Patents by Inventor Seung-Soo Choi

Seung-Soo Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11927995
    Abstract: A display device includes a base substrate including a display area and a non-display area at a periphery of the display area; a first signal wiring on the non-display area of the base substrate and including a first wiring part and a second wiring part connected to the first wiring part; and a printed circuit board including a lead wiring on the first signal wiring. The second wiring part includes an open part passing through a surface of the second wiring part in a thickness direction, the second wiring part includes a long side extending along a first direction and a short side extending along a second direction intersecting the first direction, and a separation distance between the open part and an end of the short side of the second wiring part in the first direction is within about 0.4 times the long side of the second wiring part.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Myong Soo Oh, Seung Ho Choi, Ji Hoon Hwang
  • Publication number: 20240078710
    Abstract: Disclosed herein are a method, an apparatus and a storage medium for encoding/decoding using a transform-based feature map. An optimal basis vector is extracted from one or more feature maps, and a transform coefficient is acquired through a transform using the basis vector. The basis vector and the transform coefficient may be transmitted through a bitstream. In an embodiment, one or more feature maps are reconstructed using the basis vector and the transform coefficient, which are decoded from the bitstream.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Youn-Hee KIM, Jooyoung LEE, Se-Yoon JEONG, Jin-Soo CHOI, Dong-Gyu SIM, Na-Seong KWON, Seung-Jin PARK, Min-Hun LEE, Han-Sol CHOI
  • Patent number: 11925080
    Abstract: A display device includes a substrate including a display area and a non-display area, a plurality of pixels disposed in the display area, a common voltage supply wiring overlapping the non-display area and disposed on the substrate, a driving voltage supply wiring overlapping the non-display area and disposed on the substrate, and a data voltage supply wiring overlapping the non-display area and electrically connected to the plurality of pixels, where at least one of the common voltage supply wiring and the driving voltage supply wiring includes a chamfered area, the data voltage supply wiring includes a first data voltage supply wiring, a second data voltage supply wiring, and a third data voltage supply wiring, and the first to third data voltage supply wirings are disposed in different layers.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jae-Ho Choi, Won Kyu Kwak, Chang Soo Pyon, Seung Gyu Tae
  • Publication number: 20240069269
    Abstract: A display apparatus including a display panel, a light source configured to emit light, and a light guide disposed on the light source and covering a side of the light source, the light source including a substrate, a light emitter including a light emitting stacked layer and disposed on the substrate, a light blocking layer disposed on a side surface of the light emitting stacked layer, and a reflector disposed between the substrate and the light guide, in which the light emitter has a first length direction and a second length direction, wherein orientation angles of the light emitter in the first and second length directions are different from each other, the substrate includes a first pad electrode and second pad electrode electrically connected to the light emitter, and the first and second pad electrodes are spaced apart from each other by at least 50 ?m.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 29, 2024
    Inventors: Seung Ri CHOI, Eun Ju KIM, Hee Soo LIM
  • Patent number: 11915853
    Abstract: A coil component is provided. The coil component includes a body having fifth and sixth surfaces opposing each other, first and second surfaces respectively connecting the fifth and sixth surfaces of the body and opposing each other, and third and fourth surfaces respectively connecting the first and second surfaces of the body and opposing each other in one direction, a recess disposed in an edge between one of the first and second surfaces of the body and the sixth surface of the body, a coil portion disposed inside the body and exposed through the recess, and an external electrode including a connection portion disposed in the recess and connected to the coil portion, and a pad portion disposed on one surface of the body. A length of the pad portion in the one direction is greater than a length of the connection portion in the one direction.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Mo Lim, Seung Min Lee, Byeong Cheol Moon, Yong Hui Li, Byung Soo Kang, Ju Hwan Yang, Tai Yon Cho, No Il Park, Tae Jun Choi
  • Publication number: 20030062254
    Abstract: A method and an apparatus for depositing a metal layer on a substrate use a sputtering technique wherein first sputter particles sputtered from a first target including a metal are deposited on the substrate. A first metal layer portion having a first thickness corresponding to 40 to 60% of the whole deposition thickness is formed on the substrate. Second sputter particles sputtered from a second target including a metal identical to the first target are deposited on the first metal layer portion. Thus, a second metal layer portion including a material identical to the first metal layer portion and having a second thickness corresponding to 40 to 60% of the whole deposition thickness is formed on the first metal layer portion. When depositing the second metal layer portion, a radio frequency bias is applied to a bottom surface of the substrate so that the first and second sputter particles deposited on the substrate are resputtered towards the surface of the substrate.
    Type: Application
    Filed: September 18, 2002
    Publication date: April 3, 2003
    Inventors: Seung-Soo Choi, Seung-Cheol Choi