Patents by Inventor Seung Sang Lee

Seung Sang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11951890
    Abstract: Proposed are a seat side bolster apparatus and a control method thereof. The seat side bolster apparatus of the disclosure includes a driving unit, which is provided under a foam pad of a seat cushion, is moved upwards and downwards by operation of an actuator, and presses the foam pad upwards when moving upwards, and a covering bracket, which is connected to the driving unit so as to be moved upwards and downwards together with the driving unit and to which an end of a covering enveloping the foam pad of the seat cushion is fixed.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: April 9, 2024
    Assignee: HYUNDAI TRANSYS INCORPORATED
    Inventors: Jae Keun Park, Do Hyun Kim, Sung Hyun Jo, Seung Joon Lee, Jae Sang Lim
  • Publication number: 20240094121
    Abstract: A method of detecting a biomolecule, a computing device performing the method, and a biomolecule detection system therefor are provided. The method includes receiving a terahertz signal that passed deionized water or reference material, receiving a terahertz signal that passed a target including a predetermined biomolecule, extracting a digital modulation characteristic for the received terahertz signal that passed the deionized water and the received terahertz signal that passed the target, and detecting the predetermined biomolecule included in the target by analyzing the extracted digital modulation characteristic, wherein the received terahertz signal that passed the deionized water and the received terahertz signal that passed the target are generated using a digitally modulated optical signal based on a transmission speed determined based on kinematics of the predetermined biomolecule.
    Type: Application
    Filed: April 26, 2023
    Publication date: March 21, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Won Kyoung LEE, Eon-sang KIM, Sang Rok MOON, Joon Ki LEE, Seung-Hyun CHO
  • Patent number: 10421112
    Abstract: A mold for hot stamping is disclosed. The mold may include: a base plate configured to receive and exhaust coolant, at least one lower mold and at least one upper mold. The at least one lower mold may be mounted at a surface of the base plate, and configured to receive the coolant from the base plate. The lower mold may also have the same shape as a lower shape of a product so as to form the lower shape of the product during hot stamping. The upper mold is made of material different from that of the lower mold, coupled to an upper portion of the lower mold, has the same shape as an upper shape of the product so as to form the upper shape of the product, and is configured to receive the coolant from the lower mold such that the coolant flows in the upper mold.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: September 24, 2019
    Assignee: Hyundai Motor Company
    Inventor: Seung Sang Lee
  • Publication number: 20160030993
    Abstract: A mold for hot stamping is disclosed. The mold may include: a base plate configured to receive and exhaust coolant, at least one lower mold and at least one upper mold. The at least one lower mold may be mounted at a surface of the base plate, and configured to receive the coolant from the base plate. The lower mold may also have the same shape as a lower shape of a product so as to form the lower shape of the product during hot stamping. The upper mold is made of material different from that of the lower mold, coupled to an upper portion of the lower mold, has the same shape as an upper shape of the product so as to form the upper shape of the product, and is configured to receive the coolant from the lower mold such that the coolant flows in the upper mold.
    Type: Application
    Filed: October 12, 2015
    Publication date: February 4, 2016
    Inventor: Seung Sang Lee
  • Patent number: 9168617
    Abstract: A mold for hot stamping is disclosed. The mold may include: a base plate configured to receive and exhaust coolant, at least one lower mold and at least one upper mold. The at least one lower mold may be mounted at a surface of the base plate, and configured to receive the coolant from the base plate. The lower mold may also have the same shape as a lower shape of a product so as to form the lower shape of the product during hot stamping. The upper mold is made of material different from that of the lower mold, coupled to an upper portion of the lower mold, has the same shape as an upper shape of the product so as to form the upper shape of the product, and is configured to receive the coolant from the lower mold such that the coolant flows in the upper mold.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: October 27, 2015
    Assignee: Hyundai Motor Company
    Inventor: Seung Sang Lee
  • Publication number: 20130145809
    Abstract: A mold for hot stamping is disclosed. The mold may include: a base plate configured to receive and exhaust coolant, at least one lower mold and at least one upper mold. The at least one lower mold may be mounted at a surface of the base plate, and configured to receive the coolant from the base plate. The lower mold may also have the same shape as a lower shape of a product so as to form the lower shape of the product during hot stamping. The upper mold is made of material different from that of the lower mold, coupled to an upper portion of the lower mold, has the same shape as an upper shape of the product so as to form the upper shape of the product, and is configured to receive the coolant from the lower mold such that the coolant flows in the upper mold.
    Type: Application
    Filed: June 26, 2012
    Publication date: June 13, 2013
    Applicant: HYUNDAI MOTOR COMPANY
    Inventor: Seung Sang Lee
  • Publication number: 20130111965
    Abstract: A mold for hot stamping is disclosed. The mold may include: a base plate configured to receive and exhaust coolant; at least one appearance block mounted at a surface of the base plate and positioned along a shape of a product, the appearance block having a mounting space therein; and an insert block inserted in the mounting space so as to be fixed to the appearance block and mounted at a surface of the base plate. The insert block is provided with a plurality of passages in an exterior surface thereof for circulating coolant, wherein the plurality of passages are in fluidly communication with the base plate.
    Type: Application
    Filed: June 27, 2012
    Publication date: May 9, 2013
    Applicants: KIA MOTORS CORPORATION, HYUNDAI MOTOR COMPANY
    Inventor: Seung Sang Lee
  • Patent number: D782420
    Type: Grant
    Filed: January 12, 2015
    Date of Patent: March 28, 2017
    Inventor: Seung Sang Lee
  • Patent number: D801275
    Type: Grant
    Filed: January 12, 2015
    Date of Patent: October 31, 2017
    Inventor: Seung Sang Lee
  • Patent number: D815771
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: April 17, 2018
    Inventor: Seung Sang Lee