Patents by Inventor Seung Min Ahn

Seung Min Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250125096
    Abstract: A multilayer electronic component of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; a connection portion disposed in an end of the internal electrode; an interface plating layer disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the connection portion; and an external electrode disposed on the interface plating layer, wherein the connection portion may have a different crystal structure from the internal electrode.
    Type: Application
    Filed: August 28, 2024
    Publication date: April 17, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min AHN, Hyung Duk YUN, Dong Hyeon LEE, Byung Jun JEON, Chae Min PARK, Joon Hwan KWAG, Hong Seok KIM
  • Publication number: 20250118496
    Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an interface plating layer disposed on an end of the internal electrode; and an external electrode disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the interface plating layer, and including a conductive resin layer including a conductive metal and a resin.
    Type: Application
    Filed: September 3, 2024
    Publication date: April 10, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hyeon LEE, Seung Min AHN, Hyung Duk YUN, Chae Min PARK, Joon Hwan KWAG, Byung Jun JEON, Hong Seok KIM
  • Patent number: 12087512
    Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: September 10, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
  • Publication number: 20230282422
    Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.
    Type: Application
    Filed: May 11, 2023
    Publication date: September 7, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
  • Patent number: 11749460
    Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: September 5, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
  • Patent number: 11728095
    Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: August 15, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Beom Joon Cho, Seung Min Ahn, Mi Na Hyun
  • Patent number: 11515096
    Abstract: An electronic component includes a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant at least partially covering regions of the capacitor component and the metal frame. The metal frame may include a surface unevenness portion disposed on at least a portion of an interface with the encapsulant.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: November 29, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min Ahn, Beom Joon Cho, Ki Young Kim
  • Publication number: 20220181086
    Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.
    Type: Application
    Filed: August 30, 2021
    Publication date: June 9, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Beom Joon CHO, Seung Min AHN, Mi Na HYUN
  • Publication number: 20220130614
    Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.
    Type: Application
    Filed: May 28, 2021
    Publication date: April 28, 2022
    Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
  • Publication number: 20220084751
    Abstract: An electronic component includes a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant at least partially covering regions of the capacitor component and the metal frame. The metal frame may include a surface unevenness portion disposed on at least a portion of an interface with the encapsulant.
    Type: Application
    Filed: April 23, 2021
    Publication date: March 17, 2022
    Inventors: Seung Min Ahn, Beom Joon Cho, Ki Young Kim