Patents by Inventor Seung Kae Moon

Seung Kae Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Acoustic sensor and method of manufacturing the same
    Patent number: 8374364
    Abstract: An acoustic sensor lengthens the portion of the beam portion not fixed with the anchor without lowering the strength of the beam portion and the supporting strength of the diaphragm. On an upper surface of a silicon substrate, a beam portion made of polysilicon is formed through a second sacrifice layer made of silicon dioxide film on an extended portion of a first sacrifice layer made of polysilicon. The extended portion is formed under a region excluding a distal end of the beam portion. The extended portion is removed by etching from a back chamber arranged in the silicon substrate to form a hollow portion in a region excluding the distal end of the lower surface of the beam portion, and then the second sacrifice layer is removed by etching. The second sacrifice layer remaining on the lower surface of the distal end of the beam portion forms an anchor.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: February 12, 2013
    Assignee: OMRON Corporation
    Inventors: Takashi Kasai, Yoshitaka Tsurukame, Seung Kae Moon, Shinichi Terasaka
  • ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110266640
    Abstract: An acoustic sensor lengthens the portion of the beam portion not fixed with the anchor without lowering the strength of the beam portion and the supporting strength of the diaphragm. On an upper surface of a silicon substrate, a beam portion made of polysilicon is formed through a second sacrifice layer made of silicon dioxide film on an extended portion of a first sacrifice layer made of polysilicon. The extended portion is formed under a region excluding a distal end of the beam portion. The extended portion is removed by etching from a back chamber arranged in the silicon substrate to form a hollow portion in a region excluding the distal end of the lower surface of the beam portion, and then the second sacrifice layer is removed by etching. The second sacrifice layer remaining on the lower surface of the distal end of the beam portion forms an anchor.
    Type: Application
    Filed: April 28, 2011
    Publication date: November 3, 2011
    Applicant: OMRON CORPORATION
    Inventors: Takashi Kasai, Yoshitaka Tsurukame, Seung Kae Moon, Shinichi Terasaka