Patents by Inventor Seung Yong PYUN

Seung Yong PYUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12226994
    Abstract: A multilayer sheet including: a transparent film with a total light transmittance of 85% or more in accordance with ISO 13468; a coating layer disposed on a first surface of the transparent film; and an adhesive layer disposed on a second surface, opposite to the first surface, of the transparent film, wherein a thickness of the adhesive layer after being cured is two times or less of a thickness of the coating layer, is disclosed.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: February 18, 2025
    Assignee: SK microworks solutions Co., Ltd.
    Inventors: Seok-Jong Woo, Jun-Ki Park, Hyung-Woo Cho, Seung-Yong Pyun
  • Patent number: 11805616
    Abstract: Embodiments relate to a polyimide-based composite film, which comprises a base film comprising a polyimide-based resin; and a functional layer disposed on the base film, wherein when the side of the functional layer located opposite to the side in contact with the base film is referred to as a first side and when the side of the base film in contact with the functional layer is referred to as a second side, the leveling index represented by Equation 1 is less than 0.75.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: October 31, 2023
    Assignees: SK microworks Co., Ltd., SK microworks solutions Co., Ltd.
    Inventors: Sunhwan Kim, Jung Hee Ki, Jin Woo Lee, Dawoo Jeong, Seung Yong Pyun, Yun Hee Seo
  • Publication number: 20230271404
    Abstract: A multilayer sheet including: a transparent film with a total light transmittance of 85% or more in accordance with ISO 13468; a coating layer disposed on a first surface of the transparent film; and an adhesive layer disposed on a second surface, opposite to the first surface, of the transparent film, wherein a thickness of the adhesive layer after being cured is two times or less of a thickness of the coating layer, is disclosed.
    Type: Application
    Filed: October 31, 2022
    Publication date: August 31, 2023
    Applicant: SK microworks solutions Co., Ltd.
    Inventors: Seok-Jong WOO, Jun-Ki PARK, Hyung-Woo CHO, Seung-Yong PYUN
  • Publication number: 20230272178
    Abstract: The composite film according to an embodiment adopts an acrylate-based binder and an acrylamide-based monomer in a single functional layer for antistatic, antifouling, and chemical resistant functions to exhibit flexible characteristics without deteriorating the adhesive strength to a substrate; thus, it can be applied as a cover window of a flexible display device.
    Type: Application
    Filed: December 5, 2022
    Publication date: August 31, 2023
    Inventors: Hyung-Woo CHO, Jun-Ki PARK, Seok-Jong WOO, Seung-Yong PYUN
  • Publication number: 20230272175
    Abstract: In the composite film according to the embodiment, an elastic layer in which its modulus change characteristics with respect to temperature have been adjusted to a certain range is coated onto the opposite side to a hard coating layer; thus, it is possible to enhance the surface hardness and elastic recovery characteristics of the hard coating layer. Thus, it can be advantageously applied as a cover window of a flexible display device.
    Type: Application
    Filed: December 5, 2022
    Publication date: August 31, 2023
    Inventors: Jun-Ki PARK, Seok-Jong WOO, Hyung-Woo CHO, Seung-Yong PYUN
  • Patent number: 11613615
    Abstract: Embodiments relate to a polyimide-based composite film, which comprises a base film comprising a polyimide-based resin; and a functional layer disposed on the base film, wherein when the side of the functional layer located opposite to the side in contact with the base film is referred to as a first side and when the side of the base film located opposite to the side in contact with the functional layer is referred to as a second side, the adhesiveness index represented by Equation 1 is 3.5 or less.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: March 28, 2023
    Assignees: SKC CO., LTD., SK MIOROWOREC SOLUTIONS CO., LTD.
    Inventors: Sunhwan Kim, Jung Hee Ki, Jin Woo Lee, Dawoo Jeong, Seung Yong Pyun, Yun Hee Seo
  • Publication number: 20210047485
    Abstract: Embodiments relate to a polyimide-based composite film, which comprises a base film comprising a polyimide-based resin; and a functional layer disposed on the base film, wherein when the side of the functional layer located opposite to the side in contact with the base film is referred to as a first side and when the side of the base film located opposite to the side in contact with the functional layer is referred to as a second side, the adhesiveness index represented by Equation 1 is 3.5 or less.
    Type: Application
    Filed: July 29, 2020
    Publication date: February 18, 2021
    Inventors: Sunhwan KIM, Jung Hee KI, Jin Woo LEE, Dawoo JEONG, Seung Yong PYUN, Yun Hee SEO
  • Publication number: 20210051811
    Abstract: Embodiments relate to a polyimide-based composite film, which comprises a base film comprising a polyimide-based resin; and a functional layer disposed on the base film, wherein when the side of the functional layer located opposite to the side in contact with the base film is referred to as a first side and when the side of the base film in contact with the functional layer is referred to as a second side, the leveling index represented by Equation 1 is less than 0.75.
    Type: Application
    Filed: July 29, 2020
    Publication date: February 18, 2021
    Inventors: Sunhwan KIM, Jung Hee KI, Jin Woo LEE, Dawoo JEONG, Seung Yong PYUN, Yun Hee SEO