Abstract: According to example embodiments of inventive concepts, a semiconductor device includes: a substrate, and a stacked structure including interlayer insulating layers and gate electrodes alternately stacked on the substrate. The stacked structure defines a through-hole over the substrate. The gate electrodes each include a first portion between the through-hole and a second portion of the gate electrodes. A channel pattern may be in the through-hole. A tunneling layer may surround the channel pattern. A charge trap layer may surround the tunneling layer, and protective patterns may surround the first portions of the gate electrodes. The protective patterns may be between the first portions of the gate electrodes and the charge trap layer.

Abstract: According to example embodiments of inventive concepts, a semiconductor device includes: a substrate, and a stacked structure including interlayer insulating layers and gate electrodes alternately stacked on the substrate. The stacked structure defines a through-hole over the substrate. The gate electrodes each include a first portion between the through-hole and a second portion of the gate electrodes. A channel pattern may be in the through-hole. A tunneling layer may surround the channel pattern. A charge trap layer may surround the tunneling layer, and protective patterns may surround the first portions of the gate electrodes. The protective patterns may be between the first portions of the gate electrodes and the charge trap layer.

Abstract: In a method of manufacturing a semiconductor device, a dielectric layer structure and a control gate layer can be formed sequentially on a substrate. The control gate layer can be partially etched to form a plurality of control gates. A gate spacer and a sacrificial spacer sequentially can be stacked on a sidewall of the control gate and on a portion of the dielectric layer structure. The dielectric layer structure can be partially etched using the sacrificial spacer and the gate spacer as an etching mask to form a plurality of dielectric layer structure patterns. The sacrificial spacer can be removed. An insulating interlayer can be formed on the substrate to form an air gap. The insulating interlayer can cover the dielectric layer structure pattern, the gate spacer and the control gate. The air gap can extend between the adjacent gate spacers and between the adjacent dielectric layer structure patterns.

Abstract: According to example embodiments of inventive concepts, a semiconductor device includes: a substrate, and a stacked structure including interlayer insulating layers and gate electrodes alternately stacked on the substrate. The stacked structure defines a through-hole over the substrate. The gate electrodes each include a first portion between the through-hole and a second portion of the gate electrodes. A channel pattern may be in the through-hole. A tunneling layer may surround the channel pattern. A charge trap layer may surround the tunneling layer, and protective patterns may surround the first portions of the gate electrodes. The protective patterns may be between the first portions of the gate electrodes and the charge trap layer.

Abstract: A semiconductor memory device includes linear patterns disposed between isolation trenches extending in a first direction in a semiconductor device and having a first crystal direction the same as the semiconductor substrate. A bridge pattern connects at least two adjacent linear patterns and includes a semiconductor material having a second crystal direction different from the first crystal direction. A first isolation layer pattern is disposed in at least one of the isolation trenches in a field region of the semiconductor substrate. Memory cells are disposed on at least one of the linear patterns.

Abstract: In a method of manufacturing a semiconductor device, a dielectric layer structure and a control gate layer can be formed sequentially on a substrate. The control gate layer can be partially etched to form a plurality of control gates. A gate spacer and a sacrificial spacer sequentially can be stacked on a sidewall of the control gate and on a portion of the dielectric layer structure. The dielectric layer structure can be partially etched using the sacrificial spacer and the gate spacer as an etching mask to form a plurality of dielectric layer structure patterns. The sacrificial spacer can be removed. An insulating interlayer can be formed on the substrate to form an air gap. The insulating interlayer can cover the dielectric layer structure pattern, the gate spacer and the control gate. The air gap can extend between the adjacent gate spacers and between the adjacent dielectric layer structure patterns.

Abstract: A method for recovery of residual actinide element from chloride molten salts that are formed after electro-refining and/or electro-winning of a spent nuclear fuel and include actinide elements and rare-earth elements is provided. The method comprises conducting electrolysis using a liquid cadmium cathode (LCC) in the chloride molten salt that is formed after electro-refining and/or electro-winning of a spent nuclear fuel and contains rare-earth elements and actinide elements; electro-depositing the actinide elements contained in the chloride molten salt on the LCC in order to reduce a concentration of the actinide elements; and adding a CdCl2 oxidant to the chloride molten salt containing the LCC-metal alloy in order to oxidize the rare-earth elements co-deposited on the LCC, thereby forming the rare-earth chlorides in the chloride molten salt.

Abstract: A method for recovery of residual actinide element from chloride molten salts that are formed after electro-refining and/or electro-winning of a spent nuclear fuel and include actinide elements and rare-earth elements is provided. The method comprises conducting electrolysis using a liquid cadmium cathode (LCC) in the chloride molten salt that is formed after electro-refining and/or electro-winning of a spent nuclear fuel and contains rare-earth elements and actinide elements; electro-depositing the actinide elements contained in the chloride molten salt on the LCC in order to reduce a concentration of the actinide elements; and adding a CdCl2 oxidant to the chloride molten salt containing the LCC-metal alloy in order to oxidize the rare-earth elements co-deposited on the LCC, thereby forming the rare-earth chlorides in the chloride molten salt.

Abstract: Methods of forming non-volatile memory devices include forming a device isolation layer and a gate pattern of a non-volatile memory cell transistor, on a semiconductor substrate. This gate pattern includes a floating gate electrode and a control gate line that extends on the floating gate electrode and on the device isolation layer. At least a first portion of a first sidewall of the gate pattern is then covered with a first mask that exposes upper corners of the control gate line. The device isolation layer is then selectively etched at a first rate to define an at least partial opening therein. During this etching step, the upper corners of the control gate line are also etched back at a second rate less than the first rate.