Patents by Inventor Seung Pil JUNG

Seung Pil JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240075853
    Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.
    Type: Application
    Filed: April 13, 2023
    Publication date: March 7, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, DAS CO., LTD, Faurecia Korea, Ltd., Hyundai Transys Inc.
    Inventors: Sang Soo LEE, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Sang Do PARK, Chan Ho JUNG, Dong Hoon LEE, Hea Yoon KANG, Deok Soo LIM, Seung Pil JANG, Seon Ho KIM, Jong Seok YUN, Hyo Jin KIM, Dong Gyu SHIN, Jin Ho SEO, Young Jun KIM, Taek Jun NAM
  • Publication number: 20230295381
    Abstract: The present invention relates to a polysiloxane-polycarbonate copolymer using a hydroxyl terminated polysiloxane mixture, and a method for producing same, and more specifically, to: a polysiloxane-polycarbonate copolymer which includes hydroxy-terminated polysiloxanes of chemical formulae 1 and 2 in a specific weight ratio as repeating units, and thus exhibits excellent transmittance and low-temperature impact strength compared to the case of using either of the hydroxy-terminated polysiloxanes by itself, and in which the overall production yield of the raw material polysiloxane is improved, such that the polysiloxane-polycarbonate copolymer is excellent in terms of economics; and a method for producing same.
    Type: Application
    Filed: April 22, 2021
    Publication date: September 21, 2023
    Applicant: SAMYANG CORPORATION
    Inventors: Yun Ju CHANG, Kyung Moo SHIN, Ki Tae KANG, Mi Ran KIM, Seung Pil JUNG, Jin Sik CHOI, Seong Hyen HEO
  • Patent number: 11378470
    Abstract: An electronic device includes a force-sensing apparatus. The force-sensing apparatus includes a planar-shaped frame, a force sensor, and a displacement portion. The force sensor is disposed on one surface of the frame. The displacement portion has a planar profile and one side coupled at an acute angle to the frame and another side freely disposed above a sensing surface of the force sensor.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: July 5, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Ju Lee, Nam Gyun Yim, Sol Ji Chang, Hong Seok Lee, Hee Sun Oh, Gye Won Lee, Seung Pil Jung, Jong Yun Kim
  • Patent number: 11191150
    Abstract: An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: November 30, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Seok Lee, Gye Won Lee, Hee Sun Oh, Jong Yun Kim, Seung Pil Jung, Chang Ju Lee
  • Publication number: 20210262870
    Abstract: An electronic device includes a force-sensing apparatus. The force-sensing apparatus includes a planar-shaped frame, a force sensor, and a displacement portion. The force sensor is disposed on one surface of the frame. The displacement portion has a planar profile and one side coupled at an acute angle to the frame and another side freely disposed above a sensing surface of the force sensor.
    Type: Application
    Filed: August 21, 2020
    Publication date: August 26, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Ju LEE, Nam Gyun YIM, Sol Ji CHANG, Hong Seok LEE, Hee Sun OH, Gye Won LEE, Seung Pil JUNG, Jong Yun KIM
  • Patent number: 10934431
    Abstract: Disclosed is a polycarbonate resin composition including (1) a polyester compound having a structure of chemical formula 1 as defined herein or a phenyl-arylene ether sulfone compound having a structure of chemical formula 2 as defined herein; (2) a polycarbonate block copolymer; and (3) a thermoplastic aromatic polycarbonate resin or a polysiloxane-polycarbonate resin; and a molded product including the same. The polycarbonate resin composition exhibits remarkably excellent heat resistance compared to existing high heat resistance polycarbonate resins, and has an excellent balance of physical properties such as fluidity.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: March 2, 2021
    Assignee: SAMYANG CORPORATION
    Inventors: Seung Pil Jung, Jung Up Park, Jin Sik Choi, Seong Hyen Heo, Kyung Moo Shin
  • Publication number: 20210045225
    Abstract: An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.
    Type: Application
    Filed: December 30, 2019
    Publication date: February 11, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Seok LEE, Gye Won LEE, Hee Sun OH, Jong Yun KIM, Seung Pil JUNG, Chang Ju LEE
  • Publication number: 20200087509
    Abstract: The present invention relates to a polycarbonate resin composition having excellent heat resistance and fluidity, and a molded product including the same. More specifically, the present invention relates to a polycarbonate resin composition, and a molded product including the same, wherein the polycarbonate resin composition, by including a polycarbonate copolymer together with a compound having a specific structure and a specific resin, exhibits remarkably excellent heat resistance compared to existing high heat resistance polycarbonate resins, and has an excellent balance of physical properties such as fluidity.
    Type: Application
    Filed: November 10, 2017
    Publication date: March 19, 2020
    Applicant: SAMYANG CORPORATION
    Inventors: Seung Pil JUNG, Jung Up PARK, Jin Sik CHOI, Seong Hyen HEO, Kyung Moo SHIN
  • Patent number: 10211878
    Abstract: A communications apparatus includes: a communications IC including a first RF pin, a second RF pin, and a third RF pin; a first front-end module connected between the first RF pin and a first RF terminal to provide a first signal path for wireless Tx and Rx, a second signal path for a first wireless LAN Rx, and a third signal path for a first wireless LAN Tx; a second front-end module connected between the third RF pin and a second RF terminal to provide a fourth signal path for a second wireless LAN Tx and a fifth signal path for a second wireless LAN Rx; and a duplexer configured to provide a first wireless LAN Tx signal to the first front-end module through the second RF pin, and provide a second wireless LAN Tx signal to the second front-end module through the second RF pin.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: February 19, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Pil Jung, Da Un Kim, Young Sik Jeon
  • Publication number: 20180062693
    Abstract: A communications apparatus includes: a communications IC including a first RF pin, a second RF pin, and a third RF pin; a first front-end module connected between the first RF pin and a first RF terminal to provide a first signal path for wireless Tx and Rx, a second signal path for a first wireless LAN Rx, and a third signal path for a first wireless LAN Tx; a second front-end module connected between the third RF pin and a second RF terminal to provide a fourth signal path for a second wireless LAN Tx and a fifth signal path for a second wireless LAN Rx; and a duplexer configured to provide a first wireless LAN Tx signal to the first front-end module through the second RF pin, and provide a second wireless LAN Tx signal to the second front-end module through the second RF pin.
    Type: Application
    Filed: March 10, 2017
    Publication date: March 1, 2018
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Pil JUNG, Da Un KIM, Young Sik JEON
  • Patent number: 9853682
    Abstract: A communications module includes a front-end module including a common port configured to be connected to an antenna, a reception port configured to pass a reception signal, and a transmission port configured to pass a transmission signal, and a high frequency switch circuit connected to the reception port and/or the transmission port and configured to change signal routes for signals passing through the front-end module, wherein the front-end module is configured to amplify communications signals of different communications standards.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: December 26, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Pil Jung, Young Pyo Lee
  • Publication number: 20170085292
    Abstract: A communications module includes a front-end module including a common port configured to be connected to an antenna, a reception port configured to pass a reception signal, and a transmission port configured to pass a transmission signal, and a high frequency switch circuit connected to the reception port and/or the transmission port and configured to change signal routes for signals passing through the front-end module, wherein the front-end module is configured to amplify communications signals of different communications standards.
    Type: Application
    Filed: March 25, 2016
    Publication date: March 23, 2017
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Pil JUNG, Young Pyo LEE
  • Publication number: 20160143147
    Abstract: The electronic device module and method thereof includes a board, an electronic device, a sealing part, and a connection conductor. The board includes external connection electrodes. The electronic device is mounted on the board. The sealing part is configured to seal the electronic device. The connection conductor is configured to penetrate through the sealing part and including one end bonded to the external connection electrodes of the board. One of the external connection electrodes includes a reinforcing via disposed in the board.
    Type: Application
    Filed: October 27, 2015
    Publication date: May 19, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Woo PARK, Seung Pil JUNG
  • Publication number: 20080187314
    Abstract: Disclosed herein is an optical access network system in which the transmission quality of an upstream signal is remarkably improved in an optical access network in which a Reflective Semiconductor Optical Amplifier (RSOA) is used as the light source for each subscriber. The most important characteristics of the present invention are that a Manchester modulation format is used as a modulation format for a downstream signal in an optical access network system in which an RSOA is used as the light source for each subscriber, so that the problem of deterioration of the transmission quality of a remodulated upstream signal, occurring when an RSOA is used as the light source for each subscriber, is solved, and thus the transmission performance of an upstream signal and the power budget performance of the entire system are improved.
    Type: Application
    Filed: September 5, 2007
    Publication date: August 7, 2008
    Applicant: KOREA ADVANCED OF SCIENCE AND TECHNOLOGY
    Inventors: Yun Chur CHUNG, Sang Yub KIM, Sang Bae JUN, Seung Pil JUNG