Patents by Inventor Seung Ra

Seung Ra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141103
    Abstract: The present disclosure relates to a method for preparing a polyalkylene carbonate resin, and more particularly, to a method for preparing a polyalkylene carbonate resin having the reduced cyclic carbonate content, which is a by-product, and an increased ratio of a repeating unit including carbon dioxide, by increasing catalyst activity.
    Type: Application
    Filed: September 26, 2022
    Publication date: May 2, 2024
    Inventors: Seung Hee LEE, Sang Kook KIM, Sang Woo KIM, Bo Ra SHIN, No Jin PARK
  • Patent number: 11912760
    Abstract: Described herein are doppel-targeting molecules (e.g., antibodies) useful for inhibiting pathological angiogenesis and treating diseases and conditions associated with pathological angiogenesis, such as tumors, cancers, atherosclerosis, tuberculosis, asthma, pulmonary arterial hypertension (PAH), neoplasms and neoplasm-related conditions, and for detecting doppel expression in a subject. Related compositions and methods also are described.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: February 27, 2024
    Assignee: PHAROSGEN CO., LTD
    Inventors: Youngro Byun, Ha Kyeong Lee, So Young Choi, So Ra Park, Se Ra Lee, Seung Il Baek
  • Publication number: 20070020397
    Abstract: Disclosed herein is a method of fabricating a printed circuit board using an imprinting process, including forming a plating layer on an insulating layer having a plurality of recessed patterns formed through an imprinting process, and etching and polishing the portion of the plating layer using an etchant, resulting in a low polishing process cost and eliminating the need for an additional polishing process, because deterioration of the surface of the insulting layer is prevented.
    Type: Application
    Filed: May 16, 2006
    Publication date: January 25, 2007
    Inventors: Jae Cho, Myeong Hong, Seung Ra, Il Maeng, Jeong Kwak, Choon Lee, Sang Lee
  • Publication number: 20060240360
    Abstract: The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.
    Type: Application
    Filed: January 17, 2006
    Publication date: October 26, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Cho, Il Maeng, Choon Lee, Seung Ra
  • Publication number: 20060226566
    Abstract: The present invention relates to an imprinting apparatus, system and method. Specifically, the present invention relates to an imprinting apparatus, system and method, which can be applied to a large substrate, in which a substrate is aligned, imprinted through sequential pressurization by the imprinting apparatus to form a circuit pattern on the substrate and easily released from the imprinting apparatus.
    Type: Application
    Filed: January 5, 2006
    Publication date: October 12, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Kwak, Il Maeng, Seung Ra
  • Publication number: 20060222833
    Abstract: The present invention relates to an imprinting mold for a printed circuit board, having excellent durability, and a method of manufacturing a printed circuit board using the same. Specifically, this invention provides an imprinting mold for a printed circuit board, having excellent durability, in which the mold having a surface structure corresponding to a plurality of via holes and a pattern to be formed is prepared by incorporating 30-80 parts by weight of a filler, having an average particle size of 0.1-5.0 ?m, into 100 parts by weight of a heat or UV curing prepolymer. In addition, a method of manufacturing a printed circuit board using the imprinting mold is provided.
    Type: Application
    Filed: January 6, 2006
    Publication date: October 5, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Il Maeng, Myeong Hong, Choon Lee, Jeong Kwak, Jae Cho, Seung Ra
  • Publication number: 20060066201
    Abstract: The present invention provides a field emitter electrode and a method for fabricating the same. The method comprises the steps of mixing a carbonizable polymer, carbon nanotubes and a solvent to prepare a carbon nanotube-containing polymer solution, electrospinning (or electrostatic spinning) the polymer solution to form a nanofiber web layer on a substrate, stabilizing the nanofiber web layer such that the polymer present in the nanofiber web layer is crosslinked, and carbonizing the nanofiber web layer such that the crosslinked polymer is converted to a carbon fiber.
    Type: Application
    Filed: February 25, 2005
    Publication date: March 30, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Ra, Kay An, Young Lee, Jong Lee
  • Publication number: 20060052026
    Abstract: Disclosed herein is a simplified method of producing a field emission type cold-cathode device, which can reduce the number of processes required to produce the field emission type cold-cathode device. The method includes applying an insulating material on a mesh-shaped thin conductive metal film to a predetermined thickness to integrally form a gate and an insulating layer, or simultaneously forming an insulating layer and a spacer on a mesh-shaped thin conductive metal film, and subsequently mounting the resulting structure on an upper side of a cathode.
    Type: Application
    Filed: December 1, 2004
    Publication date: March 9, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Ra, Jong Lee
  • Publication number: 20050132548
    Abstract: A method for manufacturing a multilayer ceramic capacitor, in which internal electrodes printed on each of a plurality of dielectric sheets have reduced thicknesses using an absorption member, thereby allowing the multilayer ceramic capacitor to have a high capacity and be minimized. The method includes printing the internal electrodes on each of the dielectric sheets, and stacking the dielectric sheets, wherein the internal electrodes formed on each of the dielectric sheets have a reduced thickness by causing an absorptive member to contact the surface of each of the dielectric sheets provided with the internal electrodes and then separating the absorptive member from the surface so that portions of the internal electrodes having a designated thickness are eliminated, and the dielectric sheets provided with the internal electrodes having the reduced thickness are stacked to form a chip element.
    Type: Application
    Filed: December 3, 2004
    Publication date: June 23, 2005
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Choo, Seung Ra, Yong Kim, Jung Lee, Hyo Shin, Hyoung Kim
  • Publication number: 20050128680
    Abstract: Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin coating, in which the process of coating the dielectric layer and the process of printing the inner electrode can be provided as a single process. Therefore, the thickness of the dielectric layer is easily controlled while the dielectric layer is formed to be thin. Further, since the dielectric layers and the inner electrodes are formed successively, the processes of separating and layering the dielectric layers, and the process of compressing the ceramic multilayered body can be omitted. Thereby, the ceramic multilayered body need not be compressed, and thus, a pillowing phenomenon does not occur in the multilayered ceramic capacitor.
    Type: Application
    Filed: December 15, 2004
    Publication date: June 16, 2005
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyo Shin, Seung Ra, Yong Kim, Hyoung Kim, Ho Choo, Jung Lee