Abstract: There is provided a camera module including: a lens barrel including at least one lens disposed along an optical axis; a housing in which the lens barrel is disposed; and an infra-red (IR) filter adhesively bonded to an inner surface of the housing and disposed below the lens barrel, wherein protective tape is adhered to a contact surface of the IR filter in contact with the inner surface of the housing.

Abstract: There is provided a camera module including: a lens barrel including at least one lens disposed along an optical axis; a housing in which the lens barrel is disposed; and an infra-red (IR) filter adhesively bonded to an inner surface of the housing and disposed below the lens barrel, wherein protective tape is adhered to a contact surface of the IR filter in contact with the inner surface of the housing.

Abstract: A camera module is disclosed. The camera module in accordance with an embodiment of the present invention includes a housing, which has a hollow part formed therein, a lens module, which has a lens and is installed in the hollow part of the housing in such a way that the lens module can reciprocate in a direction of an optical axis, and a foreign substance pan, which is coupled to the lens module and disposed to correspond to a gap formed between the housing and the lens module and in which foreign substance has passed through the gap being settled on the foreign substance pan. Therefore, since the entered foreign substance or the generated foreign substance is prevented from approaching an image sensor, etc., defect caused by the foreign substance can be prevented.

Abstract: Provided is a camera module including a substrate; an image sensor that is mounted on the substrate; and a housing that is coupled to the top surface of the substrate and has a lens assembly integrally provided on the center thereof, the lens assembly having a plurality of lenses stacked therein, and a plurality of support portions which project from the side walls of the housing in the lower side of the lens assembly so as to be contact-supported by the top and side surfaces of the image sensor.

Abstract: Provided is an image sensor module including a lower substrate having a plurality of electrode pads formed on the outer portion of the top surface thereof; an upper substrate installed on the top surface of the lower substrate, the upper substrate having a window formed in the central portion thereof and a plurality of electrode pads formed on the bottom surface thereof to correspond to the respective electrode pads of the lower substrate, the window exposing the central portion of the top surface of the lower substrate; a conductive member interposed between the electrode pads of the lower substrate and the electrode pads of the upper substrate so as to form a conductive line for electrically connecting the electrode pads; and an image sensor module mounted on the top surface of the upper substrate.

Abstract: An optical pickup device including a lead frame and a board attached to the lead frame is provided. The lead frame includes optical components, such as a laser diode and an optical element, which are disposed within a lead frame. A photo diode is mounted on the board to receive a beam transmitted through the optical element. The board is adjusted with respect to the lead frame using the beam before attached to the lead frame. An upper opening and a lower opening are formed on an upper side and a lower side of the lead frame, respectively. An optical element installation space formed within the lead frame and defined by an upper side walls and an optical element support. A hole is formed in a central portion of the optical element support and communicates with the optical element installation space and a photo diode installation space which is defined by the optical element support and a lower side wall of lead frame.

Abstract: Disclosed herein is an optical pickup device. The optical pickup device has a lead frame package and a detecting unit. The lead frame package has a lead frame, a two-wavelength light source module and a hologram optical element. The lead frame has an opening formed to communicate with the outside. The two-wavelength light source module is arranged in a portion of the opening for emitting two beams having different wavelengths toward an optical disc. The hologram optical element is arranged over the two-wavelength light source module. Further, the hologram optical element includes a hologram pattern formed in its top and a wavefront-compensation hologram pattern formed on its bottom. The detecting unit has a board arranged beneath the lead frame package to be separated from and moved independently of the lead frame package, and a photo detector mounted on said board.

Abstract: Disclosed herein is an optical pickup device. The optical pickup device has a lead frame package and a detecting unit. The lead frame package has a lead frame, a two-wavelength light source module and a hologram optical element. The lead frame has an opening formed to communicate with the outside. The two-wavelength light source module is arranged in a portion of the opening for emitting two beams having different wavelengths toward an optical disc. The hologram optical element is arranged over the two-wavelength light source module. Further, the hologram optical element includes a hologram pattern formed in its top and a wavefront-compensation hologram pattern formed on its bottom. The detecting unit has a board arranged beneath the lead frame package to be separated from and moved independently of the lead frame package, and a photo detector mounted on said board.

Abstract: An optical pickup device including a lead frame and a board attached to the lead frame is provided. The lead frame includes optical components, such as a laser diode and an optical element, which are disposed within a lead frame. A photo diode is mounted on the board to receive a beam transmitted through the optical element. The board is adjusted with respect to the lead frame using the beam before attached to the lead frame. An upper opening and a lower opening are formed on an upper side and a lower side of the lead frame, respectively. An optical element installation space formed within the lead frame and defined by an upper side walls and an optical element support. A hole is formed in a central portion of the optical element support and communicates with the optical element installation space and a photo diode installation space which is defined by the optical element support and a lower side wall of lead frame.

Abstract: An optical pickup device having a lead frame package and a detecting unit is provided. The lead frame package includes a sub-mount, a light source mounted on the sub-mount and emitting a beam, a reflecting element disposed to direct the beam toward an optical medium, a transmission-type diffraction gating element dividing the beam into three beams, and a hologram optical element diffracting the beams reflected from the optical medium, the lead frame package having an opening defined by the hologram optical element, the bottom of the lead frame package, and side walls of the lead frame package. The detecting unit having a substrate and a photo diode mounted on the substrate is disposed within the opening of the lead frame package. After the detecting unit is adjusted with respect to the lead frame package to a position to accurately receive the reflected beams from the hologram optical element, the detecting unit is fixed to the lead frame package.