Patents by Inventor Seung Kim

Seung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12252429
    Abstract: An apparatus for molding a window, the apparatus includes: a first molding part; a jig disposed below the first molding part, the jig including a bottom surface and a plurality of side surfaces configured to support and seat a work piece to be processed into a window; and an second molding part disposed on the bottom surface, wherein the second molding part includes: a lower surface adjacent to the bottom surface; an upper surface facing the lower surface; a first cavity having a first curved surface generally concave in a direction facing the lower surface; a plurality of second cavities extending from the first cavity, the plurality of second-cavities having second curved surfaces; and a plurality of movable molds disposed on the second-cavities supported for movement along the second curved surfaces, respectively.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: March 18, 2025
    Assignees: SAMSUNG DISPLAY CO., LTD., INNOWORKS CO., LTD.
    Inventors: Seung Kim, Young Ki Park, Byunghoon Kang, Seungho Kim, Oh Joo Park, Jong Soo Baek, Gyuin Shim, Dae Seong Im
  • Patent number: 12255286
    Abstract: An electrolyte solution for a lithium secondary battery and a lithium secondary battery including the same are disclosed herein. In some embodiments, an electrolyte solution includes a lithium salt, an additive including a compound represented by Formula 1, and an organic solvent. In some embodiments, the lithium secondary battery includes a positive electrode, a negative electrode which includes a negative electrode active material containing SiOx (0<x?2), a separator, and the electrolyte solution.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: March 18, 2025
    Assignee: LG Energy Solution, Ltd.
    Inventors: Hyun Seung Kim, Chul Haeng Lee, Yu Ha An, Jeong Woo Oh
  • Publication number: 20250088225
    Abstract: A wireless communication method and apparatus in a wireless local area network (WLAN) system are disclosed. A wireless communication method according to one embodiment may include generating a high-efficiency Wi-Fi (HEW) frame including at least one of an HEW-SIG-A field and an HEW-SIG-B field which include channel information for communications according to an Orthogonal Frequency-Division Multiple Access (OFDMA) mode, and transmitting the generated HEW frame to a reception apparatus.
    Type: Application
    Filed: November 21, 2024
    Publication date: March 13, 2025
    Inventors: Yu Ro LEE, Jae Woo PARK, Jae Seung LEE, Jee Yon CHOI, Il Gyu KIM, Seung Chan BANG
  • Publication number: 20250088394
    Abstract: The transmitter includes a driver that is connected to an output node and drives the output node with a pulse amplitude modulation-4 (PAM-4) signal having four levels of a most significant bit (MSB) and a least significant bit (LSB), and an equalizer that is connected to the output node and compensates for attenuation of the PAM-4 signal based on a first operating voltage, wherein the equalizer compensates for the attenuation based on applying a second operating voltage having a level greater than a level of the first operating voltage to the output node when a transition from a first level to a second level among the four levels is a rising transition, and compensates for the attenuation based on forming a path for extracting an equalizing current from the output node when the transition from the first level to the second level is a falling transition.
    Type: Application
    Filed: September 6, 2024
    Publication date: March 13, 2025
    Inventors: Chulwoo KIM, Youngwook KWON, Jincheol SIM, Seung-Woo PARK, Seongcheol KIM
  • Publication number: 20250089165
    Abstract: A printed circuit board includes a glass layer, a through-hole penetrating through the glass layer, a seed layer provided along an inner wall of the through-hole, and a through-via disposed on the seed layer and filling the through-hole. The seed layer includes a carbon-based conductive material.
    Type: Application
    Filed: May 24, 2024
    Publication date: March 13, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seong Hun NA, Dong Yong KIM, Mi Geum KIM, Mi Jung PARK, Yong Su LEE, Ho Seung JANG, Sang Ik CHO, Sung HAN, Sung Hoon KIM
  • Publication number: 20250083505
    Abstract: A vehicular folding-type loading bay cover includes a cover unit with a plurality of slats. Respective upper end portions of preceding and following slats and respective lower end portions thereof are alternatingly connected, and the cover unit can be folded and unfolded in a loading bay of a vehicle. A main rail is disposed in the vehicular loading bay along a direction in which the cover unit is unfolded, guides the lower end portions of the slats, and guides the upper end portions of the slats in a section where the slats are unfolded. A guide rail branches off from the main rail, is parallel with the main rail in a section where the cover unit is fully folded and guides the upper end portions of the slats when the cover unit is folded.
    Type: Application
    Filed: May 7, 2024
    Publication date: March 13, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jae-Seung Lee, Hyung-Sik Choi, Gook-Hyun Jeon, Min-Su Kim
  • Patent number: 12249648
    Abstract: A semiconductor device includes a first impurity region on a substrate; a channel pattern protruding from an upper surface of the substrate, the channel pattern extending in a first direction substantially parallel to the upper surface of the substrate; a second impurity region on the channel pattern, the second impurity region covering an entire upper surface of the channel pattern; a gate structure on a sidewall of the channel pattern and the substrate adjacent to the channel pattern; a first contact pattern on the second impurity region; a second contact pattern that is electrically connected to the gate structure; and a spacer between the first contact pattern and the second contact pattern. The spacer completely surrounds the second contact pattern in plan view, and the first contact pattern partially surrounds the second contact pattern in plan view.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: March 11, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun-Seung Song, Hyo-Jin Kim, Kyoung-Mi Park, Hwi-Chan Jun, Seung-Seok Ha
  • Patent number: 12248018
    Abstract: A semiconductor chip includes a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied, a first ring oscillator connected to the first node through a first supply switch and the second node through a first ground switch and a second ring oscillator connected to the first node through a second supply switch and the second node through a second ground switch, wherein the first supply and ground switches are configured to operate in response to a first control signal, thereby operating the first ring oscillator, and the second supply and ground switches are configured to operate in response to a second control signal, thereby operating the second ring oscillator.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: March 11, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yeon Ho Jung, Jong Wook Kye, Min Woo Kwak, Mi Joung Kim, Chan Wook Park, Do Hoon Byun, Kwan Seong Lee, Jae Ho Lee, Jae Seung Choi, Hwang Ho Choi
  • Patent number: 12250134
    Abstract: A method for multi-connectivity between a plurality of base stations and user equipment includes estimating, at the user equipment, a first round trip time (RTT) taken in transmitting first data to a first base station, estimating, at the user equipment, a second RTT taken in transmitting second data to a second base station, and determining a size of the first data which is to be transmitted to the first base station, based on the first RTT and the second RTT.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: March 11, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hee-su Im, Byung-seung Kim, Eun-jun Choi
  • Publication number: 20250075180
    Abstract: The present invention relates to a method for producing ?? T cells. According to the present invention, ?? T cells with high cell killing ability and cell viability can be produced in a short period of time with high purity and high efficiency by a clinically friendly method, compared to conventionally known general ?? T cell culture methods or culturing methods using support cells, and thus, there is the advantage of increasing the productivity of allogeneic ?? T cell immunotherapeutic agents.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 6, 2025
    Inventors: Jeongho YOON, Jae Kook NAM, Junghoon KIM, Mihyeun RYU, Da Jeong KIM, Minhee LEE, Seung-Joo HYUN, Han-Wook RYU, Mi Sun PARK, Yeonteak LEE, Nahyeon JUNG, Hyo Je CHO
  • Publication number: 20250081843
    Abstract: An organic compound represented by a Chemical Formula 1 in accordance with the present invention exhibits excellent hole injection and hole transport characteristics. In addition, an hole transport auxiliary layer of the organic light-emitting diode in accordance with the present invention contains the organic compound represented by the Chemical Formula 1 to lower an operation voltage, and improve efficiency, and lifetime characteristics of the organic light-emitting diode.
    Type: Application
    Filed: August 7, 2024
    Publication date: March 6, 2025
    Inventors: Hani JEON, Tae Wan LEE, Jie SONG, Sangmee KIM, Seunguk CHO, Seung Hye JEONG
  • Publication number: 20250079084
    Abstract: A dielectric composition according to the present disclosure includes dielectric grains containing barium titanate-based compounds; and a secondary phase located between the dielectric grains, and the secondary phase includes a first secondary phase including Ga and Si. A multilayered capacitor includes a capacitor body including a dielectric layer and an internal electrode; and an external electrode disposed outside the capacitor body. The dielectric layer includes the dielectric composition according to the present disclosure.
    Type: Application
    Filed: May 31, 2024
    Publication date: March 6, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yonghwa Lee, Seung Yong Lee, Minsoo Kim, Sang Jin Park, Jinbok Shin
  • Publication number: 20250075071
    Abstract: Provided is a molded product manufactured from a thermoplastic resin composition containing a polycarbonate-based polymer, a polysiloxane-polycarbonate copolymer, a polysiloxane-polyester copolymer, and a benzotriazole-based UV stabilizer having a molecular weight equal to or greater than about 1,800.
    Type: Application
    Filed: March 20, 2024
    Publication date: March 6, 2025
    Inventors: Min Jin Choi, Seung Hwan Lee, Woo Chul Jung, Kyoung Sil Lee, Choon Ho Lee, In Chol Kim, Young Seung Kim, Yun Seok Bae, Hee Kyoung Ryoo
  • Publication number: 20250079302
    Abstract: A semiconductor device includes a substrate having a top surface and a bottom surface opposite to each other, a gate structure on the top surface of the substrate, a plurality of source/drain patterns on the top surface of the substrate and on opposite sides of the gate structure, a backside conductive line on the bottom surface of the substrate and electrically connected to at least one of the gate structure or a first source/drain pattern of the source/drain patterns, and a magnetic tunnel junction pattern electrically connected to a second source/drain pattern of the source/drain patterns.
    Type: Application
    Filed: February 19, 2024
    Publication date: March 6, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Byoungjae BAE, Jin-Wook YANG, Seung Pil KO, Yongjae KIM, Junho PARK, Kilho LEE
  • Publication number: 20250079939
    Abstract: Provided is a cooling guide structure of a motor, which may effectively cool a coil by being provided with a cooling guide including a guide part for spraying oil cooling the coil to various parts of the coil.
    Type: Application
    Filed: June 14, 2024
    Publication date: March 6, 2025
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: SangJin KIM, Hee Seo PARK, Jung Kyu YIM, Tae Woo KANG, Seung Ho LEE, Jong Jin PARK
  • Publication number: 20250079515
    Abstract: The present invention relates to a novel electrolyte additive, a non-aqueous electrolyte for a lithium secondary battery comprising the novel electrolyte additive, and a lithium secondary battery comprising the non-aqueous electrolyte. More specifically, the present invention relates to a non-aqueous electrolyte for a lithium secondary battery comprising an additive capable of forming a stable film on an electrode surface. The present invention also relates to a lithium secondary battery comprising such a non-aqueous electrolyte, thereby, a high temperature lifespan of the lithium secondary battery is not deteriorated, resistance does not increase when the lithium secondary battery is stored at a high temperature, and expansion of a volume (thickness) of the lithium secondary battery is suppressed when the lithium secondary battery is stored at a high temperature.
    Type: Application
    Filed: September 30, 2022
    Publication date: March 6, 2025
    Applicant: DUKSAN ELECTERA CO., LTD.
    Inventors: Jung Woo PARK, Tae Woo KIM, Ji Seung KIM, Sun Hwa LEE, Su Wan LEE
  • Patent number: 12243983
    Abstract: A non-aqueous electrolyte solution for a lithium secondary battery and a lithium secondary battery including the same are disclosed herein. In some embodiments, a non-aqueous electrolyte solution includes a lithium salt, an organic solvent, and a compound represented by Formula 1 as an additive. A lithium secondary battery including the non-aqueous electrolyte solution has improved high-rate charge and discharge characteristics at high temperature.
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: March 4, 2025
    Assignee: LG Energy Solution, Ltd.
    Inventors: Hyun Yeong Lee, Hyun Seung Kim, Chul Haeng Lee, Young Min Lim
  • Patent number: 12243844
    Abstract: A display device includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed in the pad area on the substrate, a circuit board disposed to overlap at least a portion of the pad area on the substrate, and an anisotropic conductive layer disposed in the pad area between the substrate and the circuit board. The circuit board includes a base substrate and a plurality of bump electrodes disposed on a lower surface of the base substrate. The anisotropic conductive layer includes an adhesive layer and a plurality of conductive particles arranged in the adhesive layer. Each of the conductive particles includes a core, a first conductive film disposed on the core in a way such that at least a portion of the core is exposed, and a second conductive film entirely covering the core and the first conductive film.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: March 4, 2025
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Byoungyong Kim, Daehyuk Im, Seung-Soo Ryu, Heeju Woo
  • Patent number: 12243874
    Abstract: A semiconductor device includes: a first active pattern on a substrate and including a first active fin and a second active fin; a device isolation layer defining the first active pattern; a gate electrode crossing the first active pattern; a first source/drain pattern and a second source/drain pattern on the first active fin and the second active fin, respectively; an inner fin spacer between the first and second source/drain patterns; and a buffer layer between the first and second active fins, wherein the inner fin spacer includes: a first inner spacer portion contacting the first source/drain pattern; a second inner spacer portion contacting the second source/drain pattern; and an inner extended portion extending from the first and second inner spacer portions, wherein the inner extended portion is between the first and second active fins, wherein the buffer layer has a dielectric constant higher than that of the inner fin spacer.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: March 4, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyungin Choi, Jinbum Kim, Haejun Yu, Seung Hun Lee
  • Patent number: 12239806
    Abstract: The present disclosure relates to a peritoneal cavity-bladder connecting catheter for ascites drainage. The peritoneal cavity-bladder connecting catheter for ascites drainage includes a peritoneal cavity position part positioned on the side of a peritoneal cavity by passing through a bladder wall located between the peritoneal cavity and a bladder, the peritoneal cavity position part having inlets through which ascites flow into an inner space and being formed as a film that surrounds the inner space, and a bladder position part integrally formed with the peritoneal cavity position part and positioned on the side of the bladder located on the side of the bladder wall opposite to the peritoneal cavity, the bladder position part having outlets through ascites flowed into the peritoneal cavity position part are discharged to outside, and being configured to form a closed inner space together with the peritoneal cavity position part.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: March 4, 2025
    Assignee: INJE UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Il Hwan Kim, Myeong Ju Kang, Bong Su Park, Si Hyung Park, Yu Jin Lee, Jin Han Park, Jae Ha Lee, Kang Min Park, Seong Cheol Kim, Jae Seung Jung, So Yeong Jung