Patents by Inventor Seung Min Ahn
Seung Min Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250125096Abstract: A multilayer electronic component of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; a connection portion disposed in an end of the internal electrode; an interface plating layer disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the connection portion; and an external electrode disposed on the interface plating layer, wherein the connection portion may have a different crystal structure from the internal electrode.Type: ApplicationFiled: August 28, 2024Publication date: April 17, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Min AHN, Hyung Duk YUN, Dong Hyeon LEE, Byung Jun JEON, Chae Min PARK, Joon Hwan KWAG, Hong Seok KIM
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Publication number: 20250118496Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an interface plating layer disposed on an end of the internal electrode; and an external electrode disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the interface plating layer, and including a conductive resin layer including a conductive metal and a resin.Type: ApplicationFiled: September 3, 2024Publication date: April 10, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Hyeon LEE, Seung Min AHN, Hyung Duk YUN, Chae Min PARK, Joon Hwan KWAG, Byung Jun JEON, Hong Seok KIM
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Patent number: 12087512Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: GrantFiled: May 11, 2023Date of Patent: September 10, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
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Publication number: 20230282422Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: ApplicationFiled: May 11, 2023Publication date: September 7, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
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Patent number: 11749460Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: GrantFiled: May 28, 2021Date of Patent: September 5, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
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Patent number: 11728095Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.Type: GrantFiled: August 30, 2021Date of Patent: August 15, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Beom Joon Cho, Seung Min Ahn, Mi Na Hyun
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Patent number: 11515096Abstract: An electronic component includes a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant at least partially covering regions of the capacitor component and the metal frame. The metal frame may include a surface unevenness portion disposed on at least a portion of an interface with the encapsulant.Type: GrantFiled: April 23, 2021Date of Patent: November 29, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Min Ahn, Beom Joon Cho, Ki Young Kim
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Publication number: 20220181086Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.Type: ApplicationFiled: August 30, 2021Publication date: June 9, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Beom Joon CHO, Seung Min AHN, Mi Na HYUN
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Publication number: 20220130614Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: ApplicationFiled: May 28, 2021Publication date: April 28, 2022Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
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Publication number: 20220084751Abstract: An electronic component includes a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant at least partially covering regions of the capacitor component and the metal frame. The metal frame may include a surface unevenness portion disposed on at least a portion of an interface with the encapsulant.Type: ApplicationFiled: April 23, 2021Publication date: March 17, 2022Inventors: Seung Min Ahn, Beom Joon Cho, Ki Young Kim