Abstract: An infrared transmission photosensitive resin composition includes (A) a pigment dispersion composition including a coloring agent (a1); (B) an alkaline soluble resin; (C) a photo-polymerizable compound; (D) a photo-polymerization initiator; and (E) a solvent, wherein the coloring agent (a1) includes a blue pigment, a red pigment and a yellow pigment. Thereby, the infrared transmission photosensitive resin composition may form an infrared transmission pixel which exhibits a high transmittance in an infrared region while having a very low transmittance in a visible light region, so as to be used in an image sensor for obtaining an image having excellent image quality at a place where the quantity of light is insufficient.

Abstract: An infrared transmission photosensitive resin composition includes (A) a pigment dispersion composition including a coloring agent (a1); (B) an alkaline soluble resin; (C) a photo-polymerizable compound; (D) a photo-polymerization initiator; and (E) a solvent, wherein the coloring agent (a1) includes a blue pigment, a red pigment and a yellow pigment. Thereby, the infrared transmission photosensitive resin composition may form an infrared transmission pixel which exhibits a high transmittance in an infrared region while having a very low transmittance in a visible light region, so as to be used in an image sensor for obtaining an image having excellent image quality at a place where the quantity of light is insufficient.

Abstract: Disclosed is a colored photosensitive resin composition for a color filter of a solid state imaging device using an ultra-short wavelength exposing device of 300 nm or less, a color filter and a solid state imaging device including the same. The colored photosensitive resin composition can fabricate a color filter having a micro-patterned colored pattern. The color filter can be advantageously applied to a solid state imaging device.

Abstract: Disclosed is a colored photosensitive resin composition for a color filter of a solid state imaging device using an ultra-short wavelength exposing device of 300 nm or less, a color filter and a solid state imaging device including the same. The colored photosensitive resin composition can fabricate a color filter having a micro-patterned colored pattern. The color filter can be advantageously applied to a solid state imaging device.

Abstract: The present invention relates to a colored negative photoresist composition comprising a coloring agent (A), an alkali soluble binder polymer (B), a photopolymerizable compound (C), a photopolymerization initiator (D), and a solvent (E), wherein the alkali soluble binder polymer (B) is a polymer comprising the monomer represented by the following Formula 1 and a monomer having a carboxyl group. The colored negative photoresist composition of the present invention improves adhesion to a silicone wafer, in particular, an SiN wafer, to prevent a separation or tear in the lining, and to form a rectangular pattern, thereby being able to be effectively used in a complementary metal oxide semiconductor.