formed so as to surround a shaft through hole of an end plate constituting the housing. A fastener, which has passed through a bearing housing of a bearing, is fastened to each fastening hole so as to mount the bearing to the end plate. An adjusting member body of an adjusting member, which has passed through the bearing housing, is positioned in an adjusting member seating part which is formed at the entrance of each fastening hole. The adjusting member rotates about the adjusting member body so that a head part may adjust the position of the bearing.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: April 16, 2024
    Assignee: HYOSUNG HEAVY INDUSTRIES CORPORATION
    Inventors: Chul Jun Park, Sang Deok Kim, Seung Ki Kim, Yoon Zong Kim, Kyo Ho Lee, Kwang Jin Kim, Joo Seob Kim, Bit Na Oh
  • Publication number: 20240119949
    Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 11, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Jeong Il SEO, Seung Kwon BEACK, Dae Young JANG, Kyeong Ok KANG, Tae Jin PARK, Yong Ju LEE, Keun Woo CHOI, Jin Woong KIM
  • Publication number: 20240115943
    Abstract: A non-limiting example game system includes a main body apparatus, and the main body apparatus executes a virtual game, and a game screen is displayed on a display. A player character, a first fellow character and background objects such as the ground, trees and rocks are displayed in the game screen. A judgment object of a rectangular parallelepiped is set to the player character, and it is judged whether line segments each connecting each of multiple judgment points that are set to vertices of the rectangular parallelepiped to a position of a virtual camera collide with the background object, respectively. When the number of the line segments that collide with the background object is two or more, it is judged that a silhouette of the player character is to be displayed.
    Type: Application
    Filed: September 7, 2023
    Publication date: April 11, 2024
    Inventors: Yuki EN, Jun Seung JIN
  • Publication number: 20240120177
    Abstract: A substrate processing method is provided. The substrate processing method comprises loading a substrate onto a substrate support inside a chamber, forming a plasma inside the chamber, providing a first DC pulse signal to an electromagnet that generates a magnetic field inside the chamber and processing the substrate with the plasma, wherein the first DC pulse signal is repeated at a first period including a first section and a second section subsequent to the first section, the first DC pulse signal has a first level during the first section, and the first DC pulse signal has a second level different from the first level during the second section.
    Type: Application
    Filed: September 19, 2023
    Publication date: April 11, 2024
    Inventors: Ji Mo LEE, Dong Hyeon NA, Myeong Soo SHIN, Woong Jin CHEON, Kyung-Sun KIM, Jae Bin KIM, Tae-Hwa KIM, Seung Bo SHIM
  • Publication number: 20240119948
    Abstract: Provided is an encoding apparatus for integrally encoding and decoding a speech signal and a audio signal, and may include: an input signal analyzer to analyze a characteristic of an input signal; a stereo encoder to down mix the input signal to a mono signal when the input signal is a stereo signal, and to extract stereo sound image information; a frequency band expander to expand a frequency band of the input signal; a sampling rate converter to convert a sampling rate; a speech signal encoder to encode the input signal using a speech encoding module when the input signal is a speech characteristics signal; a audio signal encoder to encode the input signal using a audio encoding module when the input signal is a audio characteristic signal; and a bitstream generator to generate a bitstream.
    Type: Application
    Filed: June 21, 2023
    Publication date: April 11, 2024
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Kwangwoon University Industry-Academic Collaboration Foundation
    Inventors: Tae Jin LEE, Seung-Kwon BAEK, Min Je KIM, Dae Young JANG, Jeongil SEO, Kyeongok KANG, Jin-Woo HONG, Hochong PARK, Young-Cheol PARK
  • Publication number: 20240120262
    Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
  • Publication number: 20240114778
    Abstract: The present disclosure relates to an organic electroluminescent compound, a plurality of host materials, and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure or by comprising a specific combination of compounds according to the present disclosure as a plurality of host materials, it is possible to produce an organic electroluminescent device having improved driving voltage, luminous efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.
    Type: Application
    Filed: August 14, 2023
    Publication date: April 4, 2024
    Inventors: So-Young JUNG, Hyo-Nim SHIN, Seung-Hyun YOON, Hyun-Ju KANG, Ye-Jin JEON, Tae-Jun HAN, Mi-Ja LEE, Dong-Gil KIM, Sang-Hee CHO
  • Patent number: 11948808
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: April 2, 2024
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
  • Publication number: 20240101369
    Abstract: An apparatus for supplying food ingredients according to the present disclosure includes a food ingredient lifting part configured to separate and move upward a food ingredient stack from a food ingredient cassette on which food ingredients including a plurality of stacked food ingredients are seated, a food ingredient separation part configured to suck and move upward a single sheet of a food ingredient from the food ingredient stack moved upward by the food ingredient lifting part, and a horizontal movement part configured to transfer forward the single sheet of the food ingredient moved upward by the food ingredient separation part.
    Type: Application
    Filed: December 28, 2021
    Publication date: March 28, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Duk Jin CHANG, Min Soo LIM, Seung Yong KIM, Yong Ho JEON, Sang Oh KIM, Myoung Il KWAK, Jong Hwa LEE
  • Publication number: 20240106441
    Abstract: A phase locked loop circuit and a semiconductor device are provided. The phased locked loop circuit includes a reference current generator configured to generate a summed compensation current in which at least one of a process change, a temperature change or a power supply voltage change are compensated and output the summed compensation current as a reference current, a current digital-to-analog converter configured to convert the reference current into a control current in accordance with a digital code and a voltage control oscillator configured to generate a signal based on the control current, wherein the summed compensation current is based on weighted-averaging a first type compensation current and a second type compensation current in response to at least one of the process change, the temperature change or the power supply voltage change.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 28, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kyung Min LEE, Gyu Sik KIM, Seung Jin KIM, Jae Hong JUNG
  • Publication number: 20240101149
    Abstract: A method of automatically detecting a dynamic object recognition error in an autonomous vehicle is provided. The method includes parsing sensor data obtained by frame units from a sensor device equipped in an autonomous vehicle to generate raw data by using a parser, analyzing the raw data to output a dynamic object detection result by using a dynamic object recognition model, determining that detection of a dynamic object recognition error succeeds by using an error detector when the dynamic object detection result satisfies an error detection condition, and storing the raw data and the dynamic object detection result by using a non-volatile memory when the detection of the dynamic object recognition error succeeds.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 28, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Dong-Jin LEE, Kyoung-Wook MIN, Jeong-Woo LEE, Jeong Dan CHOI, Seung Jun HAN
  • Publication number: 20240106551
    Abstract: A radio frequency (RF) test device such as a spectrum analyzer may include an RF attenuator to attenuate a received RF signal; a mixer to down-convert the attenuated RF signal; an IF attenuator to attenuate the down-converted signal; an analog-to-digital converter (ADC) to digitize the attenuated, down-converted signal; and a processor, which may select attenuation values for one or more of the RF attenuator and the IF attenuator based on an error magnitude vector (EVM) analysis, an RF signal type, and/or a signal level at an input of the ADC. The processor may use a look-up table for the selection. Initial attenuation values may be selected based on an expected RF signal type, RF signal frequency, and/or RF signal bandwidth. The attenuation values may also be selected in an iterative manner stepping the attenuation values up or down.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Applicant: VIAVI SOLUTIONS INC.
    Inventors: Bon-Jin KU, Seung-Gon HONG, Chang-Hyun PARK
  • Publication number: 20240105194
    Abstract: Disclosed is an LPC residual signal encoding/decoding apparatus of an MDCT based unified voice and audio encoding device. The LPC residual signal encoding apparatus analyzes a property of an input signal, selects an encoding method of an LPC filtered signal, and encode the LPC residual signal based on one of a real filterbank, a complex filterbank, and an algebraic code excited linear prediction (ACELP).
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seung Kwon BEACK, Tae Jin LEE, Min Je KIM, Kyeongok KANG, Dae Young JANG, Jin Woo HONG, Jeongil SEO, Chieteuk AHN, Hochong PARK, Young-Cheol PARK
  • Publication number: 20240099354
    Abstract: A system for manufacturing edible food products according to the present disclosure includes a first food ingredient supply apparatus configured to separate a single sheet of a first food ingredient from a first food ingredient stack including a plurality of stacked first food ingredients and supply the single sheet of first food ingredient, a second food ingredient supply apparatus configured to separate a single sheet of a second food ingredient from a second food ingredient stack including a plurality of stacked second food ingredients and supply the single sheet of second food ingredient, and a pressing device configured to form an edible food product by pressing a semi-finished product formed by seating the supplied single sheet of the first food ingredient on the supplied single sheet of the second food ingredient.
    Type: Application
    Filed: December 28, 2021
    Publication date: March 28, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Duk Jin CHANG, Min Soo LIM, Seung Yong KIM, Yong Ho JEON, Sang Oh KIM, Myoung Il KWAK, Jong Hwa LEE
  • Publication number: 20240105963
    Abstract: A method for manufacturing a gas diffusion layer for a fuel cell wherein carbon nanotubes are impregnated into Korean paper, thereby enhancing electroconductivity, and a gas diffusion layer manufactured thereby. The method for manufacturing a gas diffusion layer for a fuel cell which is to manufacture a gas diffusion layer as a constituent member of a unit cell in a fuel cell, includes a support preparation step of preparing a support with Korean paper; a dispersion preparation step of dispersing a carbon substance in a solvent to form a dispersion, a coating step of coating the support with the dispersion, and a thermal treatment step of thermally treating the dispersion-coated support to fix the carbon substance to the support.
    Type: Application
    Filed: March 6, 2023
    Publication date: March 28, 2024
    Inventors: Seung Tak Noh, Ji Han Lee, In Seok Lee, Jae Man Park, Won Jong Choi, Choong Hee Kim, Seong Hwang Kim, Jong Hoon Lee, Soo Jin Park, Seul Yi Lee
  • Patent number: 11942045
    Abstract: A display device includes a display panel including a plurality of pixels, a data driver configured to provide data voltages to the pixels, and a gate driver configured to provide gate signals to the pixels. The display device also includes a controller configured to control the data driver and the gate driver, and to control the magnitude of a sensing initialization voltage applied to the pixels based on a frame rate value when operating in a variable frame mode.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: March 26, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Tae Seok Ha, Koung Soo Kim, Kyu Jin Park, Sung Jae Park, Seung Woon Shin, Woon Rok Jang
  • Patent number: 11942427
    Abstract: A semiconductor device includes a first interlayer insulating film disposed on a substrate and having a first trench. A first lower conductive pattern fills the first trench and includes first and second valley areas that are spaced apart from each other in a first direction parallel to an upper surface of the substrate. The first and second valley areas are recessed toward the substrate. A second interlayer insulating film is disposed on the first interlayer insulating film and includes a second trench that exposes at least a portion of the first lower conductive pattern. An upper conductive pattern fills the second trench and includes an upper barrier film and an upper filling film disposed on the upper barrier film. The upper conductive pattern at least partially fills the first valley area.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: March 26, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Yong Yoo, Jong Jin Lee, Rak Hwan Kim, Eun-Ji Jung, Won Hyuk Hong