Patents by Inventor Seung-Min Kim

Seung-Min Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11591706
    Abstract: The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|?(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|?PD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: February 28, 2023
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Seung Min Kim, Shan Hua Jin
  • Patent number: 11588156
    Abstract: An embodiment of the present invention provides a copper foil which comprises a copper layer and an anticorrosive film placed on the copper layer, and has a Young's modulus of 3800 to 4600 kgf/mm2 and a modulus bias factor (MBF) less than 0.12, wherein the modulus bias factor (MBF) is obtained by formula 1 below.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: February 21, 2023
    Assignee: SK NEXILIS CO., LTD.
    Inventor: Seung Min Kim
  • Patent number: 11567555
    Abstract: Embodiments include an apparatus comprising an execution unit coupled to a memory, a microcode controller, and a hardware controller. The microcode controller is to identify a global power and performance hint in an instruction stream that includes first and second instruction phases to be executed in parallel, identify a local hint based on synchronization dependence in the first instruction phase, and use the first local hint to balance power consumption between the execution unit and the memory during parallel executions of the first and second instruction phases. The hardware controller is to use the global hint to determine an appropriate voltage level of a compute voltage and a frequency of a compute clock signal for the execution unit during the parallel executions of the first and second instruction phases. The first local hint includes a processing rate for the first instruction phase or an indication of the processing rate.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: January 31, 2023
    Assignee: Intel Corporation
    Inventors: Jason Seung-Min Kim, Sundar Ramani, Yogesh Bansal, Nitin N. Garegrat, Olivia K. Wu, Mayank Kaushik, Mrinal Iyer, Tom Schebye, Andrew Yang
  • Patent number: 11505873
    Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: November 22, 2022
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Shan Hua Jin, An Na Lee, Seung Min Kim
  • Publication number: 20220228268
    Abstract: Provided in one embodiment of the present disclosure is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 MPa on the basis of the absolute value thereof, wherein the copper layer comprises copper and carbon (C), the amount of carbon (C) in the copper layer is 2-20 ppm, the copper layer has a plane (111), a plane (200), a plane (220) and a plane (311) including crystalline particles, the ratio of the diffraction intensity of the plane (220) to the sum of the diffraction intensities of the plane (111), the plane (200), the plane (220) and the plane (311) is 10-40%, and the crystalline particles of the plane (220) have an average particle size of 70-120 nm at room temperature.
    Type: Application
    Filed: November 13, 2020
    Publication date: July 21, 2022
    Inventors: Shan Hua JIN, An Na LEE, Seung Min KIM
  • Publication number: 20220200010
    Abstract: An embodiment of the present disclosure provides an electrolytic copper foil, which comprises a copper layer and has a valley mean roughness of 0.8 to 12.5, a texture coefficient of (220) face (TC(220)) of 0.49 to 1.28, a tensile strength of 25 to 51 kgf/mm2, and a weight deviation in lateral direction of 3% or less.
    Type: Application
    Filed: November 13, 2020
    Publication date: June 23, 2022
    Inventors: Seung Min KIM, In Soo JUNG, Young Tae KIM, Sang Hyun JUN
  • Patent number: 11352707
    Abstract: Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra??[Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: June 7, 2022
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Seung Min Kim, An Na Lee, Ho Gun Kim, Shan Hua Jin
  • Patent number: 11355757
    Abstract: Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with such electrolytic copper foil so that high productivity can be guaranteed. An electrolytic copper foil of the disclosure has a longitudinal rising of 30 mm or less and a transverse rising of 25 mm or less, and the transverse rising is 8.5 times the longitudinal rising or less.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: June 7, 2022
    Assignee: SK NEXILIS CO., LTD.
    Inventor: Seung Min Kim
  • Patent number: 11346015
    Abstract: The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 ?m/(m·° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: May 31, 2022
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung Min Kim, Joong Kyu An, Shan Hua Jin
  • Patent number: 11346014
    Abstract: The present invention relates to an electrolytic copper foil current collector where the surface properties are controlled to achieve a high adhesiveness to a negative electrode material. An electrolytic copper foil has a first surface and the second surface, the electrolytic copper foil comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient=Rp/?m+ peak density/30+ amount of Cr adhesion/(mg/m2) (here, peak density is measured according to ASME standard B46.1). The electrolytic copper foil has a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: May 31, 2022
    Assignee: SK NEXILIS CO., LTD.
    Inventors: Seung Min Kim, Ho Gun Kim
  • Patent number: 11332372
    Abstract: The present disclosure provides an apparatus capable of continuously producing carbon nanotubes having high crystallinity, a low residual catalyst content and a high aspect ratio. The apparatus for producing carbon nanotubes includes: a reaction unit configured to synthesize carbon nanotubes (CNTs), a supply unit configured to supply a carbon source to the reaction unit through a supply pipe; and a collection unit configured to collect carbon nanotubes discharged from the reaction unit, wherein the reaction unit may include a chemical vapor deposition reactor.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: May 17, 2022
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Seung Min Kim, Sung Hyun Lee, Jun Beom Park, Ji Hong Park, Dong Myeong Lee, Sook Young Moon, Hyeon Su Jeong
  • Publication number: 20220119973
    Abstract: One embodiment of the present disclosure provides an electrolytic copper foil includes a copper layer and has a width direction weight deviation of 5% or less calculated according to Equation 1 below, a tensile strength of 25 kgf/mm2 to 62 kgf/mm2, and a valley depth-to-thickness (VDT) of 3.5 to 66.9 calculated according to Equation 2 below. width direction weight deviation (%)=(standard deviation of weight/arithmetic mean of weight)×100, and??[Equation 1] VDT=[thickness of electrolytic copper foil]/[maximum valley depth of roughness profile(Rv)].
    Type: Application
    Filed: November 5, 2020
    Publication date: April 21, 2022
    Inventors: Young Tae KIM, Sang Hyun JUN, Jeong Gil LEE, Seung Min KIM
  • Publication number: 20220106152
    Abstract: The present disclosure relates to an apparatus for accommodating copper foil. The apparatus includes an accommodation body in which an accommodation space for accommodating copper foil wound on a core is provided, a first support portion coupled to the accommodation body to support one side of the core, a second support portion coupled to the accommodation body to support the other side of the core, a first damper portion coupled to the first support portion to be disposed between the first support portion and the one side of the core, and a second damper portion coupled to the second support portion to be disposed between the second support portion and the other side of the core, wherein the first damper portion includes a first damper body coupled to the first support portion and a plurality of first damper protrusions protruding from the first damper body.
    Type: Application
    Filed: October 30, 2020
    Publication date: April 7, 2022
    Inventors: Young Tae KIM, In Soo JUNG, Seung Min KIM, Young Gyu YANG
  • Patent number: 11204766
    Abstract: Embodiments include a method comprising identifying, by an instruction scheduler of a processor core, a first high power instruction in an instruction stream to be executed by an execution unit of the processor core. A pre-charge signal is asserted indicating that the first high power instruction is scheduled for execution. Subsequent to the pre-charge signal being asserted, a voltage boost signal is asserted to cause a supply voltage for the execution unit to be increased. A busy signal indicating that the first high power instruction is executing is received from the execution unit. Based at least in part on the busy signal being asserted, de-asserting the voltage boost signal. More specific embodiments include decreasing the supply voltage for the execution unit subsequent to the de-asserting the voltage boost signal. More Further embodiments include delaying asserting the voltage boost signal based on a start delay time.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Jason Seung-Min Kim, Nitin N. Garegrat, Anitha Loke, Nasima Parveen, David Y. Fang, Kursad Kiziloglu, Dmitry Sergeyevich Lukiyanchenko, Fabrice Paillet, Andrew Yang
  • Publication number: 20210323826
    Abstract: Disclosed is a method for mass-producing densified carbon nanotube fiber. The method includes preparing carbon nanotube fiber, swelling the carbon nanotube fiber by applying an acid solution thereto, and stretching the carbon nanotube fiber, coagulating the stretched carbon nanotube fiber so as to remove the acid solution present therein, and drying the coagulated carbon nanotube fiber.
    Type: Application
    Filed: November 23, 2020
    Publication date: October 21, 2021
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Su JEONG, Seung Min KIM, Sook Young MOON, Dong Myeong LEE
  • Publication number: 20210188643
    Abstract: The present disclosure provides an apparatus capable of continuously producing carbon nanotubes having high crystallinity, a low residual catalyst content and a high aspect ratio. The apparatus for producing carbon nanotubes includes: a reaction unit configured to synthesize carbon nanotubes (CNTs), a supply unit configured to supply a carbon source to the reaction unit through a supply pipe; and a collection unit configured to collect carbon nanotubes discharged from the reaction unit, wherein the reaction unit may include a chemical vapor deposition reactor.
    Type: Application
    Filed: July 8, 2020
    Publication date: June 24, 2021
    Inventors: Seung Min KIM, Sung Hyun LEE, Jun Beom PARK, Ji Hong PARK, Dong Myeong LEE, Sook Young MOON, Hyeon Su JEONG
  • Publication number: 20210167397
    Abstract: The present invention relates to a copper foil current collector having superior adhesion to an active material of a Li secondary battery. The electrolytic copper foil of the present invention having a first surface and a second surface comprises: a first protective layer at the first surface; a second protective layer at the second surface; and a copper film between the first and second protective layers, wherein an oxygen-containing part at the second surface has a thickness (OT) of not less than 1.5 nm. According to the present invention, an electrolytic copper foil current collector for a Li secondary battery, which has low electric resistance and high adhesion to an active material, can be provided.
    Type: Application
    Filed: August 27, 2018
    Publication date: June 3, 2021
    Inventors: Seung Min KIM, An Na LEE
  • Publication number: 20210050598
    Abstract: Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with such electrolytic copper foil so that high productivity can be guaranteed. An electrolytic copper foil of the disclosure has a longitudinal rising of 30 mm or less and a transverse rising of 25 mm or less, and the transverse rising is 8.5 times the longitudinal rising or less.
    Type: Application
    Filed: October 29, 2020
    Publication date: February 18, 2021
    Inventor: Seung Min KIM
  • Publication number: 20210025066
    Abstract: The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|?(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|?PD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.
    Type: Application
    Filed: January 25, 2019
    Publication date: January 28, 2021
    Inventors: Seung Min KIM, Shan Hua JIN
  • Publication number: 20210025067
    Abstract: The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 ?m/(m·° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.
    Type: Application
    Filed: January 25, 2019
    Publication date: January 28, 2021
    Inventors: Seung Min KIM, Joong Kyu AN, Shan Hua JIN