Abstract: Provided is a keyword management method of an electronic apparatus. The keyword management method may include confirming a landing page type corresponding to a keyword associated with a search service of another apparatus, checking whether the keyword corresponds to a keyword set, changing the landing page type corresponding to the keyword when the keyword corresponds to the keyword set and the confirmed landing page type is not a landing page type related to the keyword set, and providing information on the changed landing page type to the other apparatus.

Abstract: A semiconductor device is disclosed. The semiconductor device includes a transceiver including an amplifier region configured to output a data signal to a source line connected to a pixel during a first period and receive a detection signal from a touch electrode during a second period different from the first period, and configured to generate the data signal based on input data; and a driving controller configured to generate the data based on input image data, outputting the data to the transceiver, and generate a touch signal based on the detection signal.

Abstract: A variable resistive memory device includes a memory cell, a first current-applying block, a second current-applying block and a mode setting circuit. The memory cell includes a first electrode, a second electrode, and a memory layer, the memory layer interposed between the first electrode and the second electrode. The first current-applying block is configured to flow a first current to the first electrode that flows from the first electrode to the second electrode. The second current-applying block is configured to flow a second current to the second electrode that flows from the second electrode to the first electrode. The mode setting circuit is configured to selectively provide any one of the first electrode of the first current-applying block and the second electrode of the second current-applying block with a first voltage. When the memory cell is selected, the selected current-applying block, among the first current-applying block and the second current-applying block, is driven.

Abstract: An apparatuses for managing access to a file stored in a remote location includes detecting an attempt for a user terminal to access the file stored in the remote location, determining a location where the file attempted to be access is to be opened, in response to a determination that the location where the file is to be opened is remote, opening the file and providing a content of the opened file to the user terminal by a file management server and in response to a determination that the location where the file is to be opened is local, processing the file to be downloaded to the user terminal by the file management server.

Abstract: An apparatuses for managing access to a file stored in a remote location includes detecting an attempt for a user terminal to access the file stored in the remote location, determining a location where the file attempted to be access is to be opened, in response to a determination that the location where the file is to be opened is remote, opening the file and providing a content of the opened file to the user terminal by a file management server and in response to a determination that the location where the file is to be opened is local, processing the file to be downloaded to the user terminal by the file management server.

Abstract: A variable resistive memory device includes a memory cell, a first current-applying block, a second current-applying block and a mode setting circuit. The memory cell includes a first electrode, a second electrode, and a memory layer, the memory layer interposed between the first electrode and the second electrode. The first current-applying block is configured to flow a first current to the first electrode that flows from the first electrode to the second electrode. The second current-applying block is configured to flow a second current to the second electrode that flows from the second electrode to the first electrode. The mode setting circuit is configured to selectively provide any one of the first electrode of the first current-applying block and the second electrode of the second current-applying block with a first voltage. When the memory cell is selected, the selected current-applying block, among the first current-applying block and the second current-applying block, is driven.

Abstract: A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.

Abstract: A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.

Abstract: A fan-out semiconductor package includes a semiconductor chip including a body and an electrode pad disposed on the body, a metal layer disposed on the electrode pad of the semiconductor chip, and a interconnection member including an insulating layer disposed on one side of the semiconductor chip, a via hole penetrating through the insulating layer and exposing at least a portion of a surface of the metal layer, a seed layer disposed on the surface of the metal layer exposed by the via hole and a wall of the via hole, and a conductor layer disposed on the seed layer.

Abstract: A fan-out semiconductor package includes a semiconductor chip including a body and an electrode pad disposed on the body, a metal layer disposed on the electrode pad of the semiconductor chip, and a interconnection member including an insulating layer disposed on one side of the semiconductor chip, a via hole penetrating through the insulating layer and exposing at least a portion of a surface of the metal layer, a seed layer disposed on the surface of the metal layer exposed by the via hole and a wall of the via hole, and a conductor layer disposed on the seed layer.

Abstract: A printed circuit board includes an insulating layer; and a circuit pattern formed on the insulating layer. The circuit pattern includes a seed layer and a metal layer formed on the seed layer, and both sides of the seed layer are formed with an etched groove. Also, a method of manufacturing a printed circuit board includes: forming a seed layer on the insulating layer; forming a plating resist formed with an opening on the seed layer; forming a circuit pattern by performing plating processing on the opening; removing the plating resist; forming a passivation layer on the circuit pattern; performing dry etching on a remaining portion other than a side wall of the passivation layer; and performing wet etching the seed layer exposed on a surface by the dry etching.

Abstract: Disclosed are a robot cleaner and a method for controlling the same. The robot cleaner is capable of recognizing a position thereof by extracting one or more feature points having 2D coordinates information with respect to each of a plurality of images, by matching the feature points with each other, and then by creating a matching point having 3D coordinates information. Matching points having 3D coordinates information are created to recognize a position of the robot cleaner, and the recognized position is verified based on a moving distance measured by using a sensor. This may allow a position of the robot cleaner to be precisely recognized, and allow the robot cleaner to perform a cleaning operation or a running operation by interworking the precisely recognized position with a map.

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Abstract: Disclosed are a mobile robot with a single camera capable of performing a cleaning process with respect to surroundings, and capable of more precisely making a 3D map of the surroundings including a plurality of feature points, and a method for recognizing 3D surroundings of the same. According to the method, images of the surroundings are captured, and a preset number of particles with respect to feature points of a first image are projected to a second image based on matching information of feature points extracted from the two images sequentially captured, thereby extracting 3D information of the surroundings.

Abstract: Exemplary embodiments of the invention provide an apparatus for providing a mind map-type online community service, capable of maintaining the “theme-wise” direction of conversations by forming nodes in a shape with a protrusion in response to content being created by a user.

Abstract: Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the copper-clad laminate plate according to one implementation embodiment of the present invention includes: carrier; a peel layer formed on the carrier; a copper-clad layer formed on the peel layer; and a surface-treated layer formed on the copper-clad layer, in which the surface-treated layer includes a thiol-based compound. Therefore, the present invention provides a printed circuit board capable of improving an adhesive force between a base and a copper-clad layer without treating a roughed surface by forming the surface-treated layer on the copper-clad layer.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a representative preferred embodiment of the present invention, it is possible to protect a line width of a circuit pattern and suppress an undercut by providing the printed circuit board in which etched grooves are formed at both sides of a seed layer of the circuit pattern.

Abstract: Disclosed is a mobile robot and a controlling method of the same. An entire movement region is divided into a plurality of regions, and a partial map is gradually made by using feature points of a plurality of images of the divided regions. Then, the map is compensated into a closed curved line, thereby making an entire map. Furthermore, when the mobile robot is positioned at a boundary of neighboring regions of the cleaning region, the boundary where a closed curved line is formed, the mobile robot compensates for its position based on a matching result between feature points included in the map, and feature points extracted from images captured during a cleaning process.

Abstract: Provided are a system and method for real-time object recognition and pose estimation using in-situ monitoring.