Patents by Inventor Seung-Woo Kwon

Seung-Woo Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11951130
    Abstract: The present invention relates to an antigen-binding molecule comprising a heavy chain variable region comprising a heavy-chain complementarity-determining region 1 (HCDR1) comprising an amino acid sequence represented by Sequence No. 1, an HCDR2 comprising an amino acid sequence represented by Sequence No. 2, and an HCDR3 comprising an amino acid sequence represented by Sequence No. 3; a light-chain variable region comprising a light-chain complementarity-determining region 1 (LCDR1) comprising an amino acid sequence represented by Sequence No. 4, an LCDR2 comprising an amino acid sequence represented by Sequence No. 5, and an LCDR3 comprising an amino acid sequence represented by Sequence No. 6; wherein the antigen-binding molecule is a T cell receptor (TCR); and to a cell line expressing the same.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: April 9, 2024
    Assignee: Eutilex Co., Ltd.
    Inventors: Byoung S. Kwon, Young Ho Kim, Kwang Hee Kim, Ji Won Chung, Young Gyoon Chang, Bo Rim Yi, Jung Yun Lee, Seung Hyun Lee, Sun Woo Im, Jin Kyung Choi, Hyun Tae Son, Eun Hye Yoo
  • Publication number: 20240114620
    Abstract: A printed circuit board includes a first insulating layer, a plurality of first and second pads disposed on the first insulating layer, and a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second pads. The first pad has a closed region having a side surface covered by the solder resist layer, and an open region having a side surface exposed by the first opening. The second pad has only a closed region having a side surface covered by the solder resist layer.
    Type: Application
    Filed: August 25, 2023
    Publication date: April 4, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min LEE, Francis SAYNES, Keun Woo KWON
  • Publication number: 20240076468
    Abstract: An embodiment resin composition for shielding electromagnetic waves, based on a total weight of the resin composition, includes 20 to 80 wt % of thermoplastic resin, 1 to 50 wt % of a conductive filler, and 0.1 to 30 wt % of an additive.
    Type: Application
    Filed: January 16, 2023
    Publication date: March 7, 2024
    Inventors: Seung-Woo Choi, Dong-Bum Seo, Kyun Oh, Yu-Hyun Song, Yang-Jin Kwon, Joo-Han Lee
  • Patent number: 11911185
    Abstract: An apparatus for estimating bio-information may include: a bio-signal acquirer configured to acquire a bio-signal; and a processor configured to extract one or more first feature values from the bio-signal, determine a scale factor based on the first feature values, and to estimate bio-information based on the scale factor and the first feature values.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Soon Park, Ui Kun Kwon, Yunseo Ku, Seung Woo Noh, Seung Keun Yoon, Dae Geun Jang
  • Publication number: 20020194668
    Abstract: The present invention relates to functional golf gloves, which allow a golfer to grip the golf club with appropriate pressure with hands.
    Type: Application
    Filed: May 23, 2002
    Publication date: December 26, 2002
    Inventor: Seung-Woo Kwon