Abstract: A picker for a module IC handler includes a plurality of grippers. Each gripper includes first and second jaws, and one or more cylinders or other actuators for driving the first and second jaws. Each gripper also includes a damping device that damps movements of the jaws to reduce an impact that can occur as the jaws grip a module IC. The grippers may also include one or more sensors for sensing when the jaws have grasped a module IC, or for sensing the position of the gripper relative to the module IC.

Abstract: A picker for a module IC handler includes a plurality of grippers. Each gripper includes first and second jaws, and one or more cylinders or other actuators for driving the first and second jaws. Each gripper also includes a damping device that damps movements of the jaws to reduce an impact that can occur as the jaws grip a module IC. The grippers may also include one or more sensors for sensing when the jaws have grasped a module IC, or for sensing the position of the gripper relative to the module IC.

Abstract: An apparatus for adjusting a pitch of a picker using a single actuator is provided. The apparatus includes a picker base, a plurality of pickers adapted for varying the pitch of the pickers by use of a linear guide device provided at one side of the picker base. The apparatus includes an actuator for driving the plurality of pickers, and a bevel gear unit coupled to the actuator by upper and lower racks for transmitting the driving force to the plurality of pickers.

Abstract: A gripper for the picking apparatus of a module IC handler including a gripper body, first to third supports vertically formed at a lower part of the gripper body, a cylinder for driving a jaw located between first and second supports and second and third supports, a pair of jaws movably connected at a lower part of the cylinder, for picking the module IC, a damping mechanism for reducing an impact occurred upon picking the module IC by the jaw, and a module IC sensor for sensing the module IC upon moving the jaw. The present invention reduces damage of the module ICs with the damping mechanism upon picking the module ICs. Also, the gripper easily and exactly grips the module ICs, thus accomplishing the working performance.