Patents by Inventor Seung-won YU

Seung-won YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967492
    Abstract: The present disclosure relates to a thin film manufacturing apparatus including a chamber having an inner process space of a substrate, a substrate support unit connected to the chamber to support the substrate in the chamber, a heat source unit connected to the chamber and disposed opposite to the substrate support unit, a plasma generation unit connected to one side of the chamber to supply radicals between the substrate support unit and the heat source unit, and a baffle connected to the chamber and including a movement passage of the radicals therein and a plurality of first exhaust holes communicating with the movement passage, which are formed in a top surface thereof. The thin film manufacturing apparatus may improve uniformity of the thin film formed on the substrate.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: April 23, 2024
    Assignee: AP SYSTEMS INC.
    Inventors: Byoung Il Lee, Chang Kyo Kim, Chang Min Kwon, Seung Won Yu
  • Publication number: 20220122824
    Abstract: The present disclosure relates to a thin film manufacturing apparatus including a chamber having an inner process space of a substrate, a substrate support unit connected to the chamber to support the substrate in the chamber, a heat source unit connected to the chamber and disposed opposite to the substrate support unit, a plasma generation unit connected to one side of the chamber to supply radicals between the substrate support unit and the heat source unit, and a baffle connected to the chamber and including a movement passage of the radicals therein and a plurality of first exhaust holes communicating with the movement passage, which are formed in a top surface thereof. The thin film manufacturing apparatus may improve uniformity of the thin film formed on the substrate.
    Type: Application
    Filed: October 6, 2021
    Publication date: April 21, 2022
    Inventors: Byoung Il Lee, Chang Kyo Kim, Chang Min Kwon, Seung Won Yu
  • Patent number: 10132112
    Abstract: A door operation apparatus for a vehicle is provided to open or shut a door at a speed corresponding to a user's force or information selected by the user. In particular, the door operating apparatus installed in a body to open and shut an internal room of the body includes: a power member connected to the door for applying a moving force to the door; a detector for detecting a force applied by the user to the door; a controller for determining an open and shut speed corresponding to the detected force and controlling the power member to be driven to open and shut the door at the determined open and shut speed; and a driver for driving the power member based on a command from the controller.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: November 20, 2018
    Assignee: HYUNDAI MOTOR COMPANY
    Inventors: Seung Won Yu, Ki Eun Kim
  • Publication number: 20170275940
    Abstract: A door operation apparatus for a vehicle is provided to open or shut a door at a speed corresponding to a user's force or information selected by the user. In particular, the door operating apparatus installed in a body to open and shut an internal room of the body includes: a power member connected to the door for applying a moving force to the door; a detector for detecting a force applied by the user to the door; a controller for determining an open and shut speed corresponding to the detected force and controlling the power member to be driven to open and shut the door at the determined open and shut speed; and a driver for driving the power member based on a command from the controller.
    Type: Application
    Filed: November 10, 2016
    Publication date: September 28, 2017
    Applicant: HYUNDAI MOTOR COMPANY
    Inventors: Seung Won YU, Ki Eun KIM
  • Publication number: 20080108156
    Abstract: A method for fabricating a light emitting diode lamp in a simplified procedure, and a high-output LED, that has a simple structure and can exhibit improvement in heat release property, fabricated by using the method which includes the steps of coating an insulating layer on a substrate and etching the insulating layer using a mask pack, coating a conductive metal layer on the insulating layer, forming an electrode pattern and a recess, on which an LED chip is mounted, on the metal layer using the mask pack, attaching the LED chip to the top of the recess, connecting a wire to the electrode pattern, and mounting a reflector having a vertical opening hole around the LED chip on the substrate to reflect light emitted from the LED chip in all directions, and molding the top of the substrate from a transparent resin to cover the LED chip, the electrode pattern and the reflector.
    Type: Application
    Filed: January 17, 2007
    Publication date: May 8, 2008
    Applicant: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Hak-geun JEONG, Bong-man JUNG, Soo-bin HAN, Yu-jin SONG, Suk-in PARK, Seung-won YU, Gyu-duk KIM
  • Patent number: D749480
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: February 16, 2016
    Assignee: Kia Motors Corporation
    Inventors: Seung Won Yu, Ki Eun Kim, Yun Seok Oh, Jun Hyuk Kim
  • Patent number: D781195
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: March 14, 2017
    Assignee: Hyundai Motor Company
    Inventors: Seung-Won Yu, Ki-Eun Kim, So-Yeon Park, Tae-Hoon Kim