Abstract: A light emitting diode package including a light emitting diode chip, a phosphor layer disposed to cover an upper portion of the light emitting diode chip, the phosphor layer being configured to convert a wavelength of light emitted from the light emitting diode chip, and a color filter layer disposed to cover an upper portion of the phosphor layer, the color filter being configured to block light having a predetermined wavelength range from being emitted through the phosphor layer.

Abstract: A displaying apparatus including a panel substrate and pixel modules arranged thereon, each pixel module including a circuit board and unit pixels on the circuit board, in which each unit pixel includes light emitting devices longitudinally extending along a first direction on the circuit board and including a substrate, a light emitting structure including first and second conductivity type semiconductor layers and an active layer therebetween, a first connection layer electrically connected to the first conductivity type semiconductor layer, a second connection layer electrically connected to the second conductivity type semiconductor layer, a step adjustment layer disposed between the first connection layer and the second connection layer and covering a portion of the light emitting device, in which the light emitting devices in the unit pixel are arranged in a second direction crossing the first direction.

Abstract: A light emitting apparatus including a substrate, a plurality of light emitting diode devices disposed on the substrate, a light non-transmitting layer disposed on the substrate and having at least one of open regions, and a first conductive bonding layer disposed between the plurality of lighting emitting diode devices and the substrate and electrically contacting the plurality of light emitting diode devices, in which an upper surface of the first conductive bonding layer is placed above the light non-transmitting layer.

Abstract: A circuit board includes a base having a plurality of interconnections on an upper surface thereof, a first photosensitive solder resist (PSR) covering the interconnections and defining a pad open region exposing portions of the interconnections, a second PSR covering the first PSR and having an opening exposing the pad open region. The opening of the second PSR is larger than the pad open region of the first PSR.

Abstract: A display device comprising a first base substrate, a second base substrate having a different area than the first base substrate, a plurality of pixels disposed on each of the first and second base substrates, and an interconnection part connected to the pixels, the interconnection part including a plurality of signal interconnections disposed on each of the first and second base substrates, in which the signal interconnections disposed on the first base substrate are connected to the signal interconnections disposed on the second base substrate through a plurality of connecting portions disposed on both of the first and second base substrates.

Abstract: A light emitting diode device including a substrate, a plurality of terminals disposed on the substrate, and a plurality of light sources disposed on the substrate, electrically connected to the plurality of terminals, and configured to emit light, in which each of the light sources includes a light emitting diode chip, and a wall surrounding side surfaces of the light emitting diode chip, at least one of the light sources includes a wavelength converter disposed on the light emitting diode chip, and at least two light sources share the wall.

Abstract: A unit pixel including a transparent substrate, a plurality of light emitting devices arranged on the transparent substrate, an adhesive layer bonding the light emitting devices to the transparent substrate, a step adjusting layer covering the light emitting device and bonded to the adhesive layer, a plurality of connection layers disposed on the step adjustment layer and electrically connected to the light emitting devices, in which the step adjustment layer has a concave-convex pattern along an edge thereof.

Abstract: A light emitting module including a circuit board, a plurality of unit pixels arranged on the circuit board, a molding member covering the unit pixels, and an anti-glare layer disposed on the molding member, in which the molding member includes a first molding layer at least partially covering each of the unit pixels, and a second molding layer covering the first molding layer.

Abstract: A display apparatus including a substrate, a first sub-pixel, a second sub-pixel, and a third sub-pixel disposed on the substrate and configured to emit red light, green light, and blue light, respectively, partition walls disposed between the first sub-pixel, the second sub-pixel, and the third sub-pixel, and configured to not transmit light, in which the first sub-pixel, the second sub-pixel, and the third sub-pixel include a first light emitting cell, a second light emitting cell, and a third light emitting cell, respectively, and a height of each of the first, second, and third light emitting cells is lower than a height of the partition walls, and a difference between the height of the partition walls and the height of each of the first, second, and third light emitting cells is less than 100 ?m.

Abstract: A light emitting diode unit including a blue light emitting diode package disposed on a substrate and configured to emit blue light to the outside, a red light emitting diode package disposed on the substrate and configured to emit red light to the outside, and a green light emitting diode package disposed on the substrate and configured to emit green light to the outside, in which each of the blue light emitting diode package, the red light emitting diode package, and the green light emitting diode package includes a wall to prevent light from being emitted to the sides thereof.

Abstract: A display device including light emitting modules having signal lines and common lines arranged thereon, each including light emitting diodes mounted on an upper surface thereof and electrically connected to the signal lines and the common lines, respectively, a motherboard coupled to the light emitting modules, and a bonding layer having electrical conductivity and coupling the light emitting modules to the motherboard, in which each of the light emitting modules includes signal line terminals and common line terminals disposed on a lower surface thereof and electrically connected to the signal lines and the multiple common lines, respectively, and the motherboard includes board signal line terminals and board common line terminals disposed on an upper surface thereof at locations corresponding to the signal line terminals and the common line terminals of the light emitting modules.

Abstract: A method of fabricating a light emitting module includes mounting a plurality of unit pixels on a circuit board, applying a molding material to cover the unit pixels, placing a plate on the molding material to press the molding material with the plate, and curing the molding material to form a molding member.

Abstract: A display including a base, a plurality of pixels disposed on the base in rows and columns, at least one of the pixels including a first interconnect and a plurality of second interconnects, and a plurality of mounting portions on which a plurality of sub-pixels is to be mounted, in which a first portion of each of the plurality of mounting portions is electrically connected to the first interconnect, a second portion of each of the plurality of mounting portions is electrically connected to one of the second interconnects, and at least one of the plurality of sub-pixels mounted on the plurality of mounting portions is configured to emit light of different wavelength.

Abstract: A displaying apparatus includes a pixel unit. The pixel unit includes at least one pixel having a light emitting device and a light conversion layer for converting a first wavelength of light of the light emitting device into a second wavelength of light different from the first wavelength; and an insulation layer covers side surfaces of the light emitting device and the light conversion layer.

Abstract: A light emitting diode unit including a blue light emitting diode package disposed on a substrate and configured to emit blue light to the outside, a red light emitting diode package disposed on the substrate and configured to emit red light to the outside, and a green light emitting diode package disposed on the substrate and configured to emit green light to the outside, in which each of the blue light emitting diode package, the red light emitting diode package, and the green light emitting diode package includes a wall to prevent light from being emitted to the sides thereof.

Abstract: A substrate for displays including a base, a plurality of first interconnects disposed on the base, a plurality of second interconnects disposed on the base to intersect with the first interconnects, and a plurality of sub-pixels disposed on the base and including one or more of the first and second interconnects, each of the sub-pixels including at least one interconnect extension protruding from at least one side of the second interconnect, first and second mounting portions formed between the at least one interconnect extension and the first interconnect, and a light emitting diode mounted on the first mounting portion, in which the second mounting portion is configured to mount another light emitting diode thereon.

Abstract: A displaying apparatus including: a panel substrate; a plurality of light emitting devices arranged on the panel substrate; and at least one connection tip disposed on one surface of each of the light emitting devices. Each of the light emitting devices includes a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first and second conductivity type semiconductor layers; and first and second electrode pads disposed on the light emitting structure.

Abstract: A substrate for displays including a base, a plurality of first interconnects disposed on the base, a plurality of second interconnects disposed on the base to intersect with the first interconnects, and a plurality of sub-pixels disposed on the base and including one or more of the first and second interconnects, each of the sub-pixels including at least one interconnect extension protruding from at least one side of the second interconnect, first and second mounting portions formed between the at least one interconnect extension and the first interconnect, and a light emitting diode mounted on the first mounting portion, in which the second mounting portion is configured to mount another light emitting diode thereon.

Abstract: A display device including light emitting modules having signal lines and common lines arranged thereon, each including light emitting diodes mounted on an upper surface thereof and electrically connected to the signal lines and the common lines, respectively, a motherboard coupled to the light emitting modules, and a bonding layer having electrical conductivity and coupling the light emitting modules to the motherboard, in which each of the light emitting modules includes signal line terminals and common line terminals disposed on a lower surface thereof and electrically connected to the signal lines and the multiple common lines, respectively, and the motherboard includes board signal line terminals and board common line terminals disposed on an upper surface thereof at locations corresponding to the signal line terminals and the common line terminals of the light emitting modules.

Abstract: A displaying apparatus including: a panel substrate; a plurality of light emitting devices arranged on the panel substrate; and at least one connection tip disposed on one surface of each of the light emitting devices. Each of the light emitting devices includes a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer interposed between the first and second conductivity type semiconductor layers; and first and second electrode pads disposed on the light emitting structure.