Patents by Inventor Seung-Keun Kim

Seung-Keun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11951890
    Abstract: Proposed are a seat side bolster apparatus and a control method thereof. The seat side bolster apparatus of the disclosure includes a driving unit, which is provided under a foam pad of a seat cushion, is moved upwards and downwards by operation of an actuator, and presses the foam pad upwards when moving upwards, and a covering bracket, which is connected to the driving unit so as to be moved upwards and downwards together with the driving unit and to which an end of a covering enveloping the foam pad of the seat cushion is fixed.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: April 9, 2024
    Assignee: HYUNDAI TRANSYS INCORPORATED
    Inventors: Jae Keun Park, Do Hyun Kim, Sung Hyun Jo, Seung Joon Lee, Jae Sang Lim
  • Patent number: 11945744
    Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: April 2, 2024
    Assignees: SAMSUNG ENGINEERING CO., LTD., SAMSUNG ELECTRONICS CO., LTD
    Inventors: Seok Hwan Hong, Dae Soo Park, Seung Joon Chung, Yong Xun Jin, Jae Hyung Park, Jae Hoon Choi, Jae Dong Hwang, Jong Keun Yi, Su Hyoung Cho, Kyu Won Hwang, June Yurl Hur, Je Hun Kim, Ji Won Chun
  • Publication number: 20240088432
    Abstract: An embodiment sulfur dioxide-based inorganic electrolyte is provided in which the sulfur dioxide-based inorganic electrolyte is represented by a chemical formula M·(A1·Cl(4-x)Fx)z·ySO2. In this formula, M is a first element selected from the group consisting of Li, Na, K, Ca, and Mg, A1 is a second element selected from the group consisting of Al, Fe, Ga, and Cu, x satisfies a first equation 0?x?4, y satisfies a second equation 0?y?6, and z satisfies a third equation 1?z?2.
    Type: Application
    Filed: April 12, 2023
    Publication date: March 14, 2024
    Inventors: Kyu Ju Kwak, Won Keun Kim, Eun Ji Kwon, Samuel Seo, Yeon Jong Oh, Kyoung Han Ryu, Dong Hyun Lee, Han Su Kim, Ji Whan Lee, Seong Hoon Choi, Seung Do Mun
  • Publication number: 20240085791
    Abstract: The colored photosensitive resin composition of the present invention maintains excellent resolution, visibility, and the like while it has excellent reflectance RSCI measured by the SCI (specular component included) method, reflectance RSCE measured by the SCE (specular component excluded) method, and the ratio between them (RSCE/RSCI), and has a uniform film thickness in an appropriate range. Thus, it can be formed into a multilayer cured film that simultaneously satisfies such physical properties as a high reflectance and a high light-shielding property. In addition, when a cured film is formed from the composition, it is possible to form a pattern on a multilayer film in a single development process. Thus, it can be advantageously used for a quantum dot display device.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Seung-Keun KIM, Kyung-Jae PARK
  • Patent number: 11493847
    Abstract: The present invention relates to a structure for a quantum dot barrier rib and a process for preparing the same. The structure for a quantum dot barrier rib of the present invention comprises a cured film having a uniform film thickness and an appropriate range of film thickness. Here, the reflectance RSCI measured by the SCI (specular component included) method and the reflectance RSCE measured by the SCE (specular component excluded) method are reduced, and the ratio between them (RSCE/RSCI) is appropriately adjusted, so that it is possible to satisfy such characteristics as high light-shielding property and low reflectance at the same time while the resolution and pattern characteristics are maintained to be excellent. In addition, when the structure for a quantum dot barrier rib is prepared, it is possible to form a multilayer pattern having a uniform film thickness suitable for the quantum dot barrier ribs in a single development process. Thus, it can be advantageously used for a quantum dot display.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: November 8, 2022
    Inventors: Seung-Keun Kim, Hyung-Tak Jeon, Kyu Cheol Lee, Kyung-Jae Park, Seung-Kyu Song
  • Publication number: 20220204671
    Abstract: The present invention relates to a fluorinated acrylate-based copolymer and to a photosensitive resin composition comprising the same. The copolymer can have excellent water repellency even with a relatively low content of fluorine by introducing a non-polar ring-containing unit, so that it can prevent coating imbalance and decreases in the pattern strength that may occur when the fluorine content is high.
    Type: Application
    Filed: December 6, 2021
    Publication date: June 30, 2022
    Inventors: Kyung-Jae Park, Seung-Keun Kim, Kyu-Cheol Lee
  • Publication number: 20220163887
    Abstract: The colored photosensitive resin composition of the present invention maintains excellent resolution, visibility, and the like while it has excellent reflectance RSCI measured by the SCI (specular component included) method, reflectance RSCE measured by the SCE (specular component excluded) method, and the ratio between them (RSCE/RSCI), and has a uniform film thickness in an appropriate range. Thus, it can be formed into a multilayer cured film that simultaneously satisfies such physical properties as a high reflectance and a high light-shielding property. In addition, when a cured film is formed from the composition, it is possible to form a pattern on a multilayer film in a single development process. Thus, it can be advantageously used for a quantum dot display device.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 26, 2022
    Inventors: Seung-Keun KIM, Kyung-Jae Park
  • Publication number: 20220100090
    Abstract: The present invention relates to a colored photosensitive resin composition and to a light-shielding black matrix prepared therefrom. The colored photosensitive resin composition of the present invention is capable of providing a cured film that satisfies such characteristics as high light-shielding property and low reflectance at the same time by more effectively reducing the total reflectance, which is a smaller-the-better characteristic that should be satisfied as a light-shielding black matrix, while the optical density, resolution, leveling characteristics, visibility, and the like are maintained to be excellent. Thus, the light-shielding black matrix prepared from the composition can be advantageously used in liquid crystal displays and quantum dot displays.
    Type: Application
    Filed: December 13, 2021
    Publication date: March 31, 2022
    Inventors: Seung-Keun KIM, Kyu cheol LEE
  • Publication number: 20210191259
    Abstract: The colored photosensitive resin composition of the present invention comprises a multifunctional thiol compound and/or a compound containing a double bond and a hydroxyl group, whereby it can sufficiently form a cured film even at low temperatures. In addition, the photosensitive resin composition of the present invention has a fast development speed and excellent resolution and chemical resistance.
    Type: Application
    Filed: December 11, 2020
    Publication date: June 24, 2021
    Inventors: Hyung Tak Jeon, Kyu Cheol Lee, Seung-Keun Kim, Seung-Kyu Song
  • Publication number: 20200371436
    Abstract: The present invention relates to a structure for a quantum dot barrier rib and a process for preparing the same. The structure for a quantum dot barrier rib of the present invention comprises a cured film having a uniform film thickness and an appropriate range of film thickness. Here, the reflectance RSCI measured by the SCI (specular component included) method and the reflectance RSCE measured by the SCE (specular component excluded) method are reduced, and the ratio between them (RSCE/RSCI) is appropriately adjusted, so that it is possible to satisfy such characteristics as high light-shielding property and low reflectance at the same time while the resolution and pattern characteristics are maintained to be excellent. In addition, when the structure for a quantum dot barrier rib is prepared, it is possible to form a multilayer pattern having a uniform film thickness suitable for the quantum dot barrier ribs in a single development process. Thus, it can be advantageously used for a quantum dot display.
    Type: Application
    Filed: May 20, 2020
    Publication date: November 26, 2020
    Inventors: Seung-Keun KIM, Hyung-Tak JEON, Kyu Cheol LEE, Kyung-Jae PARK, Seung-Kyu SONG
  • Publication number: 20200201180
    Abstract: The present invention relates to a colored photosensitive resin composition and to a light-shielding black matrix prepared therefrom. The colored photosensitive resin composition of the present invention is capable of providing a cured film that satisfies such characteristics as high light-shielding property and low reflectance at the same time by more effectively reducing the total reflectance, which is a smaller-the-better characteristic that should be satisfied as a light-shielding black matrix, while the optical density, resolution, leveling characteristics, visibility, and the like are maintained to be excellent. Thus, the light-shielding black matrix prepared from the composition can be advantageously used in liquid crystal displays and quantum dot displays.
    Type: Application
    Filed: December 11, 2019
    Publication date: June 25, 2020
    Inventors: Seung-Keun KIM, Kyu cheol Lee
  • Publication number: 20180335695
    Abstract: Disclosed herein are a photosensitive resin composition and an organic insulating film prepared therefrom. By optimizing the weight average molecular weight of an alkali-soluble resin and the amount of each component in the photosensitive resin composition, a coated film obtained therefrom may have high planarity property and patterns with high resolution. Accordingly, the photosensitive resin composition may be used as a material for an organic insulating film simultaneously functioning as white pixels in a liquid crystal display.
    Type: Application
    Filed: October 4, 2016
    Publication date: November 22, 2018
    Inventors: Yu-Jin Chae, Ju-Young Jung, Seung-Ho Kwon, Jung-Hwa Lee, Seung-Keun Kim
  • Publication number: 20180253004
    Abstract: Disclosed herein are a photosensitive resin composition and an organic insulating film prepared therefrom. By optimizing the weight average molecular weight of a copolymer, and using a specific solvent in the photosensitive resin composition, a coated film obtained therefrom may have high planarity property and patterns with high resolution. Accordingly, the photosensitive resin composition may be used as a material for an organic insulating film simultaneously functioning as white pixels.
    Type: Application
    Filed: August 31, 2016
    Publication date: September 6, 2018
    Inventors: Jung-Hwa Lee, Ju-Young Jung, Seung-Ho Kwon, Seung-Keun Kim, Yu-Jin Chae
  • Patent number: 8198711
    Abstract: A lead frame includes a plurality of leads electrically connected to a semiconductor chip and a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads. An adhesive layer is disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads. At least one line electrically connects the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: June 12, 2012
    Assignee: LG Micron Ltd.
    Inventors: Ki-Bum Sung, Jae-Hyun Ahn, Seung-Sue Kang, Seung-Keun Kim
  • Patent number: 8072054
    Abstract: A lead frame includes a plurality of leads electrically connected to a semiconductor chip and a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads. An adhesive layer is disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads. At least one line electrically connects the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: December 6, 2011
    Assignee: LG Micron Ltd.
    Inventors: Ki-Bum Sung, Jae-Hyun Ahn, Seung-Sue Kang, Seung-Keun Kim
  • Publication number: 20100219520
    Abstract: A lead frame includes a plurality of leads electrically connected to a semiconductor chip and a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads. An adhesive layer is disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads. At least one line electrically connects the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability.
    Type: Application
    Filed: May 14, 2010
    Publication date: September 2, 2010
    Inventors: Ki-Bum Sung, Jae-Hyun Ahn, Seung-Sue Kang, Seung-Keun Kim
  • Publication number: 20100219515
    Abstract: A lead frame includes a plurality of leads electrically connected to a semiconductor chip and a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads. An adhesive layer is disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads. At least one line electrically connects the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability.
    Type: Application
    Filed: May 14, 2010
    Publication date: September 2, 2010
    Inventors: Ki-Bum Sung, Jae-Hyun Ahn, Seung-Sue Kang, Seung-Keun Kim
  • Publication number: 20100151389
    Abstract: Disclosed is a photosensitive resin composition suitable for forming barrier ribs for LCD pixels during a process for fabricating an LCD using an ink jet printing step. Also disclosed is a method of forming barrier ribs for LCD pixels using such photosensitive resin composition.
    Type: Application
    Filed: September 22, 2009
    Publication date: June 17, 2010
    Applicant: Rohm and Haas Electronic Materials Korea Ltd.
    Inventors: Chun Geun Park, Moo Young Lee, Seok Han, Seung Keun Kim, In Kyung Sung, Hag Ju Lee
  • Publication number: 20080157306
    Abstract: A lead frame includes a plurality of leads electrically connected to a semiconductor chip and a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads. An adhesive layer is disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads. At least one line electrically connects the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability.
    Type: Application
    Filed: February 23, 2006
    Publication date: July 3, 2008
    Inventors: Ki-Bum Sung, Jae-Hyun Ahn, Seung-Sue Kang, Seung-Keun Kim