Abstract: A lithium battery including: a positive electrode including an overlithiated lithium transition metal oxide having a layered structure; a negative electrode including a silicon-based negative active material; and an electrolyte between the positive electrode and the negative electrode, the electrolyte including an electrolytic solution including a fluorinated ether solvent in an amount of 3 vol % or more based on the total volume of the electrolytic solution.

Abstract: A connector for a light source module includes a body portion and a terminal portion. The body portion includes a first opening portion and a second opening portion. The first opening portion receives a portion of the light source module. The second opening portion receives a portion of a light source driver which drives the light source module. The terminal portion includes a first terminal and a second terminal. The first terminal is in the first opening portion of the body portion. The second terminal is connected to the first terminal. The second terminal is in the second opening portion of the body portion.

Abstract: Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings.

Abstract: A method of driving a light-source module includes adjusting a frequency of a boosting switching signal based on a dimming signal which controls luminance of a light-emitting diode (“LED”) string of the light-source module, where the LED string comprises a plurality of LEDs connected to each other in series, and controlling a main transistor in response to the boosting switching signal to transfer a driving voltage to the LED string.

Abstract: A light source apparatus includes a light source disposed adjacent to a side portion of a light guide plate and a light source driver driving the light source. The light source driver includes a booster and a protecting circuit. The booster boosts an input voltage to a driving voltage for driving the light source. The protecting circuit selectively cuts off the input voltage applied to the booster according to an output current of the booster, reducing the risk of damage to the driver due to shorts, overcurrents, or the like.

Abstract: A semiconductor device and a method for forming the same are disclosed. The semiconductor device includes an active region formed to be sloped or tilted by ?° (where 0°<?°<90°) from the bottom of a semiconductor substrate, at least one gate that is formed over the sloped active region and has a surface parallel to the bottom of the semiconductor substrate, and a landing plug that is coupled to the active region and is located between the gates. As a result, the area of the active region is increased thus increasing a channel width, so that the operation of the semiconductor device can be improved as the integration degree of the semiconductor device is rapidly increased.

Abstract: A method of manufacturing a printed circuit board having a flow preventing dam, including: applying a dry film resist on a base substrate having a solder pad, and then primarily exposing the dry film resist to light; secondarily exposing the primarily exposed dry film resist formed on a peripheral area of the base substrate to light, thus forming a flow preventing dam; removing the unexposed dry film resist to expose the solder pad, thus forming an opening; printing the opening with a solder paste, and then forming a solder bump through a reflow process; and removing the primarily exposed dry film resist.

Abstract: A semiconductor device includes a plurality of pillars disposed to protrude from a semiconductor substrate, bit lines surrounding perimeters of portions of the plurality of pillars and extending in a first direction, gates spaced apart from the bit lines, surrounding perimeters of portions of the plurality of pillars over the bit lines, and extending to a second direction perpendicular to the first direction, and separation layers separating the gates parallel to the second direction. Therefore, the semiconductor device suitable to the high integration of semiconductor devices can be implemented.

Abstract: A method of driving a light source includes receiving an alternating current (“AC”) voltage from outside, generating a first direct current (“DC”) voltage based on the AC voltage, generating a second DC voltage, corresponding to a difference between a driving voltage of a light source part and the first DC voltage, based on the first DC voltage, and outputting a sum of the first DC voltage and the second DC voltage to the light source part

Abstract: A connector for a light source module includes a body portion and a terminal portion. The body portion includes a first opening portion and a second opening portion. The first opening portion receives a portion of the light source module. The second opening portion receives a portion of a light source driver which drives the light source module. The terminal portion includes a first terminal and a second terminal. The first terminal is in the first opening portion of the body portion. The second terminal is connected to the first terminal. The second terminal is in the second opening portion of the body portion.

Abstract: A squeegee module. The squeegee module of the present invention includes a rotary unit rotated in opposite directions, support rods mounted to the rotary unit on opposite sides of the center of the rotary unit, a squeegee holder connected to ends of the support rods, and a squeegee blade mounted to the squeegee holder, wherein the squeegee holder moves upwards and downwards in cooperation with rotation of the rotary unit, thus controlling the inclination angle of the squeegee blade.

Abstract: A semiconductor device and a method for forming the same are disclosed. The semiconductor device includes an active region formed to be sloped or tilted by ?° (where 0°<?°<90°) from the bottom of a semiconductor substrate, at least one gate that is formed over the sloped active region and has a surface parallel to the bottom of the semiconductor substrate, and a landing plug that is coupled to the active region and is located between the gates. As a result, the area of the active region is increased thus increasing a channel width, so that the operation of the semiconductor device can be improved as the integration degree of the semiconductor device is rapidly increased.

Abstract: A method of manufacturing a printed circuit board having a flow preventing dam, including: applying a dry film resist on a base substrate having a solder pad, and then primarily exposing the dry film resist to light; secondarily exposing the primarily exposed dry film resist formed on a peripheral area of the base substrate to light, thus forming a flow preventing dam; removing the unexposed dry film resist to expose the solder pad, thus forming an opening; printing the opening with a solder paste, and then forming a solder bump through a reflow process; and removing the primarily exposed dry film resist

Abstract: Disclosed is a printed circuit board having a flow preventing dam and a manufacturing method thereof. The printed circuit board includes a base substrate having a solder pad, a solder bump formed on the solder pad of the base substrate, and a flow preventing dam formed on a peripheral area of the base substrate using a dry film resist. The flow preventing dam can prevent the outflow of an underfill solution and can be simply formed.

Abstract: A light source apparatus includes a light source disposed adjacent to a side portion of a light guide plate and a light source driver driving the light source. The light source driver includes a booster and a protecting circuit. The booster boosts an input voltage to a driving voltage for driving the light source. The protecting circuit selectively cuts off the input voltage applied to the booster according to an output current of the booster, reducing the risk of damage to the driver due to shorts, overcurrents, or the like.

Abstract: In a backlight assembly and a display apparatus having the backlight assembly, a plurality of lamps are housed in a housing having grounded sidewalls, where each of the lamps has at least one bend and series circuits are formed by respective sets of two or more of the bent lamps; where each series connected set of lamps is driven by an AC driving voltage of sufficient magnitude to light the series connected set of lamps, the AC driving voltage being produced by an AC step-up transformer circuit and where each series connected set has its series circuit formed by a lamp-to-lamp connection made through a grounded sidewall of the container. High and low voltage portions of each series connected set of lamps are positioned to reduce electrostatic discharge as between high voltage portions of the series and a nearby grounded sidewall of the container.

Abstract: A post bump formed over an electrode pad of a substrate for electrically connecting to an external device, the post bump including a metal post formed over the electrode pad; and a solder formed over the metal post and shaped as a dome, the dome occupying a space defined by imaginary lines extending from a perimeter of the metal post along an axial direction of the metal post.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In accordance with an embodiment of the present invention, the method includes providing a substrate having a pad formed thereon, forming a resist on the substrate, in which the resist has an opening formed therein such that the pad is exposed, forming a metal post inside the opening such that the metal post is electrically connected to the pad, forming a through-hole in the resist by removing a portion of the resist such that the through-hole surrounds the metal post, and forming a solder layer inside the through-hole and on an upper surface of the metal post so as to cover an exposed surface of the metal post.

Abstract: An electronic component package and a method of manufacturing the same are disclosed. The method can include: providing a board, on which a multiple number of pads are formed; forming a solder resist layer, in which an opening superimposing over all of the pads is formed, on the board; forming metal posts over the pads, respectively; mounting an electronic component on the board by bonding the electrodes to the metal posts; and forming an underfill resin layer in the opening such that the underfill resin layer is interposed between the electronic component and the board. The solder resist layer may function as a dam that prevents the underfill resin layer from leaking in lateral directions during the subsequent underfill process so that the additional processes, such as dispensing, etc., that were required for forming a separate dam can be omitted, and the process time and costs can be reduced.

Abstract: Disclosed is a printed circuit board having a flow preventing dam and a manufacturing method thereof The printed circuit board includes a base substrate having a solder pad, a solder bump formed on the solder pad of the base substrate, and a flow preventing dam formed on a peripheral area of the base substrate using a dry film resist. The flow preventing dam can prevent the outflow of an underfill solution and can be simply formed.