Patents by Inventor Seung Kyoung Heo

Seung Kyoung Heo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11367647
    Abstract: A method of manufacturing an electronic device is provided. The method includes forming a stack structure by placing a to-be-peeled layer on a substrate, applying thermal shock to the stack structure, detaching the to-be-peeled layer from the substrate, and transferring the detached to-be-peeled layer to a target substrate.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: June 21, 2022
    Assignee: DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Kyung In Jang, Ho Hyun Keum, Jong Cheol Rah, Seung Kyoung Heo
  • Publication number: 20210090932
    Abstract: A method of manufacturing an electronic device is provided. The method includes forming a stack structure by placing a to-be-peeled layer on a substrate, applying thermal shock to the stack structure, detaching the to-be-peeled layer from the substrate, and transferring the detached to-be-peeled layer to a target substrate.
    Type: Application
    Filed: November 6, 2019
    Publication date: March 25, 2021
    Applicant: Daegu Gyeongbuk Institute of Science and Technology
    Inventors: Kyung In Jang, Ho Hyun Keum, Jong Cheol Rah, Seung Kyoung Heo